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TMS38054FNLR

Texas Instruments

TMS38054FNLR by Texas Instruments

TMS38054FNLR by Texas Instruments is a 44-terminal chip carrier with 5V supply, operating at 0-70°C. It functions as a Token Ring transceiver with data rate of 16 Mbps. Ideal for network interfaces, it features J-bend terminals and quad position layout.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,434 parts In-Stock

1+ parts

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7,434

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Digiode

USA . 1,657 parts In-Stock

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1,657

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,371 parts In-Stock

1+ parts

$6.641

100+ parts

-

1k+ parts

$7.359

10k+ parts

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2,371

$6.641

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$7.359

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DigiPath Technology Company

USA . 712 parts In-Stock

1+ parts

$7.313

100+ parts

$6.728

1k+ parts

-

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712

$7.313

$6.728

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ChromeModa Solutions

Germany . 3,645 parts In-Stock

1+ parts

$7.462

100+ parts

$6.119

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-

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3,645

$7.462

$6.119

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IDEA Electronic Components Group

UK . 1,534 parts In-Stock

1+ parts

$7.462

100+ parts

-

1k+ parts

$6.716

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1,534

$7.462

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$6.716

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AZTECH Wire

Italy . 363 parts In-Stock

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$18.649

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363

$18.649

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One Stop Electronics

USA . 1,092 parts In-Stock

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$928.000

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1,092

$928.000

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Corphita

USA . 1,211 parts In-Stock

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1,211

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Overview

Enhance your network interfaces with the top-quality TMS38054FNLR from Texas Instruments. This state-of-the-art token ring transceiver offers unmatched reliability and performance, making it the perfect choice for your networking needs. With its innovative design and commercial-grade temperature grade, this chip carrier package delivers exceptional value and benefits to customers. Whether you're looking to upgrade your existing network or develop new applications, the TMS38054FNLR is the ideal solution for maximizing efficiency and connectivity. Elevate your network capabilities today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, making it a good choice for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on printed circuit boards, making the product suitable for compact designs.

Power Supplies (V): 5

Operating at a standard voltage of 5V, this product is compatible with most systems and provides stable power supply for reliable performance.

No. of Terminals: 44

With a high number of terminals, this product offers increased connectivity options and flexibility in network configurations.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures stable performance even in demanding environments, enhancing the product's reliability.

Data Rate: 16 Mbps

Supporting a data rate of 16 Mbps, this product enables fast and efficient data transfer speeds, making it ideal for high-performance network applications.

Technical Specifications

Network Interfaces TMS38054FNLR attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

16 Mbps

JESD-30 Code:

S-PQCC-J44

Length:

16.5862 mm

No. of Functions:

1

No. of Terminals:

44

No. of Transceivers:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.2 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16.5862 mm

Trade Compliance

TMS38054FNLR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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