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MAX2261EUT-T

Analog Devices

MAX2261EUT-T by Analog Devices

Analog Devices' MAX2261EUT-T is an RF/Microwave Up/Down Converter with 6 terminals, operating b/w -40 °C to 85°C. It requires 3/5V power supply, draws a max current of 11.3mA, and features surface mounting. Ideal for applications requiring high-frequency signal conversion in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,655 parts In-Stock

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Anansix

USA . 2,031 parts In-Stock

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2,031

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Digiode

USA . 889 parts In-Stock

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889

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MARBEL Systems

Belgium . 1,404 parts In-Stock

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$1.090

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$1.090

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Texas Native Microelectronics

USA . 400 parts In-Stock

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$1.253

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$1.203

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$1.165

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$1.103

400

$1.253

$1.203

$1.165

$1.103

Kenton Components

USA . 3,354 parts In-Stock

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$1.504

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$1.323

3,354

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Semicontronic

India . 640 parts In-Stock

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$3.000

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$2.925

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$2.910

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640

$3.000

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$2.910

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Qasali Group International

UK . 1,509 parts In-Stock

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$3.383

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$3.146

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$2.977

1,509

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AZTECH Wire

Italy . 469 parts In-Stock

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$17.028

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One Stop Electronics

USA . 2,155 parts In-Stock

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$21.000

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Corphita

USA . 2,040 parts In-Stock

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Overview

Elevate your RF and microwave system performance with the MAX2261EUT-T by Analog Devices. As a leader in innovative technology, Analog Devices delivers unparalleled quality and reliability in the RF/Microwave Up/Down Converters category. This versatile product offers customers exceptional value and benefits, providing seamless integration and enhanced functionality in a wide range of applications. Trust Analog Devices to elevate your system to new heights with the MAX2261EUT-T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Power Supplies (V): 3/5

The availability of multiple power supply options allows flexibility in different operating environments or power sources.

No. of Terminals: 6

Having 6 terminals provides ample connectivity options for various input and output configurations.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the converter can withstand demanding operating conditions without performance degradation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures reliable operation even in extreme cold environments.

Terminal Finish: TIN LEAD

The tin lead terminal finish offers good conductivity and solderability, ensuring secure connections for long-term performance.

Maximum Supply Current: 11.3 mA

The low maximum supply current of 11.3 mA results in efficient power consumption, making it suitable for battery-operated or low-power applications.

Mounting Feature: SURFACE MOUNT

The surface mounting feature allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Technical Specifications

RF/Microwave Up/Down Converters MAX2261EUT-T attributes and parameters. Explore more RF/Microwave Up/Down Converters devices from Analog Devices

Specs

JESD-609 Code:

e0

Mounting Feature:

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Package Equivalence Code:

TSOP6,.11,37

Power Supplies (V):

3/5

Sub-Category:

RF/Microwave Up/Down Converters

Maximum Supply Current:

11.3 mA

Terminal Finish:

TIN LEAD

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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