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TMS470MF06608BPGEQ

Texas Instruments

TMS470MF06608BPGEQ by Texas Instruments

TMS470MF06608BPGEQ by Texas Instruments is a 32-bit microcontroller with 131072 ROM words, operating at up to 20 MHz clock frequency. Ideal for automotive applications, it features 77 I/O lines, PWM channels, and ADC channels for versatile functionality in a compact FLATPACK package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,531 parts In-Stock

1+ parts

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4,531

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Digiode

USA . 2,487 parts In-Stock

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2,487

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 386 parts In-Stock

1+ parts

$14.862

100+ parts

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386

$14.862

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Parana Technologies

USA . 1,980 parts In-Stock

1+ parts

$15.501

100+ parts

$1,439.515

1k+ parts

$13.951

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1,980

$15.501

$1,439.515

$13.951

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DigiPath Technology Company

USA . 2,375 parts In-Stock

1+ parts

$17.069

100+ parts

$15.703

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2,375

$17.069

$15.703

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ChromeModa Solutions

Germany . 787 parts In-Stock

1+ parts

$17.417

100+ parts

$14.282

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787

$17.417

$14.282

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IDEA Electronic Components Group

UK . 553 parts In-Stock

1+ parts

$17.417

100+ parts

$16.546

1k+ parts

$15.675

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553

$17.417

$16.546

$15.675

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One Stop Electronics

USA . 699 parts In-Stock

1+ parts

$35.000

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699

$35.000

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Corphita

USA . 758 parts In-Stock

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758

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Overview

Discover the power and precision of the TMS470MF06608BPGEQ microcontroller by Texas Instruments. Engineered with cutting-edge technology and a commitment to excellence, this device is ideal for a wide range of applications in the automotive industry and beyond. With its high-quality design and advanced features, customers can trust in its reliability and efficiency. Experience seamless performance, innovative solutions, and unmatched value with the TMS470MF06608BPGEQ microcontroller. Elevate your projects to the next level with this top-of-the-line product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Ease of installation and space-saving design for efficient PCB layout.

Maximum Supply Voltage: 1.7 V

Efficient power consumption and compatibility with low voltage systems.

Package Shape: SQUARE

Compact form factor that can fit in tight spaces within electronic devices.

Bit Size: 32

High processing capability for handling complex tasks and calculations.

No. of Terminals: 144

Sufficient connectivity options for interfacing with external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enhances PCB design flexibility and ensures a stable and reliable connection.

Minimum Supply Voltage: 1.4 V

Allows for operation in low voltage conditions while maintaining performance.

Maximum Operating Temperature: 125 °C

Suitable for use in harsh environments or industrial applications with higher temperature ranges.

Minimum Operating Temperature: -40 °C

Can withstand cold temperatures, making it versatile for various operating conditions.

ADC Channels: YES

Allows for analog-to-digital conversion, enabling the microcontroller to interface with sensors and analog devices.

Terminal Position: QUAD

Facilitates easy connection and soldering of the microcontroller to the PCB.

ROM Words: 131072

Sufficient memory capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low profile design for space-constrained applications.

Width: 20 mm

Compact size for integration into electronic devices with limited space.

Maximum Clock Frequency: 20 MHz

High-speed processing capability for quick execution of instructions and operations.

Length: 20 mm

Square form factor for a balanced and symmetrical layout on the PCB.

Temperature Grade: AUTOMOTIVE

Meets automotive industry standards for reliability and performance in automotive applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC architecture for efficient and streamlined operation.

Technology: CMOS

Low power consumption and compatibility with a wide range of electronic devices.

Terminal Form: GULL WING

Secure and reliable terminal connection for enhanced durability and stability.

Nominal Supply Voltage: 1.55 V

Optimal voltage level for efficient performance and power consumption.

PWM Channels: YES

Supports Pulse Width Modulation for precise control of connected devices.

ROM Programmability: FLASH

Allows for reprogramming of the ROM memory, enabling flexibility in application development.

Terminal Pitch: 0.5 mm

Fine pitch for precise soldering and connection on the PCB.

Speed: 80 rpm

Provides high-speed operation for efficient processing of data and tasks.

No. of I/O Lines: 77

Sufficient input/output options for interfacing with external components and peripherals.

Technical Specifications

Microcontrollers TMS470MF06608BPGEQ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 3V TO 3.6V

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

77

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

1.7 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.55 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMS470MF06608BPGEQ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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