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TMS320DM642AGDK6

Texas Instruments

TMS320DM642AGDK6 by Texas Instruments

TMS320DM642AGDK6 by Texas Instruments is a 32-bit DSP with integrated cache, 64-bit external data bus width, and max clock frequency of 75.19 MHz. Ideal for digital signal processing applications requiring low power mode, it features multiple internal bus architecture and boundary scan capability.

Median Price

$75.724

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,220 parts In-Stock

1+ parts

$75.724

100+ parts

$67.310

1k+ parts

$49.493

10k+ parts

-

1,220

$75.724

$67.310

$49.493

-

Rochester

USA . 25,962 parts In-Stock

1+ parts

-

100+ parts

$71.160

1k+ parts

$63.670

10k+ parts

$59.920

25,962

-

$71.160

$63.670

$59.920

DigiKey

USA . 25,962 parts In-Stock

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25,962

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Verical

USA . 19,592 parts In-Stock

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-

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$88.950

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$79.588

10k+ parts

$74.900

19,592

-

$88.950

$79.588

$74.900

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$55.720

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-

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500

$55.720

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DigiKey Marketplace

USA . 26,062 parts In-Stock

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$65.000

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26,062

$65.000

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Digiode

USA . 4,817 parts In-Stock

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$65.303

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$65.303

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Vyrian

USA . 2,102 parts In-Stock

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Cyclops Electronics Ltd

UK . 144 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 701 parts In-Stock

1+ parts

$20.580

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701

$20.580

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Corohmni

South Africa . 958 parts In-Stock

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$50.890

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$50.890

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Ampacity Inc.

Singapore . 13,275 parts In-Stock

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$58.430

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13,275

$58.430

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Parana Technologies

USA . 206 parts In-Stock

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$61.705

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$61.705

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Corphita

USA . 89 parts In-Stock

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$61.866

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$61.866

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DigiPath Technology Company

USA . 1,465 parts In-Stock

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$67.945

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$67.945

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ChromeModa Solutions

Germany . 5,762 parts In-Stock

1+ parts

$69.332

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$56.852

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5,762

$69.332

$56.852

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IDEA Electronic Components Group

UK . 1,242 parts In-Stock

1+ parts

$69.332

100+ parts

$65.865

1k+ parts

$62.399

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1,242

$69.332

$65.865

$62.399

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Assy Fe

Spain . 2,013 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Kepictronics

USA . 85 parts In-Stock

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

UK . 25 parts In-Stock

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Overview

Unlock the power of digital signal processing with the TMS320DM642AGDK6 by Texas Instruments. Designed with precision and reliability, this DSP offers unparalleled performance in a variety of applications. From audio and video processing to telecommunications and industrial automation, this cutting-edge technology delivers superior results. With integrated cache and multiple power supplies, this product ensures optimal efficiency and seamless operation. Experience the difference that Texas Instruments brings to the table with the TMS320DM642AGDK6 - where quality meets innovation for ultimate customer satisfaction.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY packaging provides durability and protection to the DSP, ensuring a longer lifespan and reliable performance.

Integrated Cache: YES

Having an integrated cache improves the processing speed and efficiency of the DSP, making it suitable for handling complex signal processing tasks.

Surface Mount: YES

Surface mount capability makes the DSP easy to install and allows for compact and space-saving designs in electronic devices.

Maximum Supply Voltage: 1.44 V

Operating at a maximum supply voltage of 1.44 V ensures energy efficiency and low power consumption, making it ideal for portable or battery-powered devices.

Address Bus Width: 23

With a wide address bus width of 23, the DSP can efficiently handle large amounts of data and memory address locations.

Package Shape: SQUARE

The square package shape helps in efficient placement on circuit boards, optimizing space utilization and ease of PCB layout.

Bit Size: 32

Operating at a bit size of 32 allows the DSP to process data and perform calculations with higher precision and accuracy.

Power Supplies (V): 1.4,3.3

Support for multiple power supplies (1.4V, 3.3V) offers flexibility in voltage requirements and compatibility with different power sources.

No. of Terminals: 548

The high number of terminals provides ample connectivity options for interfacing with other components, peripherals, and external devices.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array fine pitch package style enhances signal transmission and reliability, making the DSP suitable for high-frequency applications.

Minimum Supply Voltage: 1.36 V

Operating at a minimum supply voltage of 1.36 V ensures stable performance even under low power conditions, enhancing the overall efficiency of the DSP.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature of 90°C, the DSP can withstand harsh environmental conditions and maintain performance in challenging thermal environments.

No. of External Interrupts: 4

Support for 4 external interrupts allows the DSP to respond quickly to external events or signals, improving responsiveness and real-time processing capabilities.

Minimum Operating Temperature: 0 °C

Operating at a minimum temperature of 0°C ensures reliable performance even in cold environments, making the DSP suitable for a wide range of applications.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good solderability and reliability during assembly, ensuring a secure connection and long-term stability.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB mounting and soldering, simplifying the manufacturing process and ensuring consistent electrical connections.

Maximum Seated Height: 2.8 mm

With a maximum seated height of 2.8 mm, the DSP can be integrated into slim and compact devices without compromising on performance or functionality.

RAM Words: 16384

Having 16384 RAM words provides ample memory capacity for storing data and program instructions, enabling efficient multitasking and data processing.

Width: 23 mm

With a width of 23 mm, the DSP offers a compact form factor that is suitable for space-constrained applications or embedded systems.

Boundary Scan: YES

Boundary scan capability allows for efficient testing, debugging, and programming of the DSP, ensuring seamless integration into the overall system design.

External Data Bus Width: 64

A wide external data bus width of 64 enables faster data transfer and processing speeds, making the DSP suitable for high-performance applications.

Maximum Clock Frequency: 75.19 MHz

Operating at a maximum clock frequency of 75.19 MHz allows the DSP to handle real-time computations and signal processing tasks with high speed and accuracy.

Peak Reflow Temperature °C: 220

With a peak reflow temperature of 220°C, the DSP can withstand high-temperature soldering processes during manufacturing, ensuring reliable solder joints and assembly.

Internal Bus Architecture: MULTIPLE

Having a multiple internal bus architecture enables efficient data routing and communication within the DSP, enhancing overall processing performance and speed.

Length: 23 mm

With a length of 23 mm, the DSP maintains a compact and balanced form factor that is ideal for integration into a variety of electronic devices and systems.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor with additional peripheral IC functionalities expands the capabilities of the DSP, allowing for versatile signal processing and interfacing options.

No. of Timers: 3

Having 3 built-in timers enhances the timekeeping and synchronization capabilities of the DSP, enabling precise timing control in various applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption, high-speed operation, and reliable performance, making the DSP suitable for a wide range of battery-powered or energy-efficient applications.

Terminal Form: BALL

Ball terminal form simplifies the mounting and soldering process, providing a reliable and robust connection for integrating the DSP into electronic assemblies.

Nominal Supply Voltage: 1.4 V

Operating at a nominal supply voltage of 1.4 V ensures consistent and stable performance, optimizing power efficiency and reducing the risk of voltage fluctuations.

No. of DMA Channels: 64

Support for 64 DMA channels enables efficient data transfer and communication between peripherals and memory, improving overall system performance and data handling capabilities.

Terminal Pitch: 0.8 mm

Having a terminal pitch of 0.8 mm allows for precise and compact soldering connections, facilitating assembly and ensuring reliable electrical connections in the DSP.

Format: FIXED POINT

Operating in fixed-point format simplifies arithmetic operations and enhances numerical accuracy, making the DSP suitable for precise signal processing and computations.

Moisture Sensitivity Level (MSL): 4

Being rated at MSL 4 indicates that the DSP is less sensitive to moisture during storage and handling, ensuring component reliability and longevity.

Low Power Mode: YES

Support for low power mode enhances energy efficiency and extends battery life in power-constrained applications, making the DSP a sustainable and cost-effective choice.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM642AGDK6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.19 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B548

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

548

No. of Timers:

3

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA548,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.44 V

Minimum Supply Voltage:

1.36 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320DM642AGDK6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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