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TRF1216IRGPTG3

Texas Instruments

TRF1216IRGPTG3 by Texas Instruments

TRF1216IRGPTG3 by Texas Instruments is a RF/Microwave DOWN CONVERTER with 27 dB Min. Down Conversion Gain, 5V Power Supply, and -40 to 85°C Operating Temp. Ideal for applications requiring a LO Tunable device with RF Input Frequency range of 3300-3800 MHz and IF range of 400-500 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,002 parts In-Stock

1+ parts

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6,002

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Digiode

USA . 2,615 parts In-Stock

1+ parts

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2,615

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 661 parts In-Stock

1+ parts

$1.000

100+ parts

$0.975

1k+ parts

$0.970

10k+ parts

-

661

$1.000

$0.975

$0.970

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Parana Technologies

USA . 1,096 parts In-Stock

1+ parts

$2.637

100+ parts

-

1k+ parts

$3.127

10k+ parts

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1,096

$2.637

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$3.127

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DigiPath Technology Company

USA . 518 parts In-Stock

1+ parts

$2.904

100+ parts

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518

$2.904

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ChromeModa Solutions

Germany . 5,550 parts In-Stock

1+ parts

$2.963

100+ parts

$2.430

1k+ parts

-

10k+ parts

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5,550

$2.963

$2.430

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IDEA Electronic Components Group

UK . 2,102 parts In-Stock

1+ parts

$2.963

100+ parts

-

1k+ parts

$2.667

10k+ parts

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2,102

$2.963

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$2.667

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Ampacity Inc.

Singapore . 926 parts In-Stock

1+ parts

$9.000

100+ parts

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926

$9.000

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AZTECH Wire

Italy . 690 parts In-Stock

1+ parts

$14.670

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690

$14.670

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One Stop Electronics

USA . 1,551 parts In-Stock

1+ parts

$33.000

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1,551

$33.000

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Corphita

USA . 3,004 parts In-Stock

1+ parts

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3,004

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Corohmni

South Africa . 421 parts In-Stock

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421

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Overview

Experience the unparalleled quality and reliability of Texas Instruments with the TRF1216IRGPTG3 RF/Microwave Up/Down Converter. This versatile component offers seamless integration and superior performance in a variety of applications, from telecommunications to aerospace. With its advanced technology and innovative design, this converter provides customers with unmatched value, benefits, and advantages that will elevate their projects to new heights. Trust Texas Instruments to deliver excellence every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures a lightweight and durable construction, making it suitable for a variety of applications.

Power Supplies (V): 5

Operates on a low voltage supply, making it energy efficient and easy to integrate into existing systems.

Maximum Operating Temperature: 85 °C

Can operate efficiently in high temperature environments, providing reliable performance in challenging conditions.

Minimum Down Conversion Gain: 27 dB

Offers a high conversion gain, ensuring minimal signal loss during the down conversion process.

Minimum Operating Temperature: -40 °C

Capable of operating in low temperature environments, making it suitable for a wide range of operating conditions.

Terminal Finish: Matte Tin (Sn)

Matte Tin finish provides a reliable and corrosion-resistant terminal connection, ensuring long-term performance.

LO Tunable: YES

Local Oscillator (LO) tunable feature allows for flexibility in frequency selection, catering to specific application requirements.

Characteristic Impedance: 50 ohm

Maintains a consistent impedance matching with other components in the RF/Microwave system for optimized performance.

Minimum Intermediate Frequency (IF): 400 MHz

Provides a wide range of intermediate frequency options, allowing for versatility in signal processing and customization.

Maximum RF Input Frequency: 3800 MHz

Supports high-frequency RF input signals, making it suitable for a variety of communication and signal processing applications.

Minimum Input Power (CW): 10 dBm

Allows for low input power operation while maintaining signal integrity and quality during the conversion process.

Maximum Intermediate Frequency (IF): 500 MHz

Offers a high intermediate frequency range, enabling efficient signal processing and noise reduction capabilities.

Mounting Feature: SURFACE MOUNT

Surface mount design allows for easy and secure installation on PCBs, ensuring a compact and efficient system integration.

Technical Specifications

RF/Microwave Up/Down Converters TRF1216IRGPTG3 attributes and parameters. Explore more RF/Microwave Up/Down Converters devices from Texas Instruments

Specs

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

Minimum Down Conversion Gain:

27 dB

Maximum Intermediate Frequency (IF):

500 MHz

Minimum Intermediate Frequency (IF):

400 MHz

Minimum Input Power (CW):

10 dBm

JESD-609 Code:

e3

LO Tunable:

YES

Mounting Feature:

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Package Equivalence Code:

LCC20,.16SQ,20

Power Supplies (V):

5

Maximum RF Input Frequency:

3800 MHz

Minimum RF Input Frequency:

3300 MHz

RF or Microwave Device Type:

Sub-Category:

RF/Microwave Up/Down Converters

Maximum Supply Current:

200 mA

Terminal Finish:

Matte Tin (Sn)

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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