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TMS470PLF111PGET

Texas Instruments

TMS470PLF111PGET by Texas Instruments

TMS470PLF111PGET by Texas Instruments is a 32-bit microcontroller with 82 I/O lines, operating at up to 20 MHz. Ideal for industrial applications, it features FLASH ROM programmability, ADC channels, and operates b/w -40°C to 105°C temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,498 parts In-Stock

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6,498

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Digiode

USA . 3,316 parts In-Stock

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3,316

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Distributors (Availability)

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AZTECH Wire

Italy . 528 parts In-Stock

1+ parts

$9.109

100+ parts

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528

$9.109

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Parana Technologies

USA . 565 parts In-Stock

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$20.915

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$21.110

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565

$20.915

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$21.110

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ChromeModa Solutions

Germany . 2,695 parts In-Stock

1+ parts

$23.500

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$19.270

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2,695

$23.500

$19.270

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IDEA Electronic Components Group

UK . 909 parts In-Stock

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$23.500

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$22.325

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$21.150

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909

$23.500

$22.325

$21.150

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One Stop Electronics

USA . 799 parts In-Stock

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$25.000

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799

$25.000

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Corphita

USA . 2,207 parts In-Stock

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DigiPath Technology Company

USA . 1,365 parts In-Stock

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$21.188

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Overview

Discover the cutting-edge TMS470PLF111PGET microcontroller by Texas Instruments, a game-changer in the industry. With a sleek package body material and high-quality manufacturing, this microcontroller offers unparalleled performance for various applications. Whether you're looking to enhance your automation systems or revolutionize your IoT devices, this product delivers unmatched value, efficiency, and reliability. Choose Texas Instruments for top-notch technology that goes above and beyond customer expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and high resistance to heat and chemicals, making the product suitable for various industrial applications.

Surface Mount: YES

Surface mount technology allows for a compact and efficient design, saving valuable space on PCBs.

Maximum Supply Voltage: 5.25 V

A high maximum supply voltage ensures robust performance and reliability in varying operating conditions.

Package Shape: SQUARE

Square package shape facilitates easy PCB layout and integration with other components.

Bit Size: 32

32-bit architecture offers high computational power and efficiency for demanding applications.

No. of Terminals: 144

A high number of terminals provide flexibility in connecting peripherals and external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package style ensures space-saving and easy assembly on PCBs.

Minimum Supply Voltage: 4.75 V

A low minimum supply voltage allows for energy-efficient operation and extends the product's battery life.

Maximum Operating Temperature: 105 °C

High maximum operating temperature range makes the product suitable for industrial environments with harsh conditions.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range ensures reliable performance even in extreme cold environments.

ADC Channels: YES

Integrated ADC channels enable analog signal processing for sensor interfacing and data acquisition.

Terminal Position: QUAD

Quad terminal position provides easy access and connectivity for external devices and peripherals.

Maximum Seated Height: 1.6 mm

Low maximum seated height allows for compact designs and reduces overall PCB thickness.

Width: 20 mm

Compact width dimension enables easy integration in space-constrained applications.

Maximum Clock Frequency: 20 MHz

High maximum clock frequency allows for fast data processing and real-time operations.

Length: 20 mm

Compact length dimension enables space-efficient placement on PCBs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in demanding industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture and integrated peripheral ICs make the product ideal for embedded control applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

Gull wing terminal form provides secure surface mounting and easy soldering on PCBs.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage ensures consistent performance and prevent damage to the product.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and customization of the product.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting and space-saving design on PCBs.

Speed: 48 rpm

High speed capability ensures fast data processing and responsive control in real-time applications.

No. of I/O Lines: 82

A high number of I/O lines provide versatile connectivity options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers TMS470PLF111PGET attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

82

No. of Terminals:

144

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMS470PLF111PGET Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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