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TMS320C6670AXCYPA

Texas Instruments

TMS320C6670AXCYPA by Texas Instruments

TMS320C6670AXCYPA by Texas Instruments is a 32-bit DSP with integrated cache, operating at -40 to 100 °C. It has 841 terminals, 32768 RAM words, and supports floating point format. Ideal for industrial applications requiring low power consumption and high-speed signal processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,201 parts In-Stock

1+ parts

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5,201

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Digiode

USA . 3,437 parts In-Stock

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3,437

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 694 parts In-Stock

1+ parts

$16.000

100+ parts

-

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694

$16.000

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AZTECH Wire

Italy . 795 parts In-Stock

1+ parts

$16.708

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795

$16.708

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Corohmni

South Africa . 2,526 parts In-Stock

1+ parts

$41.719

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2,526

$41.719

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Parana Technologies

USA . 1,385 parts In-Stock

1+ parts

$76.719

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1,385

$76.719

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DigiPath Technology Company

USA . 1,239 parts In-Stock

1+ parts

$84.477

100+ parts

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1,239

$84.477

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IDEA Electronic Components Group

UK . 2,080 parts In-Stock

1+ parts

$86.201

100+ parts

$81.891

1k+ parts

$77.581

10k+ parts

-

2,080

$86.201

$81.891

$77.581

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ChromeModa Solutions

Germany . 1,272 parts In-Stock

1+ parts

$86.201

100+ parts

$70.685

1k+ parts

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1,272

$86.201

$70.685

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Microchip USA

USA . 1,837 parts In-Stock

1+ parts

$274.450

100+ parts

$267.130

1k+ parts

$263.470

10k+ parts

$259.810

1,837

$274.450

$267.130

$263.470

$259.810

Corphita

USA . 3,392 parts In-Stock

1+ parts

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3,392

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Overview

Experience unparalleled performance and efficiency with the TMS320C6670AXCYPA by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers top-notch quality and reliability. This DSP is perfect for a wide range of applications, offering customers exceptional value and benefits. Whether you're looking to enhance your audio processing, telecommunications, or industrial control systems, this product provides the power and flexibility you need to succeed. Trust Texas Instruments to provide the cutting-edge technology you require for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects internal components, making the product long-lasting.

Integrated Cache: YES

Enhances processing speed by storing frequently accessed data for quick retrieval.

Maximum Supply Voltage: 1.05 V

Allows for efficient power consumption while providing enough voltage for optimal performance.

Package Shape: SQUARE

Facilitates easier integration into circuit designs and saves space.

Bit Size: 32

Offers high computational power and precision for complex signal processing tasks.

Power Supplies (V): 1, 1.5, 1.8

Provides flexibility in power options to suit different application requirements.

No. of Terminals: 841

Allows for connectivity with a wide range of external devices and components.

Package Style (Meter): GRID ARRAY, FINE PITCH

Enables high-density packaging and efficient signal routing for improved performance.

Minimum Supply Voltage: 0.95 V

Supports low-power operation and optimizes energy efficiency.

Maximum Operating Temperature: 100 °C

Ensures reliable performance even under high-temperature conditions.

Minimum Operating Temperature: -40 °C

Allows for operation in a wide range of temperature environments.

Terminal Finish: TIN SILVER COPPER

Provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Facilitates easy assembly and connections in circuit layouts.

Maximum Seated Height: 3.39 mm

Enables compact and slim device designs for space-constrained applications.

RAM Words: 32768

Offers ample memory for storing and processing data efficiently.

Width: 24 mm

Compact size for easy integration into various electronic devices.

Boundary Scan: YES

Allows for efficient testing and debugging of the product during development and production.

Internal Bus Architecture: SINGLE

Simplifies data transfer within the processor for faster operation.

Length: 24 mm

Compact size for easy integration into various electronic devices.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with wide temperature ranges and harsh conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

Versatile for both digital signal processing and mixed-signal processing tasks.

No. of Timers: 16

Provides precise timing control for various operations and tasks.

Technology: CMOS

Offers low power consumption and high noise immunity for efficient signal processing.

Terminal Form: BALL

Facilitates secure connections and soldering during assembly.

Nominal Supply Voltage: 1 V

Optimal voltage level for stable and efficient operation.

No. of DMA Channels: 80

Enables efficient data transfer and processing with multiple channels.

Terminal Pitch: 0.8 mm

Allows for high-density packaging and efficient signal routing.

Format: FLOATING POINT

Supports high-precision numerical calculations for accurate signal processing.

Moisture Sensitivity Level (MSL): 4

Indicates the level of protection against moisture, ensuring product reliability.

Low Power Mode: YES

Offers power-saving features for extended battery life and energy efficiency.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6670AXCYPA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B841

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

80

No. of Terminals:

841

No. of Timers:

16

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA841,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1,1.5,1.8

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

3.39 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6670AXCYPA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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