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TMS320DM641AZNZ6

Texas Instruments

TMS320DM641AZNZ6 by Texas Instruments

TMS320DM641AZNZ6 by Texas Instruments is a 32-bit DSP with integrated cache, operating at 75 MHz. With 23-bit address bus width and 32-bit external data bus width, it's ideal for digital signal processing applications. This CMOS technology device features low power mode and boundary scan capability.

Median Price

$49.090

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 660 parts In-Stock

1+ parts

$49.090

100+ parts

$43.636

1k+ parts

$32.085

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660

$49.090

$43.636

$32.085

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 160 parts In-Stock

1+ parts

$44.141

100+ parts

$36.196

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-

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160

$44.141

$36.196

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Digiode

USA . 4,863 parts In-Stock

1+ parts

$46.636

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4,863

$46.636

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Vyrian

USA . 8,094 parts In-Stock

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8,094

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Dan-Mar Components

USA . 160 parts In-Stock

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160

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TME

Poland . 40 parts In-Stock

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$54.702

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40

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$54.702

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,187 parts In-Stock

1+ parts

$12.110

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$12.110

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Corohmni

South Africa . 11 parts In-Stock

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$20.001

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11

$20.001

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Parana Technologies

USA . 529 parts In-Stock

1+ parts

$28.813

100+ parts

-

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$52.164

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529

$28.813

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$52.164

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DigiPath Technology Company

USA . 1,489 parts In-Stock

1+ parts

$31.727

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1,489

$31.727

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ChromeModa Solutions

Germany . 5,174 parts In-Stock

1+ parts

$32.374

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$26.547

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5,174

$32.374

$26.547

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IDEA Electronic Components Group

UK . 1,130 parts In-Stock

1+ parts

$32.374

100+ parts

$30.755

1k+ parts

$29.137

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1,130

$32.374

$30.755

$29.137

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Corphita

USA . 2,942 parts In-Stock

1+ parts

$44.181

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2,942

$44.181

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Microchip USA

USA . 493 parts In-Stock

1+ parts

$152.080

100+ parts

$150.760

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$150.760

10k+ parts

$149.440

493

$152.080

$150.760

$150.760

$149.440

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Overview

Unlock the power of cutting-edge digital signal processing with the TMS320DM641AZNZ6 by Texas Instruments. Designed for high performance and reliability, this DSP offers seamless integration, advanced cache capabilities, and a wide range of applications in industries such as telecommunications, automotive, and consumer electronics. Trust in Texas Instruments' reputation for quality and innovation to deliver unmatched value, efficiency, and functionality to meet your project needs. Experience the difference with the TMS320DM641AZNZ6 and elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ideal for portable or handheld devices.

Integrated Cache: YES

Having an integrated cache helps in improving the overall performance of the digital signal processor by reducing the time taken to access data and instructions, making it more efficient.

Maximum Supply Voltage: 1.44 V

The high maximum supply voltage of 1.44V allows for flexibility in powering the digital signal processor, accommodating a wide range of voltage inputs.

Surface Mount: YES

Being surface mountable simplifies the installation process of the digital signal processor onto the circuit board, saving time and effort in assembly.

Address Bus Width: 23

Having a wider address bus width of 23 allows the processor to access a larger memory space efficiently, enhancing its capability to handle complex computations and data processing tasks.

Bit Size: 32

With a bit size of 32, the digital signal processor can handle larger chunks of data at once, enabling faster processing speeds and improved performance.

Power Supplies (V): 1.4, 3.3

Supporting multiple power supply voltages of 1.4V and 3.3V offers versatility in powering options, making the digital signal processor compatible with various systems and applications.

No. of Terminals: 548

Having a high number of terminals provides ample connectivity options for interfacing with other components or peripherals, allowing for versatile integration in different system designs.

Package Style (Meter): GRID ARRAY

The grid array package style ensures a secure and reliable connection between the digital signal processor and the circuit board, reducing the risk of signal interruptions or physical damage.

Minimum Supply Voltage: 1.36 V

The low minimum supply voltage requirement of 1.36V ensures efficient power consumption, making the digital signal processor suitable for energy-efficient devices or battery-powered applications.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature of 90°C allows for reliable performance in elevated temperature environments, making the digital signal processor suitable for industrial or automotive applications.

No. of External Interrupts: 4

Having multiple external interrupts enables the processor to respond quickly to external events or signals, enhancing its real-time processing capabilities and responsiveness.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures functionality in cold environments, making the digital signal processor suitable for a wide range of operating conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides a reliable and durable connection between the processor and the circuit board, ensuring long-term performance and stability.

RAM Words: 16384

The large RAM capacity of 16384 words allows the digital signal processor to store a significant amount of data and instructions, facilitating complex calculations and processing tasks.

Width: 27 mm

The compact width of 27mm makes the digital signal processor suitable for space-constrained applications or devices, offering a compact and efficient design solution.

Boundary Scan: YES

Having boundary scan capability allows for easy testing and debugging of the processor, simplifying the validation and verification process during development or production.

External Data Bus Width: 32

The wide external data bus width of 32 allows for high-speed data transfer between the processor and external memory or peripherals, enhancing overall system performance.

Maximum Clock Frequency: 75 MHz

The high maximum clock frequency of 75MHz enables the digital signal processor to handle demanding computational tasks and real-time processing, delivering fast and efficient performance.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds ensures reliable soldering during assembly, reducing the risk of thermal damage to the processor.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the processor can withstand the soldering process without compromising its performance or reliability, ensuring a secure and durable connection to the board.

Internal Bus Architecture: MULTIPLE

The use of multiple internal bus architecture enhances data processing efficiency and bandwidth within the processor, allowing for parallel operations and faster computations.

Length: 27 mm

The compact length of 27mm contributes to the overall compact form factor of the digital signal processor, making it suitable for integration into various device designs or applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The digital signal processor with additional peripheral IC types offers expanded functionality and connectivity options, making it versatile for diverse applications requiring specialized features.

No. of Timers: 3

Having multiple timers allows the processor to manage time-sensitive tasks or events efficiently, enabling precise control and synchronization within the system.

Technology: CMOS

The CMOS technology used in the digital signal processor provides low power consumption, high noise immunity, and compatibility with a wide range of voltages, making it an energy-efficient and reliable choice.

Terminal Form: BALL

The terminal form of ball provides a secure and robust connection between the processor and the circuit board, ensuring reliable signal transmission and long-term performance.

Nominal Supply Voltage: 1.4 V

The nominal supply voltage of 1.4V offers stable and consistent power delivery to the processor, ensuring reliable operation and optimal performance in various operating conditions.

No. of DMA Channels: 64

Having a high number of DMA channels allows for efficient data transfer and processing between memory and peripherals, optimizing system performance and reducing CPU workload.

Terminal Pitch: 1 mm

The small terminal pitch of 1mm facilitates dense packing and high-density integration of the processor onto the circuit board, maximizing space utilization and enabling compact device designs.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and enhances computational efficiency in the digital signal processor, making it suitable for applications requiring precise and fast numerical calculations.

Moisture Sensitivity Level (MSL): 4

The moisture sensitivity level of 4 indicates that the processor has a low sensitivity to moisture, reducing the risk of damage during storage, handling, or reflow soldering processes.

Low Power Mode: YES

The availability of a low power mode allows the processor to operate in a power-efficient state when full performance is not required, enabling energy savings and prolonging battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM641AZNZ6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B548

JESD-609 Code:

e1

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

548

No. of Timers:

3

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA548,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.44 V

Minimum Supply Voltage:

1.36 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS320DM641AZNZ6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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