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TMS320C6743CZKBT3

Texas Instruments

TMS320C6743CZKBT3 by Texas Instruments

TMS320C6743CZKBT3 by Texas Instruments is a 32-bit DSP with 8192 RAM words, operating at 1.2V and 3.3V. It features a grid array package style, CMOS technology, and floating-point format. Ideal for digital signal processing applications requiring high-performance computing in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,102 parts In-Stock

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Digiode

USA . 4,743 parts In-Stock

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AZTECH Wire

Italy . 683 parts In-Stock

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$7.657

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683

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Parana Technologies

USA . 1,956 parts In-Stock

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$25.218

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$25.857

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DigiPath Technology Company

USA . 166 parts In-Stock

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$27.768

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$25.547

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ChromeModa Solutions

Germany . 3,730 parts In-Stock

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$28.335

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$23.235

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IDEA Electronic Components Group

UK . 2,316 parts In-Stock

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$28.335

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$26.918

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$25.502

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$28.335

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One Stop Electronics

USA . 930 parts In-Stock

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$30.000

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930

$30.000

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Corohmni

South Africa . 5,147 parts In-Stock

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$73.229

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QUARKTWIN TECHNOLOGY LTD

USA . 23,524 parts In-Stock

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Corphita

USA . 1,505 parts In-Stock

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Microchip USA

USA . 492 parts In-Stock

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Overview

Unlock unparalleled performance and efficiency with the TMS320C6743CZKBT3 by Texas Instruments. This high-quality Digital Signal Processor is designed to revolutionize your digital processing needs, offering exceptional value and benefits for a wide range of applications. Whether you're looking to enhance audio quality, improve image processing, or optimize control systems, this versatile DSP delivers unmatched advantages to meet your unique requirements. Trust in Texas Instruments' renowned expertise and reliability to take your projects to the next level with the TMS320C6743CZKBT3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection for the internal components of the DSP, making it suitable for various environments.

Bit Size: 32

The 32-bit architecture allows for fast and efficient processing of digital signals, making the DSP ideal for high-performance applications.

Power Supplies (V): 1.2,3.3

The availability of multiple power supply options allows for flexibility in integrating the DSP into different systems with varying power requirements.

RAM Words: 8192

The large RAM capacity of 8192 words enhances the data processing capabilities of the DSP, enabling it to handle complex algorithms and calculations effectively.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The inclusion of various peripheral IC types expands the functionality and versatility of the DSP, making it suitable for a wide range of signal processing applications.

Technology: CMOS

The CMOS technology used in the DSP ensures low power consumption, high-speed operation, and reliable performance, making it an energy-efficient and efficient choice for signal processing tasks.

Format: FLOATING POINT

The Floating Point format allows for precise and accurate calculations, making the DSP suitable for applications that require complex mathematical operations with high precision.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6743CZKBT3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Bit Size:

32

Format:

FLOATING POINT

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

8192

Sub-Category:

Digital Signal Processors

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

TMS320C6743CZKBT3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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