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TMS320F240PQS

Texas Instruments

TMS320F240PQS by Texas Instruments

TMS320F240PQS by Texas Instruments is a 16-bit DSP with 40MHz clock frequency, 5V supply, and 1088 bytes of RAM. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and FLASH ROM programmability.

Median Price

$119.510

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 178 parts In-Stock

1+ parts

$119.510

100+ parts

$112.340

1k+ parts

$105.170

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178

$119.510

$112.340

$105.170

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Distributors (In-Stock)

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Nova Conductors

Japan . 15 parts In-Stock

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$103.100

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$103.100

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Digiode

USA . 4,082 parts In-Stock

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$109.848

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4,082

$109.848

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Vyrian

USA . 7,998 parts In-Stock

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7,998

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Chip Stock

USA . 645 parts In-Stock

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645

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Sunrise Surplus Inc.

USA . 1 parts In-Stock

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1

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Distributors (Availability)

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AZTECH Wire

Italy . 946 parts In-Stock

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$16.490

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$16.490

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Parana Technologies

USA . 1,424 parts In-Stock

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$70.757

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$70.757

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ChromeModa Solutions

Germany . 4,605 parts In-Stock

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$79.502

100+ parts

$65.192

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4,605

$79.502

$65.192

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IDEA Electronic Components Group

UK . 214 parts In-Stock

1+ parts

$79.502

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$75.527

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$71.552

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214

$79.502

$75.527

$71.552

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Ampacity Inc.

Singapore . 149 parts In-Stock

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$98.290

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Corohmni

South Africa . 561 parts In-Stock

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$103.100

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Corphita

USA . 4,756 parts In-Stock

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$104.067

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QUARKTWIN TECHNOLOGY LTD

USA . 18,875 parts In-Stock

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Perfect Parts

USA . 2,240 parts In-Stock

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DigiPath Technology Company

USA . 1,020 parts In-Stock

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$71.679

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Metaverse IC Inc.

Canada . 524 parts In-Stock

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A-Z Elektronik GmbH

Germany . 206 parts In-Stock

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Microchip USA

USA . 190 parts In-Stock

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Overview

Elevate your digital signal processing capabilities with the TMS320F240PQS by Texas Instruments. Designed with precision and expertise, this high-quality DSP offers unparalleled performance in a compact package. Perfect for automotive applications, this innovative technology delivers efficient processing power and reliability that you can trust. Take your projects to the next level with the TMS320F240PQS and experience the value and benefits that only Texas Instruments can provide. Trust in a leader in semiconductor manufacturing to deliver cutting-edge solutions for your digital signal processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly and manufacturing processes.

Maximum Supply Voltage: 5.5 V

Supports a wide range of voltage inputs, ensuring compatibility with different power sources.

Address Bus Width: 16

Wide address bus width allows for efficient data processing and memory access.

Package Shape: SQUARE

Square shape facilitates easier placement on PCBs and saves space in compact designs.

Bit Size: 16

16-bit processing capability provides good balance between performance and power efficiency.

Power Supplies (V): 5

Stable and common power supply voltage for reliable operation.

No. of Terminals: 132

Sufficient number of terminals for connecting various peripheral components.

Package Style (Meter): FLATPACK

Flatpack style ensures easy integration into electronic systems with minimal added height.

Minimum Supply Voltage: 4.5 V

Allows operation within a lower voltage range for energy efficiency.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, suitable for industrial and automotive applications.

CPU Family: TMS320

Part of a well-established and reliable CPU family known for its performance.

ROM Words: 16384

Large ROM capacity for storing program instructions and data.

Maximum Seated Height: 4.57 mm

Low profile design for space-constrained applications.

Width: 24.13 mm

Compact form factor suitable for small electronic devices.

Boundary Scan: YES

Boundary scan feature for efficient testing and debugging during production.

External Data Bus Width: 16

Wide external data bus width for fast data transfer between components.

Maximum Clock Frequency: 40 MHz

High clock frequency for fast signal processing and execution of instructions.

Internal Bus Architecture: MULTIPLE

Multiple internal buses enhance data flow and parallel processing capabilities.

Length: 24.13 mm

Compact length for easy integration into electronic systems.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for durability and reliability.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

A versatile peripheral IC type suitable for various signal processing applications.

RAM Bytes: 1088

Adequate RAM capacity for temporary data storage and processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals provide secure connections and ease of soldering during assembly.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage for consistent performance.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications to the firmware.

Terminal Pitch: 0.635 mm

Fine terminal pitch for compact PCB layout and efficient connectivity.

Format: FIXED POINT

Fixed-point format for efficient numerical calculations and signal processing.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates the level of protection against moisture during storage and operation.

Speed: 20 rpm

Operates at a speed of 20 rotations per minute, suitable for most signal processing tasks.

Low Power Mode: YES

Supports low power mode for energy-efficient operation and extended battery life.

Barrel Shifter: YES

Barrel shifter functionality for efficient bit manipulation and data processing.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F240PQS attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

16

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G132

JESD-609 Code:

e4

Length:

24.13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

132

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

SPQFP132,1.1SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

1088

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

4.57 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.13 mm

Peripheral IC Type:

Trade Compliance

TMS320F240PQS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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