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TMS320DM643AZNZA5

Texas Instruments

TMS320DM643AZNZA5 by Texas Instruments

TMS320DM643AZNZA5 by Texas Instruments is a 32-bit DSP with 20-bit address bus, 64-bit external data bus, and max clock frequency of 100 MHz. Ideal for digital signal processing applications requiring low power mode, it features a package style of grid array and operates b/w -40 to +90°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,794 parts In-Stock

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Digiode

USA . 2,536 parts In-Stock

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2,536

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Distributors (Availability)

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One Stop Electronics

USA . 1,489 parts In-Stock

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$6.000

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1,489

$6.000

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AZTECH Wire

Italy . 812 parts In-Stock

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$18.791

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Parana Technologies

USA . 1,936 parts In-Stock

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$42.656

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$42.656

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DigiPath Technology Company

USA . 644 parts In-Stock

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$46.969

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$43.212

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644

$46.969

$43.212

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IDEA Electronic Components Group

UK . 2,278 parts In-Stock

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$47.928

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$45.532

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$43.135

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2,278

$47.928

$45.532

$43.135

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ChromeModa Solutions

Germany . 581 parts In-Stock

1+ parts

$47.928

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$39.301

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581

$47.928

$39.301

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Corohmni

South Africa . 7 parts In-Stock

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$64.346

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Microchip USA

USA . 1,512 parts In-Stock

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Corphita

USA . 520 parts In-Stock

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Overview

Experience the power of cutting-edge technology with the TMS320DM643AZNZA5 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers top-notch quality and reliability. This versatile DSP is perfect for a wide range of applications, offering unmatched performance and efficiency. Unlock new possibilities and elevate your projects with the TMS320DM643AZNZA5, providing exceptional value and benefits to customers looking for high-quality solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the DSP, making it suitable for various operating environments.

Surface Mount: YES

Surface mount capability enables easy and efficient installation of the DSP onto circuit boards, saving time and effort.

Maximum Supply Voltage: 1.26 V

Efficient power management with a low maximum supply voltage helps in reducing power consumption and extending the lifespan of the DSP.

Address Bus Width: 20

A wide address bus width of 20 facilitates faster data transmission and processing, enhancing the overall performance of the DSP.

Bit Size: 32

A 32-bit architecture allows for high-speed arithmetic and logic operations, boosting the processing capabilities of the DSP.

No. of Terminals: 548

Having a large number of terminals enables versatile connectivity options and integration with other components, making the DSP versatile for different applications.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature of 90°C ensures reliable performance even in challenging environmental conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The specific type of peripheral IC makes this DSP suitable for processing digital signals efficiently and accurately, meeting the requirements of various applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM643AZNZA5 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B548

JESD-609 Code:

e1

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

548

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA548,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS320DM643AZNZA5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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