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TMS470R1VF689PZAR

Texas Instruments

TMS470R1VF689PZAR by Texas Instruments

TMS470R1VF689PZAR by Texas Instruments is a 32-bit microcontroller with 100 terminals, operating at up to 20 MHz. It features ADC and DMA channels, suitable for industrial applications requiring a wide temperature range from -40°C to 85°C. The package style is flatpack with low profile and fine pitch, making it ideal for compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,303 parts In-Stock

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4,303

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ComSIT Distribution GmbH

Germany . 2,938 parts In-Stock

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2,938

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Vyrian

USA . 2,769 parts In-Stock

1+ parts

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2,769

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 252 parts In-Stock

1+ parts

$1.000

100+ parts

-

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252

$1.000

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AZTECH Wire

Italy . 884 parts In-Stock

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$9.132

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884

$9.132

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Ampacity Inc.

Singapore . 238 parts In-Stock

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$17.000

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238

$17.000

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Parana Technologies

USA . 1,921 parts In-Stock

1+ parts

$26.997

100+ parts

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$31.024

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1,921

$26.997

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$31.024

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DigiPath Technology Company

USA . 1,177 parts In-Stock

1+ parts

$29.727

100+ parts

$27.349

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1,177

$29.727

$27.349

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ChromeModa Solutions

Germany . 3,650 parts In-Stock

1+ parts

$30.334

100+ parts

$24.874

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3,650

$30.334

$24.874

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IDEA Electronic Components Group

UK . 2,086 parts In-Stock

1+ parts

$30.334

100+ parts

$28.817

1k+ parts

$27.301

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2,086

$30.334

$28.817

$27.301

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Continental Prestige Electronics

USA . 4,130 parts In-Stock

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4,130

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Corphita

USA . 986 parts In-Stock

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986

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Bastille Electronics

Australia . 900 parts In-Stock

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900

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Argo Parts USA

USA . 820 parts In-Stock

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820

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Overview

Experience the power of innovation with the TMS470R1VF689PZAR by Texas Instruments. This cutting-edge microcontroller offers unparalleled performance and efficiency, making it the perfect choice for a wide range of applications. From industrial automation to consumer electronics, this high-quality product delivers exceptional value and reliability. Trust in Texas Instruments' expertise and elevate your designs with the TMS470R1VF689PZAR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is lightweight and durable, making the microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology enables easy and efficient assembly onto PCBs, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 2.05 V

Allows for a higher supply voltage, providing flexibility in power requirements while ensuring stable operation.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB, optimizing layout and design.

Bit Size: 32

32-bit architecture offers higher computational power and performance compared to lower bit sizes, suitable for complex tasks.

No. of Terminals: 100

More terminals provide increased connectivity options, allowing for versatile interfacing with other devices or peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack design with low profile and fine pitch enhances compactness and facilitates high-density mounting on PCBs.

Minimum Supply Voltage: 1.71 V

Lower minimum supply voltage ensures compatibility with a wide range of power sources, enhancing flexibility in design.

Maximum Operating Temperature: 85 °C

Ability to operate at high temperatures ensures reliability in harsh environments or extended usage.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows the microcontroller to function in extreme cold conditions without performance degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent conductivity and corrosion resistance for reliable connections and long-term performance.

ADC Channels: YES

Integrated ADC channels enable analog-to-digital conversion, essential for interfacing with analog sensors or signals.

DMA Channels: YES

DMA channels improve data transfer efficiency by offloading the CPU, enhancing overall system performance.

Terminal Position: QUAD

Quad terminal positioning simplifies soldering and assembly processes, ensuring secure connections for stable operation.

Maximum Seated Height: 1.6 mm

Low seated height profile saves space and allows for compact designs in applications with size constraints.

Width: 14 mm

Width dimension of 14mm offers a balance between size and functionality, suitable for various PCB layouts and form factors.

Maximum Clock Frequency: 20 MHz

High clock frequency provides fast execution speed for computing tasks, enhancing overall system responsiveness.

Maximum Time At Peak Reflow Temperature (s): 20

Offers a short reflow time at peak temperature, reducing thermal stress on components during manufacturing.

Peak Reflow Temperature °C: 220

Peak reflow temperature of 220°C ensures proper soldering and component mounting during the assembly process.

Length: 14 mm

14mm length dimension contributes to the overall compactness and space-saving design of the microcontroller.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in demanding environmental conditions and extended operational lifetimes.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in a microcontroller offers efficient data processing, lower power consumption, and faster execution speeds.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and robust performance for energy-efficient and reliable operation.

Terminal Form: GULL WING

Gull wing terminal form simplifies soldering and enhances mechanical strength for dependable connections in rugged operating conditions.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage of 1.8V ensures consistent and reliable performance across a wide range of operating conditions.

PWM Channels: YES

PWM channels enable precise control of analog signals, essential for applications such as motor control, lighting, and power management.

ROM Programmability: FLASH

Flash ROM programmability allows for flexible firmware updates and customization, enhancing the versatility and scalability of the microcontroller.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density mounting and miniaturization of PCB designs, ideal for compact electronic devices.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates resistance to moisture and enables safe storage and operation in humid environments without performance degradation.

Speed: 48 rpm

Operational speed of 48 rpm allows for efficient data processing and system operation, suitable for a wide range of applications.

No. of I/O Lines: 53

53 I/O lines provide ample connectivity for interfacing with external devices, sensors, and peripherals, enhancing the microcontroller's versatility.

Technical Specifications

Microcontrollers TMS470R1VF689PZAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

53

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Maximum Supply Voltage:

2.05 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

20

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TMS470R1VF689PZAR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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