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TMS470PLF111PGEI

Texas Instruments

TMS470PLF111PGEI by Texas Instruments

TMS470PLF111PGEI by Texas Instruments is a 32-bit microcontroller with 82 I/O lines, operating at up to 20 MHz. It features FLASH ROM programmability and ADC channels, suitable for industrial applications requiring a temperature range of -40 to 85°C. The package style is flatpack with low profile and fine pitch terminals, making it ideal for space-constrained designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,956 parts In-Stock

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Digiode

USA . 4,503 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,451 parts In-Stock

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$1.000

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$1.000

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AZTECH Wire

Italy . 453 parts In-Stock

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$5.532

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453

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Parana Technologies

USA . 986 parts In-Stock

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$75.445

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986

$75.445

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ChromeModa Solutions

Germany . 1,243 parts In-Stock

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$84.770

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$69.511

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1,243

$84.770

$69.511

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IDEA Electronic Components Group

UK . 880 parts In-Stock

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$84.770

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$80.532

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$76.293

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880

$84.770

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$76.293

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Corphita

USA . 4,381 parts In-Stock

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DigiPath Technology Company

USA . 1,247 parts In-Stock

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$76.429

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Overview

Unlock the power of cutting-edge technology with the TMS470PLF111PGEI microcontroller by Texas Instruments. Designed to meet the highest quality standards, this versatile device offers a wide range of applications in various industries. With its advanced features and reliable performance, customers can expect seamless integration, enhanced functionality, and increased efficiency. Experience the unmatched value and benefits that this product brings to your projects and elevate your innovation to new heights. Choose Texas Instruments for superior quality and exceptional results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Ease of assembly and integration into circuit boards for efficient production processes.

Maximum Supply Voltage: 5.25 V

Allows for a wide input voltage range, making it versatile for different power supply scenarios.

Package Shape: SQUARE

Square shape allows for efficient use of space on the circuit board.

Bit Size: 32

High bit size provides enhanced processing capability and performance for complex applications.

No. of Terminals: 144

Abundance of terminals allows for connectivity to various external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers compactness and space-saving design for applications with limited board space.

Minimum Supply Voltage: 4.75 V

Low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

Wide operating temperature range makes this microcontroller suitable for industrial environments with varying conditions.

Minimum Operating Temperature: -40 °C

Operational in extreme low-temperature environments, offering versatility in application areas.

ADC Channels: YES

Built-in ADC channels enable analog-to-digital conversion, essential for interfacing with analog sensors and signals.

Terminal Position: QUAD

Quad terminal position simplifies the connection of external devices and components for enhanced functionality.

Maximum Seated Height: 1.6 mm

Low seated height enables a compact overall design for space-constrained applications.

Width: 20 mm

Moderate width allows for efficient board layout and integration into various system designs.

Maximum Clock Frequency: 20 MHz

High clock frequency enables fast processing speeds for swift execution of tasks.

Length: 20 mm

Compact length facilitates space-saving design and integration in small form factor devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient processing and control capabilities for a wide range of applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for energy-efficient operation.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and robust electrical connections.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage ensures consistent performance and reliable operation.

ROM Programmability: FLASH

Flash ROM programmability allows for flexible firmware updates and customization of software.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density packaging and integration in compact devices.

Speed: 48 rpm

High speed capability for rapid data processing and execution of tasks.

No. of I/O Lines: 82

Abundance of I/O lines for versatile connectivity and communication with external devices and interfaces.

Technical Specifications

Microcontrollers TMS470PLF111PGEI attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

82

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMS470PLF111PGEI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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