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TMS320C6727BZDH275

Texas Instruments

TMS320C6727BZDH275 by Texas Instruments

TMS320C6727BZDH275 by Texas Instruments is a 32-bit DSP with integrated cache, 262144 RAM words, and 25 MHz clock frequency. Ideal for digital signal processing applications requiring high-speed data processing and floating-point format calculations in a compact square package.

Median Price

$27.788

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,025 parts In-Stock

1+ parts

$27.788

100+ parts

$24.700

1k+ parts

$18.162

10k+ parts

-

3,025

$27.788

$24.700

$18.162

-

Rochester

USA . 115 parts In-Stock

1+ parts

-

100+ parts

$26.120

1k+ parts

$23.370

10k+ parts

$21.990

115

-

$26.120

$23.370

$21.990

DigiKey

USA . 115 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

115

-

-

-

-

Verical

USA . 115 parts In-Stock

1+ parts

-

100+ parts

$32.650

1k+ parts

$29.212

10k+ parts

$27.488

115

-

$32.650

$29.212

$27.488

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 906 parts In-Stock

1+ parts

$23.959

100+ parts

-

1k+ parts

-

10k+ parts

-

906

$23.959

-

-

-

Vyrian

USA . 4,314 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,314

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,029 parts In-Stock

1+ parts

$22.698

100+ parts

-

1k+ parts

-

10k+ parts

-

1,029

$22.698

-

-

-

Component Stockers USA

USA . 3,595 parts In-Stock

1+ parts

$23.840

100+ parts

$22.410

1k+ parts

$19.780

10k+ parts

-

3,595

$23.840

$22.410

$19.780

-

Corohmni

South Africa . 250 parts In-Stock

1+ parts

$26.415

100+ parts

-

1k+ parts

-

10k+ parts

-

250

$26.415

-

-

-

Parana Technologies

USA . 1,498 parts In-Stock

1+ parts

$74.946

100+ parts

-

1k+ parts

-

10k+ parts

-

1,498

$74.946

-

-

-

ChromeModa Solutions

Germany . 4,663 parts In-Stock

1+ parts

$84.209

100+ parts

$69.051

1k+ parts

-

10k+ parts

-

4,663

$84.209

$69.051

-

-

IDEA Electronic Components Group

UK . 2,310 parts In-Stock

1+ parts

$84.209

100+ parts

$79.999

1k+ parts

$75.788

10k+ parts

-

2,310

$84.209

$79.999

$75.788

-

A-Z Elektronik GmbH

Germany . 5,895 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,895

-

-

-

-

Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,500

-

-

-

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DigiPath Technology Company

USA . 347 parts In-Stock

1+ parts

-

100+ parts

$75.923

1k+ parts

-

10k+ parts

-

347

-

$75.923

-

-

Overview

Experience unparalleled performance and reliability with the TMS320C6727BZDH275 by Texas Instruments, a leading manufacturer in the industry. As a top-of-the-line digital signal processor, this product offers cutting-edge technology for a wide range of applications. With integrated cache and multiple power supplies, this DSP delivers exceptional value and benefits to customers. Whether you're in need of high-speed processing or advanced data handling, this product is designed to exceed your expectations. Trust Texas Instruments for quality products that provide top-notch performance every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good insulation and protection for the internal components, ensuring durability and reliability.

Integrated Cache: YES

Integrated cache helps in improving the speed and efficiency of data processing by storing frequently accessed data for quick retrieval.

Maximum Supply Voltage: 1.32 V

Support for a maximum supply voltage of 1.32 V allows for flexibility in power input requirements.

On Chip Data RAM Width: 8

A wider data RAM width of 8 bits allows for faster data processing and manipulation capabilities.

Address Bus Width: 32

A wide address bus of 32 bits enables access to a larger memory space, improving overall performance.

Package Shape: SQUARE

Square package shape offers efficient use of space and ease of handling during installation.

Bit Size: 32

32-bit architecture provides high processing power and precision for complex DSP applications.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages (1.2V, 3.3V) allows compatibility with a variety of systems and power sources.

No. of Terminals: 256

Having 256 terminals provides ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): GRID ARRAY

Grid array package style offers a high terminal count in a compact form factor, suitable for densely packed PCB designs.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage of 1.14 V enables efficient power consumption and operation in low-power scenarios.

Maximum Operating Temperature: 90 °C

High maximum operating temperature of 90°C ensures reliable performance even in demanding thermal conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature of 0°C allows for operation in a wide range of environmental conditions.

Terminal Finish: TIN SILVER COPPER

Terminal finish of tin, silver, and copper provides good electrical conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy mounting and soldering on the PCB, simplifying the assembly process.

Maximum Seated Height: 2.02 mm

Compact maximum seated height of 2.02 mm allows for slim and space-saving PCB designs.

RAM Words: 262144

Large RAM capacity of 262144 words provides ample memory storage for data processing and storage needs.

Width: 17 mm

Width dimension of 17 mm offers a compact form factor for efficient use of space on the PCB.

Boundary Scan: YES

Boundary scan feature enables efficient testing and debugging of the DSP device for improved reliability.

External Data Bus Width: 32

External data bus width of 32 bits allows for high-speed data transfer between the DSP and external memory or peripherals.

Maximum Clock Frequency: 25 MHz

High maximum clock frequency of 25 MHz provides fast processing speed for real-time DSP applications.

Maximum Time At Peak Reflow Temperature (s): 30

Support for a maximum time of 30 seconds at peak reflow temperature of 260°C ensures reliable soldering during assembly.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C allows for efficient and reliable soldering of the DSP device during assembly.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture offers parallel data processing pathways, enhancing overall performance and efficiency.

Length: 17 mm

Length dimension of 17 mm provides a balanced form factor for efficient PCB layout and space utilization.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Support for various peripheral IC types enhances the versatility and compatibility of the DSP for diverse applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for energy-efficient and reliable operation.

Terminal Form: BALL

Ball terminal form allows for easy soldering and reliability in connecting the DSP device to the PCB.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage of 1.2 V ensures consistent and reliable power delivery for the DSP device.

No. of DMA Channels: 16

Having 16 DMA channels allows for efficient data transfer between memory and peripherals without CPU intervention, improving system performance.

ROM Programmability: MROM

MROM (Mask ROM) programmability provides secure and permanent storage of firmware and data, ensuring data integrity and protection.

Terminal Pitch: 1 mm

Fine terminal pitch of 1 mm offers high-density packaging and compatibility with modern PCB designs.

Format: FLOATING POINT

Support for floating-point format enables high-precision numerical calculations, essential for advanced DSP algorithms and computations.

Moisture Sensitivity Level (MSL): 3

MSL rating of 3 indicates moderate moisture sensitivity, requiring standard precautions during storage and handling to prevent damage.

On Chip Program ROM Width: 8

Wider on-chip program ROM width of 8 bits allows for efficient storage and execution of program instructions for optimized performance.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6727BZDH275 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

32 BIT FLOATING POINT; ALSO REQUIRES 3.3 I/O SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of Terminals:

256

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

262144

ROM Programmability:

MROM

Maximum Seated Height:

2.02 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

TMS320C6727BZDH275 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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