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TMS470R1A256PZ

Texas Instruments

TMS470R1A256PZ by Texas Instruments

TMS470R1A256PZ by Texas Instruments is a 32-bit ARM7 microcontroller with 262144 ROM words, 12288 RAM bytes, and max clock frequency of 20 MHz. Ideal for industrial applications requiring a powerful yet compact solution with features like ADC channels, PWM channels, and low profile package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,455 parts In-Stock

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Digiode

USA . 2,172 parts In-Stock

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LWI Electronics Inc

India . 2 parts In-Stock

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One Stop Electronics

USA . 1,061 parts In-Stock

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$10.000

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$10.000

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AZTECH Wire

Italy . 274 parts In-Stock

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$14.384

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Parana Technologies

USA . 509 parts In-Stock

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$51.451

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$4,777.996

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$46.306

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509

$51.451

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DigiPath Technology Company

USA . 106 parts In-Stock

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$56.654

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$52.121

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106

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ChromeModa Solutions

Germany . 5,604 parts In-Stock

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$57.810

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$47.404

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IDEA Electronic Components Group

UK . 2,189 parts In-Stock

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$57.810

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$54.920

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$52.029

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Corphita

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Microchip USA

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Overview

Unlock the power of innovation with the TMS470R1A256PZ microcontroller by Texas Instruments. Designed to deliver superior performance and reliability, this product is perfect for a wide range of applications in industries such as automotive, industrial control, and consumer electronics. With cutting-edge technology and a trusted manufacturer like Texas Instruments, you can trust that your projects will be in good hands. Experience seamless integration, advanced features, and exceptional value with the TMS470R1A256PZ microcontroller. Elevate your designs and stay ahead of the competition with this top-of-the-line product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 2.06 V

Can operate within a safe voltage range, reducing the risk of damage from overvoltage.

Bit Size: 32

Offers a high level of processing power and capability for handling complex tasks efficiently.

Power Supplies (V): 1.8, 3.3

Supports multiple power supply options, providing flexibility for various system requirements.

No. of Terminals: 100

Offers a sufficient number of connection points for interfacing with external components and peripherals.

Minimum Supply Voltage: 1.81 V

Allows for operation at lower voltages, saving power and extending battery life.

Maximum Operating Temperature: 105 °C

Can withstand high operating temperatures, making it suitable for industrial applications.

CPU Family: ARM7

Utilizes a popular and widely supported CPU architecture, ensuring compatibility with existing software and tools.

ADC Channels: YES

Includes analog-to-digital converter channels for capturing and processing analog signals, expanding the range of possible applications.

ROM Words: 262144

Provides ample storage space for program code and data, enabling the implementation of complex algorithms and applications.

Maximum Seated Height: 1.6 mm

Features a low-profile design for space-constrained applications and compact system integration.

Temperature Grade: INDUSTRIAL

Certified for industrial temperature ranges, ensuring reliable operation in harsh environmental conditions.

RAM Bytes: 12288

Offers sufficient random access memory for data storage and processing requirements, supporting multitasking and data manipulation.

Technology: CMOS

Utilizes low-power CMOS technology for energy-efficient operation and reduced heat dissipation.

Nominal Supply Voltage: 2 V

Operates at a standard supply voltage, ensuring compatibility with common power sources.

PWM Channels: YES

Supports pulse-width modulation channels for controlling motors, LEDs, and other devices with precision.

ROM Programmability: FLASH

Utilizes flash memory for programmability, allowing for easy and fast updates to the firmware and software.

Terminal Pitch: 0.5 mm

Features a fine pitch for terminals, enabling high-density PCB layouts and compact system design.

No. of I/O Lines: 12

Provides a sufficient number of input/output lines for connecting to external sensors, actuators, and communication interfaces.

Technical Specifications

Microcontrollers TMS470R1A256PZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

12

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.06 V

Minimum Supply Voltage:

1.81 V

Nominal Supply Voltage:

2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TMS470R1A256PZ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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