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TMS470R1B512PGET

Texas Instruments

TMS470R1B512PGET by Texas Instruments

TMS470R1B512PGET by Texas Instruments is a 32-bit ARM7TDMI microcontroller with 144 terminals, operating at up to 20 MHz. It features 12-Ch 10-Bit ADC, 16 DMA channels, and various connectivity options like CAN(2), I2C(3), SCI(3), SPI(2). Ideal for industrial applications requiring low power consumption and high-speed processing.

Median Price

$11.390

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 40 parts In-Stock

1+ parts

$11.390

100+ parts

$11.160

1k+ parts

$10.930

10k+ parts

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40

$11.390

$11.160

$10.930

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Distributors (In-Stock)

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Vyrian

USA . 7,152 parts In-Stock

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7,152

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Digiode

USA . 2,584 parts In-Stock

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2,584

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Chip Stock

USA . 163 parts In-Stock

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163

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Distributors (Availability)

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One Stop Electronics

USA . 521 parts In-Stock

1+ parts

$3.000

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521

$3.000

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AZTECH Wire

Italy . 665 parts In-Stock

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$14.414

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665

$14.414

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Parana Technologies

USA . 2,294 parts In-Stock

1+ parts

$17.114

100+ parts

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$17.328

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2,294

$17.114

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$17.328

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DigiPath Technology Company

USA . 1,526 parts In-Stock

1+ parts

$18.844

100+ parts

$17.337

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1,526

$18.844

$17.337

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IDEA Electronic Components Group

UK . 2,363 parts In-Stock

1+ parts

$19.229

100+ parts

$18.268

1k+ parts

$17.306

10k+ parts

-

2,363

$19.229

$18.268

$17.306

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ChromeModa Solutions

Germany . 364 parts In-Stock

1+ parts

$19.229

100+ parts

$15.768

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364

$19.229

$15.768

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Microchip USA

USA . 147 parts In-Stock

1+ parts

$48.270

100+ parts

$47.850

1k+ parts

$47.850

10k+ parts

$47.430

147

$48.270

$47.850

$47.850

$47.430

QUARKTWIN TECHNOLOGY LTD

USA . 19,752 parts In-Stock

1+ parts

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19,752

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Corphita

USA . 3,929 parts In-Stock

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3,929

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Overview

Unlock the power of cutting-edge technology with the TMS470R1B512PGET by Texas Instruments. As a leader in microcontroller manufacturing, Texas Instruments delivers unparalleled quality and reliability. Ideal for a wide range of applications, this microcontroller offers unmatched value, benefits, and advantages to customers. Experience seamless connectivity, high performance, and low power consumption all in one compact package. Trust Texas Instruments to deliver innovative solutions that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product suitable for various applications while keeping production costs low.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 2.05 V

With a relatively high maximum supply voltage, the product can handle fluctuations in power supply without risking damage.

On Chip Data RAM Width: 8

Having a wider data RAM width allows for faster data transfer and processing, improving overall performance.

Address Bus Width: 27

A wider address bus allows for larger memory addressing capabilities, accommodating more data storage and processing needs.

Package Shape: SQUARE

The square shape makes it easier to package and integrate the product into various electronic devices and systems.

Bit Size: 32

With a 32-bit architecture, the product can handle complex calculations and operations efficiently, enhancing overall processing speed.

Power Supplies (V): 1.8,3.3

Supports multiple power supply options, offering flexibility in design and compatibility with different power sources.

No. of Terminals: 144

Having a high number of terminals allows for more connections and functionalities, making the product versatile and suitable for diverse applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

These package styles provide compact and space-saving solutions for electronic designs, especially in applications with limited space constraints.

Minimum Supply Voltage: 1.81 V

The low minimum supply voltage ensures efficient power consumption and operation, ideal for energy-efficient applications.

Maximum Operating Temperature: 105 °C

Capable of operating at high temperatures, making it suitable for industrial environments where heat resistance is essential.

CPU Family: ARM7TDMI

Belonging to the ARM7TDMI family ensures compatibility with a wide range of software and tools, enhancing overall usability and flexibility.

No. of External Interrupts: 16

Supports multiple external interrupts, allowing the product to respond quickly to external events and signals for improved real-time performance.

Minimum Operating Temperature: -40 °C

Capable of operating in low-temperature environments, making it suitable for various industrial and outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent corrosion resistance and conductivity, ensuring reliable connections and longevity of the product.

ADC Channels: YES

Having Analog-to-Digital Converter (ADC) channels allows for analog signal processing and conversion, expanding the product's capabilities in data acquisition and measurement.

DMA Channels: YES

Direct Memory Access (DMA) channels enable efficient data transfer and processing, improving overall system performance and reducing CPU workload.

Terminal Position: QUAD

The quad-terminal position offers easy installation and maintenance, enhancing usability and convenience in applications requiring frequent access to terminals.

ROM Words: 524288

With a large ROM capacity, the product can store extensive program code and data, accommodating complex applications and software requirements.

Maximum Seated Height: 1.6 mm

Low seated height allows for slim and compact designs, ideal for space-constrained applications without compromising performance.

RAM Words: 32

Adequate RAM capacity for temporary data storage and processing, ensuring smooth and efficient operation of applications requiring fast data access.

Width: 20 mm

Compact width size makes the product suitable for small-scale designs and applications where space efficiency is crucial.

Boundary Scan: YES

Boundary scan support enables easy testing and debugging of the product during manufacturing and maintenance, ensuring quality and reliability.

External Data Bus Width: 16

A wider external data bus allows for faster data transfer between the microcontroller and external devices, enhancing system performance.

Peripherals: "AWD, DMA(16), DWD, TIMER

Rich set of peripherals, including Analog Watchdog (AWD), Direct Memory Access (DMA), Dual Watchdog (DWD), and Timer, enhances the product's functionalities and versatility.

Maximum Clock Frequency: 20 MHz

Capable of operating at high clock frequencies, enabling fast and responsive processing for real-time applications and high-speed data processing.

Maximum Time At Peak Reflow Temperature (s): 30

With a short reflow time, the product can withstand peak temperatures during the manufacturing process without compromising component integrity.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliable soldering and assembly of the product on circuit boards, increasing manufacturing efficiency and quality.

Length: 20 mm

Compact length size makes the product suitable for applications with space constraints, offering flexibility in design and integration.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature range, ensuring reliable performance in harsh environmental conditions commonly found in industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, the product offers high performance and energy efficiency, ideal for applications requiring fast processing and low power consumption.

RAM Bytes: 32768

With a generous amount of RAM memory, the product can handle multiple tasks simultaneously without experiencing memory limitations, improving overall system stability.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable for long-term operation.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and mounting on circuit boards, ensuring robust connections and stability in electronic assemblies.

Analog To Digital Convertors: 12-Ch 10-Bit

Multiple 10-bit Analog-to-Digital Converters (ADCs) allow for precise and accurate conversion of analog signals, enhancing the product's data acquisition capabilities.

Maximum Supply Current: 125 mA

With a maximum supply current of 125 mA, the product ensures efficient power consumption and operation, contributing to energy-saving and cost-effective designs.

Nominal Supply Voltage: 2 V

Stable nominal supply voltage at 2 V ensures consistent and reliable operation of the product, minimizing power fluctuations and voltage-related issues.

No. of DMA Channels: 16

Having 16 Direct Memory Access (DMA) channels enables efficient data transfer and processing, reducing CPU overhead and improving system performance.

No. of Serial I/Os: 5

Multiple serial I/O interfaces allow for flexible connectivity and communication options, enhancing the product's compatibility with various external devices and systems.

PWM Channels: YES

Pulse Width Modulation (PWM) channels provide precise control over the output signals, making the product suitable for applications requiring accurate signal modulation and control.

Connectivity: "CAN(2), I2C(3), SCI(3), SPI(2)

Support for various communication protocols, including Controller Area Network (CAN), Inter-Integrated Circuit (I2C), Serial Communication Interface (SCI), and Serial Peripheral Interface (SPI), ensures versatile connectivity options for diverse applications.

ROM Programmability: FLASH

Flash programmable ROM offers flexibility in programming and updating firmware, allowing for easy customization and adaptability to changing application requirements.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm allows for high-density mounting and compact PCB designs, maximizing space efficiency and integration possibilities.

Technical Specifications

Microcontrollers TMS470R1B512PGET attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

27

Bit Size:

32

Boundary Scan:

YES

CPU Family:

ARM7TDMI

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

16

No. of I/O Lines:

87

No. of Serial I/Os:

5

No. of Terminals:

144

No. of Timers:

1

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

RAM Words:

32

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

125 mA

Maximum Supply Voltage:

2.05 V

Minimum Supply Voltage:

1.81 V

Nominal Supply Voltage:

2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"CAN(2), I2C(3), SCI(3), SPI(2)"

Peripherals:

"AWD, DMA(16), DWD, TIMER"

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

TMS470R1B512PGET Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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