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TMS320F2801ZGMA

Texas Instruments

TMS320F2801ZGMA by Texas Instruments

TMS320F2801ZGMA by Texas Instruments is a 32-bit DSP with 100 terminals, operating at max 100 MHz. Ideal for industrial applications due to its low power mode, flash ROM programmability, and internal bus architecture. It features 12288 RAM bytes and operates in an industrial temperature range of -40 to 85°C.

Median Price

$6.910

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 158 parts In-Stock

1+ parts

$6.910

100+ parts

$6.770

1k+ parts

$6.630

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158

$6.910

$6.770

$6.630

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Vyrian

USA . 4,090 parts In-Stock

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Digiode

USA . 355 parts In-Stock

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355

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LWI Electronics Inc

India . 1 parts In-Stock

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1

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Distributors (Availability)

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One Stop Electronics

USA . 392 parts In-Stock

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$4.000

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392

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Ampacity Inc.

Singapore . 798 parts In-Stock

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$8.000

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798

$8.000

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AZTECH Wire

Italy . 229 parts In-Stock

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$18.003

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Parana Technologies

USA . 1,464 parts In-Stock

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$58.553

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1,464

$58.553

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ChromeModa Solutions

Germany . 4,436 parts In-Stock

1+ parts

$65.790

100+ parts

$53.948

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4,436

$65.790

$53.948

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IDEA Electronic Components Group

UK . 1,007 parts In-Stock

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$65.790

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$62.500

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$59.211

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1,007

$65.790

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$59.211

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Corohmni

South Africa . 383 parts In-Stock

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$84.911

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$84.911

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DigiPath Technology Company

USA . 1,815 parts In-Stock

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$59.316

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1,815

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Microchip USA

USA . 477 parts In-Stock

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Corphita

USA . 145 parts In-Stock

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Overview

Unlock the power of digital signal processing with the Texas Instruments TMS320F2801ZGMA. Built by a trusted manufacturer, this DSP offers unparalleled quality and reliability. Ideal for a wide range of applications, this product delivers superior performance and efficiency. With features like low power mode and flash ROM programmability, customers can expect exceptional value and benefits. Experience seamless operation and innovative technology with the TMS320F2801ZGMA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the DSP, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the DSP onto circuit boards, saving time and cost in production.

Maximum Supply Voltage: 1.89 V

The higher maximum supply voltage allows for flexibility in power input, accommodating various power sources.

On Chip Data RAM Width: 16

With a wider RAM width, the DSP can process and store more data simultaneously, improving overall performance.

Screening Level: AEC-Q100

AEC-Q100 screening ensures that the DSP meets automotive industry standards for reliability and quality, making it suitable for automotive applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space on circuit boards, enabling compact and streamlined designs.

Bit Size: 32

The 32-bit architecture of the DSP provides high processing power and efficiency, making it capable of handling complex signal processing tasks.

Power Supplies (V): 1.8, 3.3

Support for multiple power supply voltages allows for compatibility with different systems and environments, enhancing versatility.

No. of Terminals: 100

Having a high number of terminals provides more connectivity options, facilitating integration with other components in the system.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style enables easy installation and maintenance, as well as efficient heat dissipation for optimal performance.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures energy efficiency and compatibility with low-power applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows the DSP to operate reliably in harsh environments without overheating.

CPU Family: C28X

The C28X CPU family is known for its high performance and versatility, making it a reliable choice for signal processing tasks.

No. of External Interrupts: 3

Having multiple external interrupts enhances the DSP's responsiveness to external events, improving real-time processing capabilities.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range ensures the DSP can function effectively in cold environments without performance degradation.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides corrosion resistance and reliable electrical connections, ensuring stable performance over time.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure mounting of the DSP onto circuit boards, simplifying assembly processes.

Maximum Seated Height: 1.4 mm

The low maximum seated height allows for compact and space-saving designs, ideal for applications with limited space constraints.

RAM Words: 6144

With a high number of RAM words, the DSP can efficiently store and access data during processing, improving overall performance.

Width: 10 mm

The compact width of the DSP enables easy integration into different systems and devices, enhancing versatility.

Boundary Scan: YES

Boundary scan capability facilitates testing and debugging of the DSP during production and maintenance, ensuring reliable performance.

Maximum Clock Frequency: 100 MHz

The high maximum clock frequency allows for fast and efficient signal processing, meeting the demands of modern applications.

Maximum Time At Peak Reflow Temperature (s): 30

This short time at peak reflow temperature minimizes the risk of thermal damage during soldering, ensuring the reliability of the DSP.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the DSP can withstand the soldering process without any adverse effects on performance.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data transfer efficiency within the DSP, improving overall processing speed and performance.

Length: 10 mm

The compact length of the DSP allows for easy integration into tight spaces, making it suitable for applications with space constraints.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the DSP can operate reliably in rugged industrial environments, meeting industrial standards for performance and durability.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The peripheral IC type indicates that the DSP is specifically designed for signal processing tasks, ensuring optimized performance for digital signal processing applications.

No. of Timers: 10

Having multiple timers enhances the timekeeping and scheduling capabilities of the DSP, improving its ability to manage time-sensitive tasks.

RAM Bytes: 12288

With a high amount of RAM bytes, the DSP can efficiently store and process large amounts of data, enhancing its capabilities for complex signal processing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance, making the DSP energy-efficient and suitable for battery-powered devices.

Terminal Form: BALL

Ball terminal form provides reliable connectivity and ease of installation, ensuring stable electrical connections for optimal performance.

Maximum Supply Current: 230 mA

The moderate maximum supply current allows for efficient power usage and helps prevent overloading of the DSP, ensuring stable operation.

Nominal Supply Voltage: 1.8 V

The standard nominal supply voltage ensures compatibility with common power sources, making it easier to integrate the DSP into various systems.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updating and reprogramming of the DSP's software, enabling flexibility and adaptability in applications.

Terminal Pitch: 0.8 mm

The fine terminal pitch enables high density mounting of the DSP onto circuit boards, saving space and allowing for compact device designs.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and reduces processing time, improving the efficiency and speed of signal processing tasks.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the DSP is moderately sensitive to moisture exposure, requiring standard handling procedures during assembly and storage.

Low Power Mode: YES

The low power mode feature allows the DSP to operate in a power-efficient mode when not performing intensive tasks, maximizing energy savings.

On Chip Program ROM Width: 16

The wide on-chip program ROM width enables the DSP to store and execute complex programs efficiently, enhancing its computational capabilities.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F2801ZGMA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

3

No. of Terminals:

100

No. of Timers:

10

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

12288

RAM Words:

6144

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

230 mA

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

TMS320F2801ZGMA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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