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TMS320LF2403APAGS

Texas Instruments

TMS320LF2403APAGS by Texas Instruments

TMS320LF2403APAGS by Texas Instruments is a 16-bit DSP with 544 RAM words, operating at 20 MHz. Ideal for automotive applications, it features FLASH ROM programmability, 3.3V supply voltage, and low power mode for efficient performance in digital signal processing tasks.

Median Price

$15.310

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,957 parts In-Stock

1+ parts

$15.310

100+ parts

$13.373

1k+ parts

$9.223

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6,957

$15.310

$13.373

$9.223

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Distributors (In-Stock)

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Digiode

USA . 871 parts In-Stock

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$14.544

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871

$14.544

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Chip Stock

USA . 5,000 parts In-Stock

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Vyrian

USA . 4,312 parts In-Stock

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4 Star Electronics, Inc.

USA . 4,007 parts In-Stock

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TME

Poland . 160 parts In-Stock

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$15.850

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160

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$15.850

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LWI Electronics Inc

India . 5 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 320 parts In-Stock

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$9.620

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320

$9.620

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Corphita

USA . 3,554 parts In-Stock

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$13.779

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Parana Technologies

USA . 2,075 parts In-Stock

1+ parts

$20.660

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$20.775

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2,075

$20.660

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$20.775

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DigiPath Technology Company

USA . 2,291 parts In-Stock

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$22.749

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2,291

$22.749

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ChromeModa Solutions

Germany . 3,752 parts In-Stock

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$23.213

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$19.035

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3,752

$23.213

$19.035

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IDEA Electronic Components Group

UK . 1,784 parts In-Stock

1+ parts

$23.213

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$22.052

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$20.892

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1,784

$23.213

$22.052

$20.892

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Corohmni

South Africa . 276 parts In-Stock

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$86.378

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$86.378

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Lixinc

USA . 7,987 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,478 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

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Assy Fe

Spain . 1,000 parts In-Stock

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Perfect Parts

USA . 707 parts In-Stock

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707

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Overview

Discover the power of the TMS320LF2403APAGS from Texas Instruments, a cutting-edge digital signal processor designed to elevate your projects to the next level. With a focus on quality and reliability, Texas Instruments delivers top-notch products, and this DSP is no exception. Perfect for applications in automotive technology, telecommunications, and more, this versatile processor offers unmatched value and performance. Experience the benefits of advanced features like low power mode, PWM channels, and barrel shifter, all in a compact and efficient package. Upgrade your designs today with the TMS320LF2403APAGS and unlock limitless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials make the package lightweight and durable, ideal for portable and rugged applications.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in powering the device with a maximum voltage of 3.6V, suitable for a wide range of power sources.

RAM Words: 544

Ample amount of RAM words for storing and processing data, making the DSP efficient in handling complex tasks and computations.

Maximum Clock Frequency: 20 MHz

High clock frequency enables fast processing speed, making the DSP suitable for real-time signal processing applications.

Temperature Grade: AUTOMOTIVE

Designed to operate effectively in automotive environments with the ability to withstand a wide temperature range, ensuring reliability in harsh conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Specifically designed as a digital signal processor, providing specialized processing capabilities for signal processing tasks in addition to other peripheral functions.

Low Power Mode: YES

Includes a low power mode to conserve energy consumption when the device is in standby or idle mode, making it energy efficient.

Technical Specifications

Digital Signal Processors (DSPs) TMS320LF2403APAGS attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

16

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

3

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

544

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

TMS320LF2403APAGS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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