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TMS5702134DPGEQQ1

Texas Instruments

TMS5702134DPGEQQ1 by Texas Instruments

TMS5702134DPGEQQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-R4F CPU, 144 terminals, and 80 MHz clock frequency. Ideal for automotive applications, it features 24-Ch ADCs, 16 DMA channels, and connectivity options like CAN, I2C, SCI, and SPI. With low power mode and on-chip flash ROM programmability, it offers high performance in a compact package.

Median Price

$21.394

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 790 parts In-Stock

1+ parts

$21.394

100+ parts

$18.688

1k+ parts

$12.888

10k+ parts

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790

$21.394

$18.688

$12.888

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,650 parts In-Stock

1+ parts

$20.324

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-

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1,650

$20.324

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Vyrian

USA . 7,465 parts In-Stock

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7,465

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Chip Stock

USA . 225 parts In-Stock

1+ parts

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225

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 182 parts In-Stock

1+ parts

$8.390

100+ parts

-

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182

$8.390

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Corphita

USA . 797 parts In-Stock

1+ parts

$19.255

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797

$19.255

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Parana Technologies

USA . 1,164 parts In-Stock

1+ parts

$43.849

100+ parts

-

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1,164

$43.849

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DigiPath Technology Company

USA . 849 parts In-Stock

1+ parts

$48.283

100+ parts

$44.420

1k+ parts

-

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849

$48.283

$44.420

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ChromeModa Solutions

Germany . 4,047 parts In-Stock

1+ parts

$49.268

100+ parts

$40.400

1k+ parts

-

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4,047

$49.268

$40.400

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IDEA Electronic Components Group

UK . 159 parts In-Stock

1+ parts

$49.268

100+ parts

$46.805

1k+ parts

$44.341

10k+ parts

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159

$49.268

$46.805

$44.341

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Overview

Experience the power of innovation with the TMS5702134DPGEQQ1 by Texas Instruments, a cutting-edge microcontroller designed to exceed expectations. With a reputation for excellence in manufacturing, Texas Instruments delivers unparalleled quality and reliability. Ideal for automotive applications, this microcontroller offers integrated cache, advanced peripherals, and low power mode for optimal performance. Unlock new possibilities with the TMS5702134DPGEQQ1 and elevate your projects to new heights of efficiency and functionality. Trust in Texas Instruments to provide you with the tools you need to succeed in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for applications where weight and durability are important factors.

Integrated Cache: YES

Having an integrated cache helps in improving the overall performance of the microcontroller by reducing memory access times, making it suitable for high-performance applications.

Maximum Supply Voltage: 1.32 V

The microcontroller can operate at a relatively low maximum supply voltage, making it energy-efficient and suitable for applications where power consumption is a concern.

ROM Words: 2097152

With a large ROM capacity, the microcontroller can store a significant amount of program data, allowing for more complex software applications to be run efficiently.

ADC Channels: YES

The presence of Analog to Digital Convertors allows the microcontroller to interface with analog sensors and signals, making it versatile for a wide range of applications.

Maximum Clock Frequency: 80 MHz

The high maximum clock frequency enables the microcontroller to process instructions quickly, making it suitable for tasks that require high-speed processing.

Connectivity: CAN(3), I2C, SCI(2), SPI(4)

With multiple connectivity options including CAN, I2C, SCI, and SPI, the microcontroller can easily communicate with other devices and peripherals, enhancing its functionality in various systems.

Technical Specifications

Microcontrollers TMS5702134DPGEQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

0

No. of I/O Lines:

64

No. of Serial I/Os:

5

No. of Terminals:

144

No. of Timers:

41

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

RAM Words:

256

ROM Words:

2097152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

160 rpm

Maximum Supply Current:

700 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), I2C, SCI(2), SPI(4)

Peripherals:

DMA(16), POR, TIMER(41), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TMS5702134DPGEQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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