Loading...

TMS320VC549GGUR100

Texas Instruments

TMS320VC549GGUR100 by Texas Instruments

TMS320VC549GGUR100 by Texas Instruments is a 16-bit DSP with 23-bit address bus, operating at max 20 MHz clock frequency. Ideal for industrial applications, it features low power mode, barrel shifter, and 65536 RAM words for efficient signal processing tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,151 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,151

-

-

-

-

Digiode

USA . 1,590 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,590

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 724 parts In-Stock

1+ parts

$5.480

100+ parts

-

1k+ parts

-

10k+ parts

-

724

$5.480

-

-

-

One Stop Electronics

USA . 1,541 parts In-Stock

1+ parts

$8.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,541

$8.000

-

-

-

Corohmni

South Africa . 2,732 parts In-Stock

1+ parts

$43.221

100+ parts

-

1k+ parts

-

10k+ parts

-

2,732

$43.221

-

-

-

Parana Technologies

USA . 248 parts In-Stock

1+ parts

$64.457

100+ parts

-

1k+ parts

-

10k+ parts

-

248

$64.457

-

-

-

DigiPath Technology Company

USA . 82 parts In-Stock

1+ parts

$70.976

100+ parts

$65.297

1k+ parts

-

10k+ parts

-

82

$70.976

$65.297

-

-

ChromeModa Solutions

Germany . 4,455 parts In-Stock

1+ parts

$72.424

100+ parts

$59.388

1k+ parts

-

10k+ parts

-

4,455

$72.424

$59.388

-

-

IDEA Electronic Components Group

UK . 2,158 parts In-Stock

1+ parts

$72.424

100+ parts

$68.803

1k+ parts

$65.182

10k+ parts

-

2,158

$72.424

$68.803

$65.182

-

Corphita

USA . 2,171 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,171

-

-

-

-

Microchip USA

USA . 403 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

403

-

-

-

-

Overview

Unleash the power of cutting-edge technology with the TMS320VC549GGUR100 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Digital Signal Processors that redefine performance standards. Perfect for a wide range of applications, this DSP offers unparalleled value and benefits to customers looking for seamless integration, efficient processing, and unmatched reliability. Elevate your projects with the TMS320VC549GGUR100 and experience the advantages of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic is lightweight and cost-effective, making the product easy to handle and affordable.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 2.75 V

Operating within a moderate maximum supply voltage range ensures stability and reliability of the product.

Address Bus Width: 23

A wider address bus allows for efficient data transfer and processing, enhancing the performance of the product.

Package Shape: SQUARE

Square package shape provides a compact form factor, optimizing space utilization in electronic devices.

Bit Size: 16

A 16-bit architecture enables higher processing speeds and accuracy in digital signal processing applications.

Power Supplies (V): 2.5, 3.3

Compatibility with multiple power supply voltages offers flexibility and ease of integration in various electronic systems.

No. of Terminals: 144

Having a high number of terminals allows for versatile connectivity options, enabling seamless integration with other components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array, low profile, and fine pitch package style offers enhanced thermal performance, efficient signal routing, and compact design.

Minimum Supply Voltage: 2.4 V

Operating at a low minimum supply voltage ensures energy efficiency and extends the product's battery life.

Maximum Operating Temperature: 100 °C

High maximum operating temperature tolerance makes the product suitable for industrial applications where heat dissipation is crucial.

Minimum Operating Temperature: -40 °C

Wide temperature operating range allows the product to function reliably in extreme environmental conditions.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier PCB assembly and maintenance, improving overall usability.

Maximum Seated Height: 1.4 mm

Low seated height ensures compatibility with slim electronic devices and enables compact product design.

RAM Words: 65536

Large RAM capacity allows for efficient data storage and retrieval, improving the overall performance of the product.

Width: 12 mm

Compact width dimension enables easy integration of the product into space-constrained electronic systems.

Boundary Scan: YES

Boundary scan feature facilitates efficient testing and debugging of the product during manufacturing and maintenance processes.

External Data Bus Width: 16

A wider external data bus width enables faster data transfer rates, enhancing the product's processing capabilities.

Maximum Clock Frequency: 20 MHz

High maximum clock frequency allows for rapid data processing and execution of complex algorithms in real-time applications.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data flow and communication within the product, improving overall system performance.

Length: 12 mm

Compact length dimension enables easy integration of the product into space-constrained electronic systems.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, ensuring reliable operation in harsh environmental conditions typically found in industrial settings.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type supports various digital signal processing applications, expanding the product's usability across different industries.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with a wide range of electronic devices.

Terminal Form: BALL

Ball terminal form facilitates reliable connections and soldering during the PCB assembly process, ensuring long-term performance.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent and reliable operation of the product under normal operating conditions.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high-density packaging, enabling compact product design and efficient use of PCB space.

Format: FIXED POINT

Fixed-point format provides a balance between precision and processing speed, making the product suitable for various DSP applications.

Low Power Mode: YES

Low power mode functionality enhances energy efficiency and extends battery life, ideal for portable and battery-powered devices.

Barrel Shifter: YES

Barrel shifter feature enables efficient bit shifting operations, improving the product's computational efficiency in signal processing tasks.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC549GGUR100 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B144

Length:

12 mm

Low Power Mode:

YES

No. of Terminals:

144

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,13X13,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320VC549GGUR100 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20