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TMS320C6748BZCEA3E

Texas Instruments

TMS320C6748BZCEA3E by Texas Instruments

TMS320C6748BZCEA3E by Texas Instruments is a 32-bit DSP with 23-bit address bus, operating at max 50 MHz. Ideal for industrial applications, it features low power mode, floating point format, and boundary scan capability. With a package style of grid array and terminal pitch of 0.65mm, it offers high performance in a compact design.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,815 parts In-Stock

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Digiode

USA . 1,871 parts In-Stock

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Chip Stock

USA . 165 parts In-Stock

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165

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Inventory MP

USA . 21 parts In-Stock

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Bristol Electronics

USA . 21 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 264 parts In-Stock

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$13.317

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One Stop Electronics

USA . 677 parts In-Stock

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$34.000

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Parana Technologies

USA . 1,261 parts In-Stock

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$68.427

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Corohmni

South Africa . 1,039 parts In-Stock

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$70.589

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DigiPath Technology Company

USA . 2,129 parts In-Stock

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$75.346

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$69.319

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ChromeModa Solutions

Germany . 5,832 parts In-Stock

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$76.884

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$63.045

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IDEA Electronic Components Group

UK . 285 parts In-Stock

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$76.884

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$73.040

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$69.196

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Component Stockers USA

USA . 328 parts In-Stock

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$99.990

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Corphita

USA . 2,163 parts In-Stock

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Overview

Elevate your digital signal processing capabilities with the TMS320C6748BZCEA3E by Texas Instruments. Manufactured with precision and quality in mind, this DSP offers unmatched performance and reliability for a variety of applications. From audio processing to telecommunications, this product provides value, benefits, and advantages that are sure to meet and exceed your expectations. Experience cutting-edge technology at your fingertips with the TMS320C6748BZCEA3E – the ultimate solution for all your DSP needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material helps in reducing the overall weight of the product, making it more portable and easier to handle.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product onto circuit boards, reducing production time and costs.

Maximum Supply Voltage: 1.35 V

Operating at a maximum supply voltage of 1.35 V ensures energy efficiency and reduces power consumption.

Address Bus Width: 23

A wider address bus width allows for higher memory addressing capabilities, enabling the processor to handle more complex tasks efficiently.

Package Shape: SQUARE

Square package shape allows for efficient use of space on circuit boards, optimizing the layout and design of the overall system.

Bit Size: 32

A larger bit size of 32 allows for higher precision and accuracy in processing digital signals, resulting in better performance.

Power Supplies (V): 1.2,1.8,3.3

Multiple power supply options provide flexibility in designing and operating the product in different scenarios and power conditions.

No. of Terminals: 361

Having a large number of terminals allows for more connectivity options and interfaces, increasing the versatility of the product.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style of grid array, low profile, and fine pitch enhances the product's reliability, thermal performance, and ease of soldering respectively.

Minimum Supply Voltage: 0.95 V

Operating at a low minimum supply voltage of 0.95 V ensures energy efficiency and prolongs the battery life of portable devices.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, the product can withstand harsh environmental conditions and maintain stability during operation.

Minimum Operating Temperature: -40 °C

The ability to operate at a minimum temperature of -40°C allows the product to function reliably in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides corrosion resistance, good conductivity, and solderability, ensuring long-term reliability of the connections.

Terminal Position: BOTTOM

Bottom terminal position simplifies the assembly process by allowing for easy access to terminals during soldering and inspection.

Maximum Seated Height: 1.3 mm

Low maximum seated height of 1.3 mm enables a compact and slim design for the product, saving space in the overall system layout.

RAM Words: 8192

With a large RAM capacity of 8192 words, the processor can store and access more data quickly, improving overall performance and multitasking capabilities.

Width: 13 mm

A width of 13 mm allows for easy integration of the product into compact electronic devices and systems with limited space.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the product during manufacturing and maintenance, ensuring high quality and reliability.

External Data Bus Width: 16

Having an external data bus width of 16 enhances data transfer speed between the processor and external devices, enabling faster processing of information.

Maximum Clock Frequency: 50 MHz

Operating at a maximum clock frequency of 50 MHz allows the processor to handle high-speed operations and real-time processing tasks effectively.

Maximum Time At Peak Reflow Temperature (s): 30

The product can withstand peak reflow temperature for up to 30 seconds, ensuring reliable soldering and assembly during manufacturing.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the product can endure high-temperature soldering processes without any damage.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data throughput and parallel processing capabilities, improving overall performance and efficiency.

Length: 13 mm

A length of 13 mm provides a compact form factor for the product, making it suitable for applications where space is limited.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade temperature range, the product can operate reliably in harsh environments and demanding conditions with consistent performance.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Equipped with digital signal processor and other peripherals, the product can handle diverse signal processing tasks efficiently and with high accuracy.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the product energy-efficient and reliable for various applications.

Terminal Form: BALL

Ball terminal form provides secure connections and facilitates easy soldering during assembly, ensuring robust electrical contacts and reliable performance.

Nominal Supply Voltage: 1 V

Operating within a nominal supply voltage of 1 V optimizes power efficiency and performance of the product for different applications and power conditions.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65 mm allows for high-density mounting of the product on circuit boards, maximizing space utilization and reducing overall system footprint.

Format: FLOATING POINT

Utilizing floating-point format enhances computational accuracy and precision in handling complex mathematical operations, making the product suitable for scientific and data processing tasks.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the product can withstand moderate exposure to moisture during handling and storage, ensuring long-term reliability.

Low Power Mode: YES

Incorporating a low power mode option allows the product to operate in energy-saving mode when not performing intensive tasks, prolonging battery life and reducing power consumption.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6748BZCEA3E attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

TMS320C6748BZCEA3E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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