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TP3064J

Texas Instruments

TP3064J by Texas Instruments

TP3064J by Texas Instruments is a PCM CODEC with MU-LAW companding law. It operates in synchronous/asynchronous mode, has 20 terminals, and supports a -5V to 5V supply voltage range. This audio codec is ideal for telecom applications requiring filtering capabilities in commercial temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,483 parts In-Stock

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7,483

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Digiode

USA . 2,118 parts In-Stock

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2,118

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Odintec Ltd.

Israel . 900 parts In-Stock

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900

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Anansix

USA . 142 parts In-Stock

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142

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ACDS - Activité Composants Distribution Service

France . 103 parts In-Stock

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103

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Mil-Aero Solutions, Inc.

USA . 1 parts In-Stock

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1

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Parana Technologies

USA . 2,351 parts In-Stock

1+ parts

$5.817

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-

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$6.607

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2,351

$5.817

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$6.607

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DigiPath Technology Company

USA . 250 parts In-Stock

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$6.405

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250

$6.405

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ChromeModa Solutions

Germany . 3,549 parts In-Stock

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$6.536

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$5.360

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3,549

$6.536

$5.360

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IDEA Electronic Components Group

UK . 1,336 parts In-Stock

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$6.536

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$5.882

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1,336

$6.536

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$5.882

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AZTECH Wire

Italy . 258 parts In-Stock

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$19.730

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258

$19.730

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One Stop Electronics

USA . 718 parts In-Stock

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$481.000

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718

$481.000

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Kepictronics

USA . 1,650 parts In-Stock

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Corphita

USA . 391 parts In-Stock

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391

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Epart123

USA . 103 parts In-Stock

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$1.700

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103

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$1.700

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Cyclops Electronics Ltd (Excess)

UK . 103 parts In-Stock

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103

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Glotronic Ltd.

UK . 82 parts In-Stock

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Assy Fe

Spain . 2 parts In-Stock

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Overview

Experience high-quality audio like never before with the TP3064J by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch products that are reliable and efficient. The TP3064J falls under the category of Audio Codecs and is perfect for a wide range of applications. From synchronous to asynchronous operation, this product offers versatility and performance. With its compact design and user-friendly features, customers can enjoy seamless integration and exceptional audio quality. Upgrade your audio experience today with the TP3064J from Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring longevity and reliability.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

Offers flexibility in operation, allowing the user to choose the mode that best suits their needs.

No. of Terminals: 20

Sufficient terminals for connectivity and functionality, offering versatile options for use.

Maximum Operating Temperature: 70 °C

Can withstand higher temperatures, making it suitable for various operating environments.

Technology: CMOS

Utilizes CMOS technology for efficient power consumption and high performance.

Technical Specifications

Audio Codecs TP3064J attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

MU-LAW

Filter:

YES

JESD-30 Code:

R-GDIP-T20

Length:

25.019 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Seated Height:

5.08 mm

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TP3064J Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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