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TMS320C6746EZWTA3

Texas Instruments

TMS320C6746EZWTA3 by Texas Instruments

TMS320C6746EZWTA3 by Texas Instruments is a DSP with 1.05V max supply voltage, 30MHz clock frequency, and 327680 RAM words. Ideal for industrial applications requiring high-speed processing, it features an integrated cache, 23-bit address bus width, and low power mode for efficient performance.

Median Price

$18.029

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 730 parts In-Stock

1+ parts

$13.688

100+ parts

$11.957

1k+ parts

$8.246

10k+ parts

-

730

$13.688

$11.957

$8.246

-

DigiKey

USA . 194 parts In-Stock

1+ parts

$22.370

100+ parts

$15.659

1k+ parts

$14.613

10k+ parts

-

194

$22.370

$15.659

$14.613

-

Mouser Electronics

USA . 50 parts In-Stock

1+ parts

$22.370

100+ parts

$15.190

1k+ parts

$14.420

10k+ parts

-

50

$22.370

$15.190

$14.420

-

Chip1Stop

Japan . 90 parts In-Stock

1+ parts

-

100+ parts

$13.167

1k+ parts

-

10k+ parts

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90

-

$13.167

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,594 parts In-Stock

1+ parts

$13.004

100+ parts

-

1k+ parts

-

10k+ parts

-

1,594

$13.004

-

-

-

Vyrian

USA . 8,849 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,849

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,110 parts In-Stock

1+ parts

$12.319

100+ parts

-

1k+ parts

-

10k+ parts

-

3,110

$12.319

-

-

-

Corohmni

South Africa . 759 parts In-Stock

1+ parts

$13.890

100+ parts

-

1k+ parts

-

10k+ parts

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759

$13.890

-

-

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Parana Technologies

USA . 624 parts In-Stock

1+ parts

$37.785

100+ parts

-

1k+ parts

-

10k+ parts

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624

$37.785

-

-

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DigiPath Technology Company

USA . 1,340 parts In-Stock

1+ parts

$41.606

100+ parts

-

1k+ parts

-

10k+ parts

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1,340

$41.606

-

-

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ChromeModa Solutions

Germany . 4,999 parts In-Stock

1+ parts

$42.455

100+ parts

$34.813

1k+ parts

-

10k+ parts

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4,999

$42.455

$34.813

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-

IDEA Electronic Components Group

UK . 188 parts In-Stock

1+ parts

$42.455

100+ parts

$40.332

1k+ parts

$38.210

10k+ parts

-

188

$42.455

$40.332

$38.210

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Microchip USA

USA . 1,462 parts In-Stock

1+ parts

$50.904

100+ parts

-

1k+ parts

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10k+ parts

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1,462

$50.904

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Perfect Parts

USA . 605 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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605

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Kepictronics

USA . 280 parts In-Stock

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100+ parts

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280

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Overview

Unlock the power of cutting-edge technology with the TMS320C6746EZWTA3 by Texas Instruments, a top-quality Digital Signal Processor that offers unmatched performance and reliability. Whether you're in need of efficient data processing, high-speed calculations, or advanced multimedia applications, this DSP is the perfect solution for your project. With a wide range of features and benefits, including integrated cache, low power mode, and boundary scan capability, this product provides exceptional value and versatility. Trust Texas Instruments to deliver superior quality and innovation in every component, making the TMS320C6746EZWTA3 the ideal choice for your next digital signal processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Integrated Cache: YES

Having integrated cache helps in improving the speed and efficiency of data processing.

Surface Mount: YES

Being surface mountable makes it easy to integrate into various electronic devices.

Maximum Supply Voltage: 1.05 V

Operates efficiently with a maximum supply voltage of 1.05V.

On Chip Data RAM Width: 8

The width of on-chip data RAM at 8 enhances data storage capacity and processing speed.

Address Bus Width: 23

With a wide address bus width of 23, it can handle large memory address ranges effectively.

Package Shape: SQUARE

The square package shape provides a compact form factor for easier integration and space-saving.

No. of Terminals: 361

Having 361 terminals increases connectivity options and versatility in application.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style of grid array, low profile, and fine pitch allows for high component density and efficient heat dissipation.

Minimum Supply Voltage: 0.95 V

Can operate efficiently at a minimum supply voltage of 0.95V, saving energy.

Maximum Operating Temperature: 105 °C

Can withstand high operating temperatures up to 105°C for reliable performance in various environments.

Minimum Operating Temperature: -40 °C

Capable of operating at cold temperatures as low as -40°C, suitable for diverse working conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper ensures good conductivity and durability for long-term use.

Terminal Position: BOTTOM

With terminals positioned at the bottom, it allows for easier soldering and connection with other components.

Maximum Seated Height: 1.4 mm

Low seated height of 1.4mm makes it suitable for slim and compact electronic devices.

RAM Words: 327680

With a large RAM word capacity of 327680, it can store and process a significant amount of data efficiently.

Width: 16 mm

Having a width of 16mm provides a balance between compactness and component space for installation.

Boundary Scan: YES

Supports boundary scan technology for easier testing and debugging of the device during production.

External Data Bus Width: 16

An external data bus width of 16 enhances data transfer speed between the processor and external devices.

Maximum Clock Frequency: 30 MHz

Capable of operating at a clock frequency of 30 MHz for fast signal processing.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for up to 30 seconds during manufacturing processes.

Peak Reflow Temperature °C: 260

Can handle peak reflow temperatures of 260°C, ensuring proper soldering during assembly.

Internal Bus Architecture: SINGLE

The single internal bus architecture simplifies data transfer within the processor, enhancing efficiency.

Length: 16 mm

With a length of 16mm, it maintains a compact size for easy integration into various electronic systems.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, making it suitable for harsh operating environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor with other peripheral IC types adds versatility and functionality to the device.

No. of Timers: 8

The availability of 8 timers allows for precise timing functions in various applications.

Technology: CMOS

Using CMOS technology ensures low power consumption and high-speed performance.

Terminal Form: BALL

Having terminal form as balls ensures reliable connections with solder joints.

Nominal Supply Voltage: 1 V

Operates efficiently at a nominal supply voltage of 1V, enhancing power efficiency.

No. of DMA Channels: 80

With 80 DMA channels, it allows for efficient data transfer between memory and peripherals.

Terminal Pitch: 0.8 mm

The terminal pitch of 0.8mm facilitates precise soldering and compact layout design.

Format: FLOATING POINT

Supports floating-point format for accurate mathematical computations and signal processing.

Moisture Sensitivity Level (MSL): 3

With moisture sensitivity level 3, it can withstand moderate humidity levels during operation.

Low Power Mode: YES

Having a low power mode option helps in reducing power consumption when processing load is low.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6746EZWTA3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPEARTES AT 1.1V AND 1.2V SUPLLY

Address Bus Width:

23

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

80

No. of Terminals:

361

No. of Timers:

8

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

327680

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320C6746EZWTA3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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