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TMS470R1A288PZ-T

Texas Instruments

TMS470R1A288PZ-T by Texas Instruments

TMS470R1A288PZ-T by Texas Instruments is a 32-bit ARM7TDMI microcontroller with 294912 ROM words and 16 DMA channels. It features 12-Ch 10-Bit ADC, CAN(2), I2C(3), SCI(3), SPI(2) connectivity, and operates at up to 10 MHz. Ideal for industrial applications requiring low power consumption and high-speed data processing.

Median Price

$14.787

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,336 parts In-Stock

1+ parts

-

100+ parts

$11.830

1k+ parts

$10.580

10k+ parts

$9.960

2,336

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$11.830

$10.580

$9.960

DigiKey

USA . 2,336 parts In-Stock

1+ parts

-

100+ parts

$15.560

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2,336

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$15.560

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Verical

USA . 1,298 parts In-Stock

1+ parts

-

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$14.787

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$13.225

10k+ parts

$12.450

1,298

-

$14.787

$13.225

$12.450

Distributors (In-Stock)

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Digiode

USA . 1,761 parts In-Stock

1+ parts

$10.849

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1,761

$10.849

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Vyrian

USA . 7,195 parts In-Stock

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7,195

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DigiKey Marketplace

USA . 3,177 parts In-Stock

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3,177

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Bristol Electronics

USA . 522 parts In-Stock

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522

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PC Components Company LLC

USA . 5 parts In-Stock

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5

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Distributors (Availability)

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Corphita

USA . 3,799 parts In-Stock

1+ parts

$10.278

100+ parts

-

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3,799

$10.278

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Parana Technologies

USA . 612 parts In-Stock

1+ parts

$26.130

100+ parts

-

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$26.718

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612

$26.130

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$26.718

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DigiPath Technology Company

USA . 532 parts In-Stock

1+ parts

$28.773

100+ parts

$26.471

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532

$28.773

$26.471

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ChromeModa Solutions

Germany . 3,343 parts In-Stock

1+ parts

$29.360

100+ parts

$24.075

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3,343

$29.360

$24.075

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IDEA Electronic Components Group

UK . 209 parts In-Stock

1+ parts

$29.360

100+ parts

$27.892

1k+ parts

$26.424

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209

$29.360

$27.892

$26.424

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Microchip USA

USA . 494 parts In-Stock

1+ parts

$34.940

100+ parts

$34.690

1k+ parts

$34.690

10k+ parts

$34.450

494

$34.940

$34.690

$34.690

$34.450

QUARKTWIN TECHNOLOGY LTD

USA . 7,052 parts In-Stock

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7,052

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Perfect Parts

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101

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Overview

Elevate your projects with the TMS470R1A288PZ-T by Texas Instruments, a top-quality microcontroller designed to deliver exceptional performance and reliability. With a wide range of applications in various industries, this product offers customers unmatched value and benefits. From its advanced technology to its innovative features, the TMS470R1A288PZ-T stands out as a superior choice for those seeking high-quality solutions. Trust in Texas Instruments' reputation for excellence and take your projects to the next level with this cutting-edge microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the microcontroller, making it suitable for various applications.

Maximum Supply Voltage: 2.05 V

Allows for a wide range of power supply options, giving flexibility in design.

Bit Size: 32

Offers high computational power and performance for complex operations.

CPU Family: ARM7TDMI

ARM architecture is known for its efficiency and performance, making it a reliable choice.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enables efficient processing of instructions, leading to faster execution and lower power consumption.

Analog To Digital Convertors: 12-Ch 10-Bit

Enables the microcontroller to interface with analog sensors and signals, expanding its application capabilities.

Connectivity: "CAN(2), I2C(3), SCI(3), SPI(2)

Supports a variety of communication protocols, allowing seamless integration with other devices in a network.

Technical Specifications

Microcontrollers TMS470R1A288PZ-T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

27

Bit Size:

32

Boundary Scan:

YES

CPU Family:

ARM7TDMI

Maximum Clock Frequency:

10 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

16

No. of I/O Lines:

14

No. of Serial I/Os:

5

No. of Terminals:

100

No. of Timers:

1

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

294912

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

115 mA

Maximum Supply Voltage:

2.05 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"CAN(2), I2C(3), SCI(3), SPI(2)"

Peripherals:

"AWD, DMA(16), DWD, TIMER"

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

TMS470R1A288PZ-T Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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