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TMS470R1A288PGET

Texas Instruments

TMS470R1A288PGET by Texas Instruments

TMS470R1A288PGET by Texas Instruments is a 32-bit ARM7TDMI microcontroller with 144 terminals, operating at up to 10 MHz. It features 12-Ch 10-Bit ADC, 16 DMA channels, and peripherals like AWD and TIMER. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$16.580

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 9,500 parts In-Stock

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Vyrian

USA . 5,030 parts In-Stock

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Digiode

USA . 2,340 parts In-Stock

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TME

Poland . 60 parts In-Stock

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$16.580

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60

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ACDS - Activité Composants Distribution Service

France . 35 parts In-Stock

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QIE Inc.

USA . 17 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 603 parts In-Stock

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$6.096

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603

$6.096

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One Stop Electronics

USA . 411 parts In-Stock

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$10.000

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Parana Technologies

USA . 1,423 parts In-Stock

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$46.226

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ChromeModa Solutions

Germany . 2,004 parts In-Stock

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$51.939

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$42.590

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2,004

$51.939

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IDEA Electronic Components Group

UK . 15 parts In-Stock

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$51.939

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$49.342

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$46.745

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15

$51.939

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$46.745

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Microchip USA

USA . 1,649 parts In-Stock

1+ parts

$54.260

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$53.480

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$53.100

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$52.710

1,649

$54.260

$53.480

$53.100

$52.710

Authorized Procurement Solutions

USA . 7,500 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,747 parts In-Stock

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Lixinc

USA . 4,447 parts In-Stock

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Corphita

USA . 2,267 parts In-Stock

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DigiPath Technology Company

USA . 282 parts In-Stock

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$46.828

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282

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$46.828

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Overview

Discover the cutting-edge TMS470R1A288PGET microcontroller by Texas Instruments, a high-quality product that offers unparalleled performance and reliability. Ideal for industrial applications, this microcontroller boasts advanced features such as ADC channels, DMA channels, and PWM channels, ensuring seamless connectivity and efficient operation. With a powerful ARM7TDMI CPU family, this device delivers exceptional speed and precision. Trust in Texas Instruments' expertise and unlock endless possibilities with the TMS470R1A288PGET microcontroller. Experience innovation at its finest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, ideal for portable and rugged applications.

Maximum Supply Voltage: 2.05 V

Efficient power consumption and can operate within a wide voltage range.

No. of External Interrupts: 16

Allows for efficient handling of external events and interrupts.

ADC Channels: YES

Analog to digital conversion capabilities for sensor interfacing and precise measurements.

ROM Programmability: FLASH

Flexible and reprogrammable memory for easy firmware updates and modifications.

Connectivity: "CAN(2), I2C(3), SCI(3), SPI(2)

Multiple communication interfaces for versatile connectivity options with other devices.

Speed: 48 rpm

Provides sufficient processing speed for a wide range of applications.

Low Power Mode: YES

Enables power-saving features for extended battery life or energy efficiency.

Technical Specifications

Microcontrollers TMS470R1A288PGET attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

27

Bit Size:

32

Boundary Scan:

YES

CPU Family:

ARM7TDMI

Maximum Clock Frequency:

10 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

16

No. of I/O Lines:

50

No. of Serial I/Os:

5

No. of Terminals:

144

No. of Timers:

1

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

294912

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

115 mA

Maximum Supply Voltage:

2.05 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"CAN(2), I2C(3), SCI(3), SPI(2)"

Peripherals:

"AWD, DMA(16), DWD, TIMER"

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

TMS470R1A288PGET Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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