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TMS470R1A128PZQR

Texas Instruments

TMS470R1A128PZQR by Texas Instruments

TMS470R1A128PZQR by Texas Instruments is a 32-bit microcontroller with 20 MHz clock frequency, ADC and PWM channels. Ideal for industrial applications, it operates b/w -40 to 105°C temperature range and has a low profile flatpack package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,360 parts In-Stock

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6,360

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Digiode

USA . 4,418 parts In-Stock

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4,418

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Distributors (Availability)

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AZTECH Wire

Italy . 735 parts In-Stock

1+ parts

$15.981

100+ parts

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735

$15.981

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One Stop Electronics

USA . 339 parts In-Stock

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$26.000

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-

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339

$26.000

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Parana Technologies

USA . 2,011 parts In-Stock

1+ parts

$71.006

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2,011

$71.006

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DigiPath Technology Company

USA . 1,406 parts In-Stock

1+ parts

$78.186

100+ parts

$71.931

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1,406

$78.186

$71.931

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ChromeModa Solutions

Germany . 2,794 parts In-Stock

1+ parts

$79.782

100+ parts

$65.421

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2,794

$79.782

$65.421

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IDEA Electronic Components Group

UK . 244 parts In-Stock

1+ parts

$79.782

100+ parts

$75.793

1k+ parts

$71.804

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244

$79.782

$75.793

$71.804

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Corphita

USA . 825 parts In-Stock

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825

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Overview

Unleash the power of innovation with the TMS470R1A128PZQR by Texas Instruments, a cutting-edge microcontroller designed for a wide range of applications. Crafted with precision and quality, this device offers unmatched performance and reliability. Whether you're looking to enhance your automotive systems, industrial controls, or consumer electronics, this microcontroller delivers exceptional value, efficiency, and flexibility. Elevate your projects with the TMS470R1A128PZQR and experience seamless integration, advanced features, and endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, saving time and space in electronic designs.

Maximum Supply Voltage: 2.06 V

The maximum supply voltage of 2.06 V ensures safe operation and protection against overvoltage.

Minimum Supply Voltage: 1.81 V

The minimum supply voltage of 1.81 V allows for flexibility in power supply options while maintaining stable performance.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to convert analog signals to digital, expanding its range of applications.

Maximum Clock Frequency: 20 MHz

The maximum clock frequency of 20 MHz provides fast processing speed and performance for demanding tasks.

Peripheral IC Type: MICROCONTROLLER, RISC

The use of RISC architecture in the microcontroller's peripheral IC type ensures efficient and streamlined processing of instructions.

ROM Programmability: FLASH

The ROM programmability using FLASH technology allows for easy reprogramming and updating of firmware, enhancing flexibility and ease of use.

Technical Specifications

Microcontrollers TMS470R1A128PZQR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

12

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Maximum Supply Voltage:

2.06 V

Minimum Supply Voltage:

1.81 V

Nominal Supply Voltage:

2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TMS470R1A128PZQR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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