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TMS320VC5441ZGU

Texas Instruments

TMS320VC5441ZGU by Texas Instruments

TMS320VC5441ZGU by Texas Instruments is a 16-bit DSP with 133 MHz clock frequency, 65536 RAM words, and 24 DMA channels. Ideal for digital signal processing applications requiring low power mode, it features a grid array package with 169 terminals and operates b/w -40 to +85 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,227 parts In-Stock

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Digiode

USA . 2,041 parts In-Stock

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2,041

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Distributors (Availability)

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AZTECH Wire

Italy . 884 parts In-Stock

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$18.552

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884

$18.552

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One Stop Electronics

USA . 1,197 parts In-Stock

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$22.000

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1,197

$22.000

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Parana Technologies

USA . 257 parts In-Stock

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$34.509

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257

$34.509

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Corohmni

South Africa . 1,011 parts In-Stock

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$35.595

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1,011

$35.595

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DigiPath Technology Company

USA . 51 parts In-Stock

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$37.999

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51

$37.999

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ChromeModa Solutions

Germany . 5,813 parts In-Stock

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$38.774

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$31.795

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$38.774

$31.795

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IDEA Electronic Components Group

UK . 1,481 parts In-Stock

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$38.774

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$36.835

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$34.897

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1,481

$38.774

$36.835

$34.897

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Component Stockers USA

USA . 616 parts In-Stock

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$99.990

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616

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Corphita

USA . 2,371 parts In-Stock

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Microchip USA

USA . 319 parts In-Stock

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GreenTree Electronics

Israel . 100 parts In-Stock

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100

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Legend Electronics Inc. (Excess)

USA . 100 parts In-Stock

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100

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Speed Components Ltd (Excess)

Israel . 100 parts In-Stock

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100

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Glotronic Ltd.

UK . 32 parts In-Stock

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Overview

Unleash the power of digital signal processing with the TMS320VC5441ZGU by Texas Instruments. This high-quality DSP offers unmatched performance and reliability, thanks to its cutting-edge technology and innovative design. Ideal for a wide range of applications, this versatile product delivers exceptional value and benefits to customers. Whether you're looking to enhance your audio system, improve image processing, or optimize communication networks, the TMS320VC5441ZGU is the perfect choice. Trust Texas Instruments for all your DSP needs and experience superior quality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight and durable, making the product easy to handle and resistant to damage during transportation.

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB design, saving valuable space in electronic devices.

Maximum Supply Voltage: 1.65 V

Low maximum supply voltage ensures power efficiency and reduces the risk of overheating or damage to the device.

Package Shape: SQUARE

Square package shape is easy to mount and align on a PCB, simplifying the assembly process.

Bit Size: 16

16-bit processing capability provides a balance between performance and cost, suitable for a wide range of applications.

Power Supplies (V): 1.6,3.3

Multiple power supply options allow for flexibility in system design and optimization of power efficiency.

No. of Terminals: 169

High number of terminals provide connectivity options for various external components and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array package style with low profile and fine pitch enables high-density mounting and improves electrical performance.

Minimum Supply Voltage: 1.55 V

Low minimum supply voltage ensures reliable operation at lower power levels, maximizing energy efficiency.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures product reliability and stability in various environments.

No. of External Interrupts: 8

Multiple external interrupts allow for efficient handling of external events and real-time processing of signals.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures stable performance even in cold environments.

Terminal Finish: TIN SILVER COPPER

Tin, silver, and copper terminal finish provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and enables easy access for soldering and maintenance.

Maximum Seated Height: 1.4 mm

Low maximum seated height enables a slim and compact design for space-constrained applications.

RAM Words: 65536

Generous amount of RAM allows for efficient data processing and storage, enhancing overall performance.

Width: 12 mm

Compact width makes the product suitable for small form factor devices and tight PCB layouts.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging during manufacturing and maintenance periods.

External Data Bus Width: 16

16-bit external data bus width enables fast data transfer and efficient communication with external peripherals.

Maximum Clock Frequency: 133 MHz

High maximum clock frequency allows for rapid data processing and real-time signal processing.

Maximum Time At Peak Reflow Temperature (s): 30

Extended peak reflow time ensures proper soldering and reliable connections during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature enables robust solder joints and prevents soldering defects.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data throughput and enables parallel processing for improved performance.

Length: 12 mm

Compact length facilitates space-efficient PCB design and integration into various electronic devices.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type supports a wide range of signal processing applications and external interfaces.

No. of Timers: 8

Multiple timers enable precise timing and synchronization of tasks, essential for real-time processing applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity for reliable and efficient operation.

Terminal Form: BALL

Ball terminal form simplifies soldering and assembly processes, ensuring reliable connectivity and mechanical stability.

Nominal Supply Voltage: 1.6 V

Stable nominal supply voltage ensures consistent performance and reliable operation under varying load conditions.

No. of DMA Channels: 24

High number of DMA channels enable efficient data transfer and processing, improving system performance and responsiveness.

Terminal Pitch: 0.8 mm

Fine terminal pitch enables high-density mounting and compact PCB design for space-constrained applications.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and improves computational efficiency for signal processing tasks.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, requiring standard handling procedures to prevent damage during storage or assembly.

Low Power Mode: YES

Low power mode enhances energy efficiency and prolongs battery life, crucial for portable and battery-powered devices.

Barrel Shifter: YES

Barrel shifter capability enables efficient data manipulation and processing, improving overall performance and speed.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5441ZGU attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

19

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

133 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B169

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

24

No. of External Interrupts:

8

No. of Terminals:

169

No. of Timers:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA169,13X13,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.6,3.3

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.55 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5441ZGU Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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