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TMS380SRAFN

Texas Instruments

TMS380SRAFN by Texas Instruments

TMS380SRAFN by Texas Instruments is a CMOS Token Ring Transceiver with 44 terminals in a square chip carrier package. Operating temperature range of 0-70°C, suitable for commercial applications. Features J bend terminal form, 5V nominal voltage, and surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,733 parts In-Stock

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6,733

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Digiode

USA . 302 parts In-Stock

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302

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Distributors (Availability)

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Parana Technologies

USA . 812 parts In-Stock

1+ parts

$8.170

100+ parts

-

1k+ parts

$8.774

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812

$8.170

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$8.774

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DigiPath Technology Company

USA . 489 parts In-Stock

1+ parts

$8.996

100+ parts

$8.277

1k+ parts

-

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489

$8.996

$8.277

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ChromeModa Solutions

Germany . 6,113 parts In-Stock

1+ parts

$9.180

100+ parts

$7.528

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6,113

$9.180

$7.528

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IDEA Electronic Components Group

UK . 1,853 parts In-Stock

1+ parts

$9.180

100+ parts

$8.721

1k+ parts

$8.262

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1,853

$9.180

$8.721

$8.262

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AZTECH Wire

Italy . 457 parts In-Stock

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$16.798

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457

$16.798

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One Stop Electronics

USA . 1,648 parts In-Stock

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$333.000

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1,648

$333.000

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Corphita

USA . 4,143 parts In-Stock

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Overview

Discover the cutting-edge TMS380SRAFN by Texas Instruments, a top-notch network interface designed to elevate your connectivity experience. Manufactured by the renowned Texas Instruments, this product guarantees reliability and quality. Ideal for various applications, this token ring transceiver offers seamless integration and superior performance. Elevate your networking capabilities with the TMS380SRAFN and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the network interface, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on circuit boards, saving space and enabling efficient assembly.

Package Shape: SQUARE

The square package shape offers a compact design, making it suitable for space-constrained applications.

No. of Terminals: 44

Having 44 terminals allows for versatile connectivity options and compatibility with various devices.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70 °C, the network interface can withstand elevated temperatures without performance degradation.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0 °C ensures reliable performance even in cold environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the network interface energy-efficient and reliable.

Nominal Supply Voltage: 5 V

The 5 V nominal supply voltage is common and easily compatible with standard power sources, ensuring seamless integration.

Technical Specifications

Network Interfaces TMS380SRAFN attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J44

Length:

16.5862 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16.5862 mm

Trade Compliance

TMS380SRAFN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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