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TMS38054PAH

Texas Instruments

TMS38054PAH by Texas Instruments

TMS38054PAH by Texas Instruments is a Network Interfaces IC with 52 terminals, operating at 0-70°C. It features GULL WING terminals, 5V supply voltage, and supports TOKEN RING applications. The PLASTIC/EPOXY package is SQUARE shaped, FLATPACK style with a thin profile for compact designs.

Median Price

$6.820

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 117 parts In-Stock

1+ parts

-

100+ parts

$6.330

1k+ parts

$5.660

10k+ parts

$5.330

117

-

$6.330

$5.660

$5.330

DigiKey

USA . 91 parts In-Stock

1+ parts

-

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$7.310

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91

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$7.310

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Distributors (In-Stock)

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DF Sales Co.

USA . 908 parts In-Stock

1+ parts

$4.500

100+ parts

-

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908

$4.500

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DF Sales Co.

USA . 908 parts In-Stock

1+ parts

$4.500

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908

$4.500

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Digiode

USA . 3,034 parts In-Stock

1+ parts

$6.678

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-

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3,034

$6.678

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Vyrian

USA . 6,279 parts In-Stock

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6,279

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Q Components

USA . 405 parts In-Stock

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405

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,684 parts In-Stock

1+ parts

$6.327

100+ parts

-

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3,684

$6.327

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-

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Parana Technologies

USA . 316 parts In-Stock

1+ parts

$14.869

100+ parts

-

1k+ parts

$15.300

10k+ parts

-

316

$14.869

-

$15.300

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DigiPath Technology Company

USA . 1,953 parts In-Stock

1+ parts

$16.373

100+ parts

$15.063

1k+ parts

-

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1,953

$16.373

$15.063

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ChromeModa Solutions

Germany . 6,427 parts In-Stock

1+ parts

$16.707

100+ parts

$13.700

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-

10k+ parts

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6,427

$16.707

$13.700

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IDEA Electronic Components Group

UK . 780 parts In-Stock

1+ parts

$16.707

100+ parts

$15.872

1k+ parts

$15.036

10k+ parts

-

780

$16.707

$15.872

$15.036

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A-Z Elektronik GmbH

Germany . 7,455 parts In-Stock

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7,455

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Kepictronics

USA . 1,280 parts In-Stock

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1,280

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A-Plus Industry Inc.

USA . 4 parts In-Stock

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Overview

Looking to upgrade your network interfaces? Look no further than the TMS38054PAH by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge solutions for all your networking needs. The TMS38054PAH offers unmatched value with its advanced features and impressive performance. Whether you're looking to enhance your token ring transceiver or improve your overall network connectivity, this product is the perfect choice. Trust Texas Instruments to provide you with the best in class solutions for your networking applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material ensures a lightweight and durable design for the product.

Surface Mount: YES

Being surface mount allows for easy installation and integration into electronic systems.

No. of Terminals: 52

With a high number of terminals, this network interface offers versatile connectivity options.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in demanding environments.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and ease of soldering during installation.

Technical Specifications

Network Interfaces TMS38054PAH attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G52

Length:

10 mm

No. of Functions:

1

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

200 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

TMS38054PAH Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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