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TMS38054FN

Texas Instruments

TMS38054FN by Texas Instruments

TMS38054FN by Texas Instruments is a 44-terminal chip carrier with 5V supply, operating at 0-99°C. It functions as a Token Ring transceiver with data rate of 16 Mbps, suitable for network interfaces in telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,846 parts In-Stock

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7,846

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Digiode

USA . 1,822 parts In-Stock

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1,822

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 196 parts In-Stock

1+ parts

$6.486

100+ parts

-

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196

$6.486

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Parana Technologies

USA . 1,389 parts In-Stock

1+ parts

$12.363

100+ parts

-

1k+ parts

$12.801

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1,389

$12.363

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$12.801

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DigiPath Technology Company

USA . 1,833 parts In-Stock

1+ parts

$13.613

100+ parts

$12.524

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1,833

$13.613

$12.524

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ChromeModa Solutions

Germany . 3,277 parts In-Stock

1+ parts

$13.891

100+ parts

$11.391

1k+ parts

-

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3,277

$13.891

$11.391

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IDEA Electronic Components Group

UK . 275 parts In-Stock

1+ parts

$13.891

100+ parts

$13.196

1k+ parts

$12.502

10k+ parts

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275

$13.891

$13.196

$12.502

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One Stop Electronics

USA . 1,604 parts In-Stock

1+ parts

$662.000

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1,604

$662.000

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Corphita

USA . 2,410 parts In-Stock

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2,410

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Overview

Unleash the power of seamless network connectivity with the TMS38054FN by Texas Instruments. Crafted with precision and expertise, this token ring transceiver offers unparalleled performance and reliability in network interfaces. Perfect for a wide range of applications, this innovative product ensures smooth data transmission at a blazing speed of 16 Mbps. Elevate your network experience with Texas Instruments' cutting-edge technology, where quality meets value, and efficiency meets excellence. Experience the difference with TMS38054FN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and lightweight design, making it ideal for network interfaces that may need to be moved or reconfigured.

Surface Mount: YES

Easy to install on circuit boards, reducing assembly time and costs.

Package Shape: SQUARE

Compact shape saves space and allows for efficient placement on circuit boards.

Power Supplies (V): 5

Compatible with standard power supply voltage, ensuring compatibility with existing systems.

No. of Terminals: 44

Sufficient number of terminals for connecting various components and peripherals for networking applications.

Package Style (Meter): CHIP CARRIER

Chip carrier package style provides protection and easy handling during installation.

Maximum Operating Temperature: 99 °C

Can withstand high operating temperatures, ensuring reliability in various environments.

Minimum Operating Temperature: 0 °C

Can operate in low temperatures, making it suitable for a wide range of applications.

Terminal Position: QUAD

Quad terminal position allows for efficient routing of connections and signal paths.

Maximum Seated Height: 4.57 mm

Low profile design minimizes space requirements and allows for compact device configurations.

Width: 16.5862 mm

Narrow width enables dense packing on circuit boards, maximizing component placement flexibility.

Length: 16.5862 mm

Compact length saves space on circuit boards, enabling efficient layout and design.

Terminal Form: J BEND

J bend terminal form provides secure connections and prevents disconnection during operation.

Maximum Supply Current: 200 mA

Supports a maximum supply current of 200 mA, suitable for high-performance networking operations.

Telecom IC Type: TOKEN RING TRANSCEIVER

Token ring transceiver technology ensures efficient data transmission and network connectivity.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5V ensures compatibility with standard power sources for easy integration.

Terminal Pitch: 1.27 mm

Close terminal pitch allows for precise connections and signal routing in compact spaces.

Data Rate: 16 Mbps

Data rate of 16 Mbps supports high-speed networking applications, ensuring fast and reliable data transmission.

Technical Specifications

Network Interfaces TMS38054FN attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

16 Mbps

JESD-30 Code:

S-PQCC-J44

Length:

16.5862 mm

No. of Functions:

1

No. of Terminals:

44

No. of Transceivers:

1

Maximum Operating Temperature:

99 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

200 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.5862 mm

Trade Compliance

TMS38054FN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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