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TMS320LF2403APAG4

Texas Instruments

TMS320LF2403APAG4 by Texas Instruments

TMS320LF2403APAG4 by Texas Instruments is a 16-bit DSP with 544 RAM words, operating at max 20 MHz. Ideal for industrial applications, it features 3 external interrupts, ADC channels, and 5 timers for efficient signal processing in a compact thin profile package.

Median Price

$2.365

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 40 parts In-Stock

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$2.365

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Vyrian

USA . 6,795 parts In-Stock

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Digiode

USA . 3,071 parts In-Stock

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3,071

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Distributors (Availability)

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AZTECH Wire

Italy . 556 parts In-Stock

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$16.774

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Corohmni

South Africa . 1,972 parts In-Stock

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$23.458

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One Stop Electronics

USA . 1,611 parts In-Stock

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$27.000

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Parana Technologies

USA . 590 parts In-Stock

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$72.702

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590

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IDEA Electronic Components Group

UK . 1,487 parts In-Stock

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$81.688

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$77.604

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$73.519

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1,487

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$73.519

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ChromeModa Solutions

Germany . 471 parts In-Stock

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$81.688

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$66.984

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DigiPath Technology Company

USA . 1,761 parts In-Stock

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$73.650

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Microchip USA

USA . 1,739 parts In-Stock

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Corphita

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Overview

Elevate your digital signal processing projects with the TMS320LF2403APAG4 by Texas Instruments. Designed with precision and reliability, this DSP offers unparalleled performance in a compact package. With its advanced features and versatile applications, this product provides a wide range of benefits to customers looking for high-quality solutions. Experience the power of Texas Instruments technology and unlock new possibilities in your designs with the TMS320LF2403APAG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and cost-effective solution for packaging, making the product easy to handle and affordable.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options, providing a wider range of compatible power sources.

Bit Size: 16

Offers a good balance between processing power and efficiency for various signal processing tasks.

RAM Words: 544

Provides ample memory space for storing and processing data efficiently, allowing for complex signal processing tasks.

Maximum Clock Frequency: 20 MHz

Offers fast processing speed and high performance for real-time signal processing applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Specifically designed for digital signal processing tasks, ensuring optimal performance and efficiency.

Technical Specifications

Digital Signal Processors (DSPs) TMS320LF2403APAG4 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

3

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

544

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

120 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

TMS320LF2403APAG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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