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TMS470R1A128PZ

Texas Instruments

TMS470R1A128PZ by Texas Instruments

TMS470R1A128PZ by Texas Instruments is a 32-bit ARM7 microcontroller with 131072 ROM words, 8192 RAM bytes, and 20 MHz clock frequency. Ideal for industrial applications requiring a powerful yet compact solution with features like PWM channels, ADC support, and low profile packaging.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,433 parts In-Stock

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5,433

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Digiode

USA . 4,020 parts In-Stock

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4,020

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Chip Stock

USA . 2,836 parts In-Stock

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2,836

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LWI Electronics Inc

India . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 299 parts In-Stock

1+ parts

$14.899

100+ parts

-

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$15.324

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299

$14.899

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$15.324

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ChromeModa Solutions

Germany . 4,239 parts In-Stock

1+ parts

$16.740

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$13.727

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4,239

$16.740

$13.727

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IDEA Electronic Components Group

UK . 996 parts In-Stock

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$16.740

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$15.903

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$15.066

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996

$16.740

$15.903

$15.066

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AZTECH Wire

Italy . 544 parts In-Stock

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$17.442

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$17.442

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Microchip USA

USA . 490 parts In-Stock

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$30.240

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$29.810

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$29.590

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$29.380

490

$30.240

$29.810

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$29.380

One Stop Electronics

USA . 1,641 parts In-Stock

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$33.000

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$33.000

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Corphita

USA . 3,442 parts In-Stock

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3,442

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DigiPath Technology Company

USA . 911 parts In-Stock

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$15.093

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911

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$15.093

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Overview

Discover the cutting-edge TMS470R1A128PZ microcontroller by Texas Instruments, designed with precision and innovation in mind. This versatile device offers unparalleled performance and reliability, making it ideal for a wide range of applications. With its advanced features and high-quality construction, this microcontroller provides unmatched value and benefits to customers looking for seamless functionality and efficiency. Trust Texas Instruments to deliver top-of-the-line products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight and durable, making the microcontroller easy to handle and ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easy and compact installation on circuit boards, saving space and facilitating automated assembly.

Maximum Supply Voltage: 2.06 V

The high maximum supply voltage allows for reliable operation even under fluctuating or higher voltage conditions.

Package Shape: SQUARE

Square package shape is easy to handle and provides uniform mounting on the PCB, ensuring stability and ease of integration.

Bit Size: 32

32-bit architecture enables the microcontroller to handle complex calculations and processes efficiently, making it suitable for a wide range of applications.

Power Supplies (V): 1.9,3.3

Support for multiple power supply voltages provides flexibility in designing and integrating the microcontroller into various systems.

No. of Terminals: 100

A higher number of terminals allow for more connections and functionalities, making the microcontroller versatile and suitable for diverse applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Different package styles offer options for space-constrained designs and compatibility with various PCB layouts, enhancing the flexibility of the microcontroller.

Minimum Supply Voltage: 1.81 V

The low minimum supply voltage ensures efficient power usage and operation even in low-power scenarios, making the microcontroller energy-efficient.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance allows the microcontroller to function reliably in a wide range of environmental conditions, improving its reliability and durability.

CPU Family: ARM7

The ARM7 CPU family is known for its high performance and energy efficiency, making the microcontroller suitable for demanding applications requiring fast processing speeds.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature tolerance ensures the microcontroller can operate even in extreme cold environments, expanding its usability in different conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides corrosion resistance and excellent conductivity, ensuring stable connections and reliable performance over time.

ADC Channels: YES

Analog-to-digital converter (ADC) channels enable the microcontroller to interface with analog sensors and signals, expanding its capabilities for data acquisition and processing.

Terminal Position: QUAD

Quad terminal position provides stable mounting and secure connections, enhancing the durability and reliability of the microcontroller in various applications.

ROM Words: 131072

Large ROM size allows for storing a significant amount of program data and firmware, giving the microcontroller ample memory for complex program requirements.

Maximum Seated Height: 1.6 mm

Low maximum seated height ensures the microcontroller can be used in space-constrained designs without sacrificing performance or functionality.

Width: 14 mm

Compact width dimensions make the microcontroller suitable for small form factor designs and applications where space optimization is crucial.

Maximum Clock Frequency: 20 MHz

High maximum clock frequency allows the microcontroller to execute instructions quickly and efficiently, making it suitable for time-sensitive applications.

Length: 14 mm

Compact length dimensions make the microcontroller easy to integrate into designs with limited space, ensuring flexibility and versatility in layout configurations.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures the microcontroller can withstand harsh operating conditions and environments, making it suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in a microcontroller enables fast and efficient processing of instructions, improving overall performance and responsiveness in various applications.

RAM Bytes: 8192

Adequate RAM size allows for temporary data storage and efficient execution of programs, enhancing the microcontroller's multitasking capabilities and overall performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in different operating conditions.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and secure connections, ensuring reliable electrical contact and mechanical stability in the microcontroller.

Nominal Supply Voltage: 2 V

Stable nominal supply voltage ensures consistent and reliable operation of the microcontroller, preventing voltage fluctuations from affecting performance.

PWM Channels: YES

Pulse-width modulation (PWM) channels allow for precise control of analog signals and devices, enabling the microcontroller to perform tasks such as motor speed control and LED dimming.

ROM Programmability: FLASH

Flash programmable ROM enables easy and flexible programming of the microcontroller, allowing for quick updates and modifications to firmware and software.

Terminal Pitch: 0.5 mm

Fine terminal pitch provides high-density connections and precise alignment, ensuring secure mounting and reliable performance in compact designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, which is suitable for standard soldering processes and typical environmental conditions.

Speed: 48 rpm

High speed capability makes the microcontroller suitable for controlling motors, actuators, and other high-speed applications that require rapid response and accurate timing.

No. of I/O Lines: 12

A sufficient number of input/output (I/O) lines provide versatile connectivity options for external devices and sensors, allowing the microcontroller to interface with various peripherals.

Technical Specifications

Microcontrollers TMS470R1A128PZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

12

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.9,3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.06 V

Minimum Supply Voltage:

1.81 V

Nominal Supply Voltage:

2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TMS470R1A128PZ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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