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TMS5701114BPGEQQ1

Texas Instruments

TMS5701114BPGEQQ1 by Texas Instruments

TMS5701114BPGEQQ1 by Texas Instruments is a 32-bit microcontroller with 1048576 ROM words, 131072 RAM bytes, and 24-Ch 12-Bit ADC channels. Ideal for automotive applications due to AEC-Q100 screening level, CORTEX-R4F CPU family, and connectivity options like CAN, I2C, LIN.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,670 parts In-Stock

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2,670

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Digiode

USA . 2,266 parts In-Stock

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2,266

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 795 parts In-Stock

1+ parts

$9.802

100+ parts

-

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795

$9.802

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One Stop Electronics

USA . 1,042 parts In-Stock

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$25.000

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1,042

$25.000

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Parana Technologies

USA . 645 parts In-Stock

1+ parts

$39.381

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645

$39.381

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DigiPath Technology Company

USA . 1,632 parts In-Stock

1+ parts

$43.363

100+ parts

$39.894

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1,632

$43.363

$39.894

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ChromeModa Solutions

Germany . 6,691 parts In-Stock

1+ parts

$44.248

100+ parts

$36.283

1k+ parts

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6,691

$44.248

$36.283

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IDEA Electronic Components Group

UK . 1,674 parts In-Stock

1+ parts

$44.248

100+ parts

$42.036

1k+ parts

$39.823

10k+ parts

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1,674

$44.248

$42.036

$39.823

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Corphita

USA . 1,474 parts In-Stock

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1,474

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Microchip USA

USA . 377 parts In-Stock

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377

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Overview

Experience unparalleled performance and reliability with the TMS5701114BPGEQQ1 microcontroller by Texas Instruments. Designed with cutting-edge technology and built to automotive-grade standards, this microcontroller offers a wide range of applications including CAN, I2C, LIN, and SPI connectivity. With features like 32-bit processing, 24-channel ADC, and 64K data EEPROM size, this product provides exceptional value and efficiency for your projects. Trust in Texas Instruments' reputation for quality and innovation, and elevate your designs with the TMS5701114BPGEQQ1 microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount design allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 1.32 V

The maximum supply voltage of 1.32 V ensures safe operation and protects the microcontroller from overvoltage damage.

Bit Size: 32

32-bit architecture allows for high performance and efficient processing of data and instructions.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages (1.2V and 3.3V) provides flexibility in power management and compatibility with different systems.

No. of Terminals: 144

With 144 terminals, this microcontroller offers a wide range of input/output options and connectivity for various peripherals.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125°C ensures reliable performance in harsh environmental conditions.

ADC Channels: YES

Built-in Analog to Digital Converters enable the microcontroller to interface with analog sensors and signals, enhancing its versatility.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency and reduce CPU workload, increasing overall system performance.

ROM Words: 1048576

Large ROM capacity of 1048576 words allows for extensive program storage and flexibility in firmware development.

Peripherals: CAP(6), CRC(2), QEP(2), POR, PWM(14), TIMER(40)

A wide range of peripherals including capacitors, CRC units, Quadrature Encoder Pulse modules, Pulse Width Modulation channels, and Timers enhance the microcontroller's capabilities for various applications.

RAM Bytes: 131072

With 131072 bytes of RAM, the microcontroller has ample memory for data storage and processing, enabling efficient multitasking and data handling.

Connectivity: CAN(3), I2C, LIN, MIBSPI(3), SCI(2), SPI

Multiple communication interfaces such as CAN, I2C, LIN, MIBSPI, SCI, and SPI provide versatile connectivity options for interfacing with other devices and systems.

Technical Specifications

Microcontrollers TMS5701114BPGEQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

64

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

160 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

350 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), I2C, LIN, MIBSPI(3), SCI(2), SPI

Peripherals:

CAP(6), CRC(2), QEP(2), POR, PWM(14), TIMER(40)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TMS5701114BPGEQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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