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TMS320C6743DZKBT3

Texas Instruments

TMS320C6743DZKBT3 by Texas Instruments

TMS320C6743DZKBT3 by Texas Instruments is a 32-bit DSP with integrated cache, 13-bit address bus width, and 16-bit external data bus width. Widely used in automotive applications for digital signal processing tasks due to its low power mode, max clock frequency of 30 MHz, and boundary scan capability.

Median Price

$19.056

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 741 parts In-Stock

1+ parts

$14.701

100+ parts

$12.841

1k+ parts

$8.856

10k+ parts

-

741

$14.701

$12.841

$8.856

-

Mouser Electronics

USA . 4 parts In-Stock

1+ parts

$23.410

100+ parts

$14.970

1k+ parts

$14.440

10k+ parts

-

4

$23.410

$14.970

$14.440

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,620 parts In-Stock

1+ parts

$13.966

100+ parts

-

1k+ parts

-

10k+ parts

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4,620

$13.966

-

-

-

Vyrian

USA . 8,412 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,412

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,199 parts In-Stock

1+ parts

$13.231

100+ parts

-

1k+ parts

-

10k+ parts

-

2,199

$13.231

-

-

-

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$26.988

100+ parts

$24.559

1k+ parts

$22.130

10k+ parts

-

2,500

$26.988

$24.559

$22.130

-

Parana Technologies

USA . 2,335 parts In-Stock

1+ parts

$51.648

100+ parts

-

1k+ parts

-

10k+ parts

-

2,335

$51.648

-

-

-

DigiPath Technology Company

USA . 784 parts In-Stock

1+ parts

$56.871

100+ parts

$52.322

1k+ parts

-

10k+ parts

-

784

$56.871

$52.322

-

-

IDEA Electronic Components Group

UK . 1,939 parts In-Stock

1+ parts

$58.032

100+ parts

$55.130

1k+ parts

$52.229

10k+ parts

-

1,939

$58.032

$55.130

$52.229

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ChromeModa Solutions

Germany . 264 parts In-Stock

1+ parts

$58.032

100+ parts

$47.586

1k+ parts

-

10k+ parts

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264

$58.032

$47.586

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-

Corohmni

South Africa . 2,881 parts In-Stock

1+ parts

$84.254

100+ parts

-

1k+ parts

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10k+ parts

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2,881

$84.254

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-

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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2,000

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Futuretech Components

Singapore . 90 parts In-Stock

1+ parts

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90

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Kepictronics

USA . 90 parts In-Stock

1+ parts

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90

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Overview

Unlock the power of cutting-edge technology with the TMS320C6743DZKBT3 by Texas Instruments. This top-of-the-line Digital Signal Processor offers unparalleled performance and reliability, thanks to its high-quality design and innovative features. Ideal for a wide range of applications, this DSP ensures fast and efficient processing, making it the perfect choice for customers seeking value and superior functionality. Experience the advantages of Texas Instruments' expertise in semiconductor manufacturing with the TMS320C6743DZKBT3 - a game-changer in the world of digital signal processing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers durability and protection, making the product suitable for various environments.

Integrated Cache: YES

Integrated cache helps in enhancing the processing speed and efficiency of the digital signal processor.

Maximum Supply Voltage: 1.32 V

Operating within a maximum supply voltage of 1.32V ensures the safety and stability of the product.

Address Bus Width: 13

A wider address bus width allows for better memory addressing capabilities and performance.

Package Shape: SQUARE

Square package shape provides a compact design and efficient use of space in electronic systems.

Bit Size: 32

32-bit architecture enables faster and more efficient processing of digital signals.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages allows flexibility in design and implementation.

No. of Terminals: 256

Having 256 terminals provides ample connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array with fine pitch design enhances the reliability and performance of the package during assembly and operation.

Minimum Supply Voltage: 1.14 V

Operating within a minimum supply voltage of 1.14V ensures efficient power management and performance.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, the product can withstand elevated temperature environments.

Minimum Operating Temperature: -40 °C

Operating at a minimum temperature of -40°C allows for reliable performance in cold conditions.

Terminal Finish: TIN SILVER COPPER

Terminal finish with Tin, Silver, and Copper provides excellent conductivity and resistance to corrosion.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy mounting and installation in electronic systems.

Maximum Seated Height: 2.05 mm

Having a maximum seated height of 2.05mm ensures compatibility with different board configurations and layouts.

RAM Words: 8192

A large RAM capacity of 8192 words allows for efficient data storage and processing within the DSP.

Width: 17 mm

Compact width of 17mm enables space-saving integration of the DSP in various electronic devices.

Boundary Scan: YES

Boundary scan capability enhances testing and debugging processes during product development and production.

External Data Bus Width: 16

Wide external data bus width of 16 bits allows for efficient data transfer between the DSP and external devices.

Maximum Clock Frequency: 30 MHz

Support for a high maximum clock frequency of 30MHz enables fast and real-time signal processing.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the product ensures reliable soldering and assembly.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C facilitates proper soldering and assembly of the DSP in manufacturing processes.

Internal Bus Architecture: SINGLE

Single internal bus architecture simplifies the design and operation of the DSP for efficient signal processing.

Length: 17 mm

Compact length of 17mm allows for space-efficient integration of the DSP in various electronic systems.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures reliable performance in automotive applications with varying temperature conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type supports diverse application requirements for digital signal processing.

No. of Timers: 4

Having 4 timers allows for precise timing and scheduling of tasks in applications requiring time-sensitive operations.

Technology: CMOS

CMOS technology provides low power consumption and high speed operation for efficient signal processing.

Terminal Form: BALL

Ball terminal form facilitates reliable connections and soldering during the installation of the DSP in electronic systems.

Nominal Supply Voltage: 1.2 V

Operating at a nominal supply voltage of 1.2V ensures stable and efficient power distribution within the product.

No. of DMA Channels: 40

Having 40 DMA channels enables efficient data transfer between memory and peripherals, enhancing overall system performance.

Terminal Pitch: 0.5 mm

Having a terminal pitch of 0.5mm allows for compact and high-density mounting of the DSP on circuit boards.

Format: FLOATING POINT

Support for floating-point format allows for high-precision calculations and processing of data in digital signal processing applications.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates the level of protection needed during storage and handling to prevent damage from moisture.

Low Power Mode: YES

Low power mode capability allows for energy-efficient operation and extended battery life in portable electronic devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6743DZKBT3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

13

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

40

No. of Terminals:

256

No. of Timers:

4

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

2.05 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

TMS320C6743DZKBT3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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