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TMS320C6747BZKB3

Texas Instruments

TMS320C6747BZKB3 by Texas Instruments

TMS320C6747BZKB3 by Texas Instruments is a 32-bit DSP with 16-bit address and data bus width, operating at max 30 MHz. It features low power mode, boundary scan, and internal multiple bus architecture. Ideal for digital signal processing applications requiring high-speed computation in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,287 parts In-Stock

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3,287

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Digiode

USA . 2,631 parts In-Stock

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Inventory MP

USA . 21 parts In-Stock

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Bristol Electronics

USA . 21 parts In-Stock

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Speed Components Ltd

Israel . 10 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,479 parts In-Stock

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$13.000

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$13.000

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AZTECH Wire

Italy . 406 parts In-Stock

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$14.789

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Parana Technologies

USA . 501 parts In-Stock

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$35.563

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$35.563

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DigiPath Technology Company

USA . 451 parts In-Stock

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$39.159

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$36.026

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$39.159

$36.026

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ChromeModa Solutions

Germany . 5,720 parts In-Stock

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$39.958

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$32.766

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$39.958

$32.766

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IDEA Electronic Components Group

UK . 362 parts In-Stock

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$39.958

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$37.960

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$35.962

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362

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$35.962

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Corohmni

South Africa . 64 parts In-Stock

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$75.752

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QUARKTWIN TECHNOLOGY LTD

USA . 17,740 parts In-Stock

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Metaverse IC Inc.

Canada . 8,000 parts In-Stock

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Corphita

USA . 4,294 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Microchip USA

USA . 3,089 parts In-Stock

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GreenTree Electronics

Israel . 540 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the TMS320C6747BZKB3 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers unparalleled quality and reliability. This versatile DSP offers a wide range of applications, providing customers with exceptional value and performance. Experience the benefits of superior processing power, efficiency, and flexibility for your next project. Trust Texas Instruments to elevate your innovations to new heights with the TMS320C6747BZKB3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the DSP, ensuring a longer lifespan.

Surface Mount: YES

Enables easy and efficient assembly onto circuit boards, saving time and effort during production.

Maximum Supply Voltage: 1.32 V

Allows for reliable and stable operation within the specified voltage range.

Address Bus Width: 16

Provides a sufficient address bus width for handling data efficiently.

Package Shape: SQUARE

Facilitates a compact design for space-saving integration into electronic devices.

Bit Size: 32

Offers high processing capability and accuracy for advanced digital signal processing tasks.

Power Supplies (V): 1.2,1.8,3.3

Supports multiple power supply options for flexibility in different application scenarios.

No. of Terminals: 256

Generous number of terminals for connectivity and interfacing with external components.

Package Style (Meter): GRID ARRAY

Ensures secure and reliable connections between the DSP and the circuit board.

Minimum Supply Voltage: 1.14 V

Maintains operational stability even at lower voltage levels.

Maximum Operating Temperature: 90 °C

Can withstand high temperatures, suitable for demanding industrial environments.

Minimum Operating Temperature: 0 °C

Operates effectively even in low-temperature conditions, enhancing versatility.

Terminal Finish: TIN SILVER COPPER

Ensures reliable contact and signal transmission between the DSP and external components.

Terminal Position: BOTTOM

Facilitates easy and secure mounting onto the circuit board.

Maximum Seated Height: 2.05 mm

Low profile design for compact and space-efficient installations.

RAM Words: 8192

An ample amount of RAM for storing and processing data efficiently.

Width: 17 mm

Compact and slim form factor for ease of integration into various electronic devices.

Boundary Scan: YES

Enables efficient testing and debugging of the DSP during production and maintenance.

External Data Bus Width: 16

Matches the address bus width for streamlined data processing and communication.

Maximum Clock Frequency: 30 MHz

High clock frequency for rapid data processing and real-time signal manipulation.

Maximum Time At Peak Reflow Temperature (s): 30

Optimizes the reflow process during assembly for consistent and reliable soldering.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures without compromising performance or reliability.

Internal Bus Architecture: MULTIPLE

Enhances data throughput and processing efficiency with parallel internal buses.

Length: 17 mm

Symmetrical dimensions for easy alignment and placement on the circuit board.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral options for interfacing with a wide range of external devices and sensors.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation.

Terminal Form: BALL

Ball terminals for reliable and secure connections with the circuit board and other components.

Nominal Supply Voltage: 1.2 V

Standard nominal supply voltage for compatibility with various power sources.

Terminal Pitch: 1 mm

Optimal terminal pitch for ease of soldering and connection to the circuit board.

Format: FLOATING POINT

Supports floating-point arithmetic for high precision calculations in signal processing algorithms.

Moisture Sensitivity Level (MSL): 3

Suitable for use in environments with moderate exposure to moisture, ensuring reliability.

Low Power Mode: YES

Includes a low power mode for energy efficiency and extended battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6747BZKB3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

16

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

2.05 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

TMS320C6747BZKB3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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