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TJA1050T

NXP Semiconductors

TJA1050T by NXP Semiconductors

NXP Semiconductors' TJA1050T is a network interface IC with 1 Mbps data rate, suitable for automotive applications. It operates at temperatures ranging from -40 to 125°C and requires a 5V supply voltage. The small outline package has 8 terminals and is surface mountable, making it ideal for compact designs.

Median Price

$1.522

Lifecycle Status

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17

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Freelance Electronics

USA . 3 parts In-Stock

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Digiode

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LIBRA Elektronik GmbH

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PC Components Company LLC

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AZTECH Wire

Italy . 379 parts In-Stock

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$12.346

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Advanced Electronics

New Zealand . 10 parts In-Stock

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Aztec Data Supply Inc.

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Corohmni

South Africa . 266 parts In-Stock

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One Stop Electronics

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Semicontronic

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Ampacity Inc.

Singapore . 452 parts In-Stock

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Glotronic Ltd.

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ChipstoGo Electronic ltd

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Overview

Revolutionize your automotive networking with the TJA1050T by NXP Semiconductors. This top-quality interface circuit offers unparalleled reliability and efficiency, making it a must-have for all your network interface needs. With cutting-edge CMOS technology and a wide operating temperature range, this small outline package delivers seamless performance in demanding automotive environments. Trust NXP Semiconductors for the highest quality components that guarantee optimal connectivity and functionality. Elevate your automotive systems with the TJA1050T today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures a lightweight and durable construction, ideal for long-term use in various environments.

Surface Mount: YES

Being surface mount compatible allows for easy and efficient installation on printed circuit boards, saving time and effort during assembly.

Power Supplies (V): 5

Operates on a standard 5V power supply, making it compatible with most power sources and easy to integrate into existing systems.

No. of Terminals: 8

The 8 terminals provide ample connectivity options, allowing for versatile connections and compatibility with different devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand extreme conditions and maintain reliable performance.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, enhancing overall efficiency and performance.

Data Rate: 1 Mbps

Capable of handling data rates of up to 1 Mbps, making it suitable for high-speed data transmission applications and ensuring fast and efficient data transfer.

Technical Specifications

Network Interfaces TJA1050T attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.075 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

TJA1050T Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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