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TMS38053FNS

Texas Instruments

TMS38053FNS by Texas Instruments

TMS38053FNS by Texas Instruments is a 44-terminal chip carrier with 5V supply, operating b/w -55°C to 100°C. It functions as a Token Ring transceiver at 16 Mbps data rate, suitable for network interfaces in various applications.

Median Price

$14.400

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 26 parts In-Stock

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$14.400

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Vyrian

USA . 8,977 parts In-Stock

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Digiode

USA . 2,542 parts In-Stock

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Q Components

USA . 231 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 44 parts In-Stock

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Inland Empire Components Inc.

USA . 27 parts In-Stock

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PAR Electronics

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J & M Industries LLC

USA . 22 parts In-Stock

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Prism Electronics

USA . 10 parts In-Stock

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Manoshevitz Elec. Sales

Israel . 3 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 928 parts In-Stock

1+ parts

$8.862

100+ parts

$822.946

1k+ parts

$7.976

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928

$8.862

$822.946

$7.976

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DigiPath Technology Company

USA . 322 parts In-Stock

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$9.758

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$8.977

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322

$9.758

$8.977

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ChromeModa Solutions

Germany . 4,088 parts In-Stock

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$9.957

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$8.165

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4,088

$9.957

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IDEA Electronic Components Group

UK . 366 parts In-Stock

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$9.957

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$9.459

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$8.961

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366

$9.957

$9.459

$8.961

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AZTECH Wire

Italy . 496 parts In-Stock

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$10.559

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496

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One Stop Electronics

USA . 1,099 parts In-Stock

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$191.000

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A-Z Elektronik GmbH

Germany . 6,752 parts In-Stock

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Corphita

USA . 2,487 parts In-Stock

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Kepictronics

USA . 510 parts In-Stock

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510

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A-Plus Industry Inc.

USA . 87 parts In-Stock

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Perfect Parts

USA . 20 parts In-Stock

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Overview

Designed by Texas Instruments, the TMS38053FNS is a top-of-the-line Network Interfaces component that offers unparalleled quality and reliability. Perfect for a wide range of applications, this product boasts a robust design and innovative features that set it apart from the competition. With its high performance and ease of use, customers can expect seamless integration and optimal functionality. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations and brings value to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy body material makes the product lightweight and durable for easy handling and long-term use.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, increasing efficiency in manufacturing processes.

Power Supplies (V): 5

Operating at a voltage of 5V ensures compatibility with standard power sources, making integration into existing systems hassle-free.

No. of Terminals: 44

Having 44 terminals allows for versatile connectivity options, making it suitable for a wide range of networking applications.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100°C, this product can handle high-performance networking tasks without overheating.

Data Rate: 16 Mbps

Supporting a data rate of 16 Mbps ensures fast and reliable data transmission, ideal for high-speed networking requirements.

Technical Specifications

Network Interfaces TMS38053FNS attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

16 Mbps

JESD-30 Code:

S-PQCC-J44

No. of Terminals:

44

No. of Transceivers:

1

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Network Interfaces

Maximum Supply Current:

.23 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TMS38053FNS Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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