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TMS38053FN

Texas Instruments

TMS38053FN by Texas Instruments

TMS38053FN by Texas Instruments is a 44-terminal network interface chip carrier with 5V supply voltage and 16 Mbps data rate. It operates b/w 0-60°C, suitable for commercial telecom applications like token ring transceivers. The surface-mountable plastic/epoxy package makes it ideal for compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,026 parts In-Stock

1+ parts

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7,026

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Digiode

USA . 1,898 parts In-Stock

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1,898

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Semi Source

USA . 161 parts In-Stock

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161

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 477 parts In-Stock

1+ parts

$6.197

100+ parts

-

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477

$6.197

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Parana Technologies

USA . 985 parts In-Stock

1+ parts

$9.430

100+ parts

-

1k+ parts

$10.048

10k+ parts

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985

$9.430

-

$10.048

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ChromeModa Solutions

Germany . 4,799 parts In-Stock

1+ parts

$10.596

100+ parts

$8.689

1k+ parts

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4,799

$10.596

$8.689

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IDEA Electronic Components Group

UK . 1,914 parts In-Stock

1+ parts

$10.596

100+ parts

$10.066

1k+ parts

$9.536

10k+ parts

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1,914

$10.596

$10.066

$9.536

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One Stop Electronics

USA . 493 parts In-Stock

1+ parts

$346.000

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493

$346.000

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DigiPath Technology Company

USA . 1,557 parts In-Stock

1+ parts

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100+ parts

$9.553

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1,557

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$9.553

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Corphita

USA . 432 parts In-Stock

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432

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Overview

Unlock seamless networking capabilities with the TMS38053FN by Texas Instruments. As a leader in innovative technology solutions, Texas Instruments brings you a high-quality network interface that is versatile and reliable. From token ring transceivers to data rates of 16 Mbps, this product offers unmatched value and performance. Whether you're looking to enhance your telecommunications equipment or streamline your network infrastructure, the TMS38053FN is the perfect choice for all your networking needs. Experience the benefits of cutting-edge technology with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to damage, making the product reliable for long-term use.

Surface Mount: YES

Enables easy installation on circuit boards, saving time and effort during assembly.

Power Supplies (V): 5

Operates on a standard voltage, ensuring compatibility with most devices and power sources.

No. of Terminals: 44

Offers plenty of connection points for interfacing with other components, increasing versatility and functionality.

Package Style: CHIP CARRIER

Provides compact packaging for efficient use of space on circuit boards.

Maximum Operating Temperature: 60 °C

Can withstand high temperatures without malfunctions, ensuring reliable performance in various environments.

Minimum Operating Temperature: 0 °C

Works in cold conditions, making it suitable for use in different climates and settings.

Data Rate: 16 Mbps

Offers high-speed data transfer capabilities, ideal for handling large amounts of information quickly and efficiently.

Technical Specifications

Network Interfaces TMS38053FN attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

16 Mbps

JESD-30 Code:

S-PQCC-J44

No. of Terminals:

44

No. of Transceivers:

1

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Network Interfaces

Maximum Supply Current:

.23 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TMS38053FN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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