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TMS320C6454BZTZ8

Texas Instruments

TMS320C6454BZTZ8 by Texas Instruments

TMS320C6454BZTZ8 by Texas Instruments is a 32-bit DSP with 64-bit external data bus, operating at 66.6 MHz. It features 32768 RAM words and a max supply voltage of 1.89V. Ideal for digital signal processing applications requiring high-speed performance in a compact package with grid array style and fine pitch terminals.

Median Price

$138.275

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 346 parts In-Stock

1+ parts

$127.150

100+ parts

$119.520

1k+ parts

$111.890

10k+ parts

-

346

$127.150

$119.520

$111.890

-

DigiKey

USA . 346 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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346

-

-

-

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Verical

USA . 346 parts In-Stock

1+ parts

-

100+ parts

$149.400

1k+ parts

$139.863

10k+ parts

-

346

-

$149.400

$139.863

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,956 parts In-Stock

1+ parts

$140.258

100+ parts

-

1k+ parts

-

10k+ parts

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3,956

$140.258

-

-

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Vyrian

USA . 5,721 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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5,721

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Cyclops Electronics Ltd

UK . 24 parts In-Stock

1+ parts

-

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24

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 830 parts In-Stock

1+ parts

$34.472

100+ parts

-

1k+ parts

-

10k+ parts

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830

$34.472

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-

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DigiPath Technology Company

USA . 862 parts In-Stock

1+ parts

$37.958

100+ parts

$34.922

1k+ parts

-

10k+ parts

-

862

$37.958

$34.922

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ChromeModa Solutions

Germany . 2,458 parts In-Stock

1+ parts

$38.733

100+ parts

$31.761

1k+ parts

-

10k+ parts

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2,458

$38.733

$31.761

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IDEA Electronic Components Group

UK . 1,301 parts In-Stock

1+ parts

$38.733

100+ parts

$36.796

1k+ parts

$34.860

10k+ parts

-

1,301

$38.733

$36.796

$34.860

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Corohmni

South Africa . 2,895 parts In-Stock

1+ parts

$64.930

100+ parts

-

1k+ parts

-

10k+ parts

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2,895

$64.930

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Corphita

USA . 3,420 parts In-Stock

1+ parts

$132.876

100+ parts

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1k+ parts

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10k+ parts

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3,420

$132.876

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Microchip USA

USA . 1,373 parts In-Stock

1+ parts

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100+ parts

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1,373

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Overview

Experience superior performance and efficiency with the TMS320C6454BZTZ8 by Texas Instruments, a leading manufacturer of cutting-edge digital signal processors. This innovative product falls under the category of DSPs, offering a wide range of applications for various industries. With its advanced technology and high-quality design, this processor provides unmatched value, benefits, and advantages to customers. Elevate your projects to the next level with the TMS320C6454BZTZ8 and discover the difference that Texas Instruments can make in your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage during transport or handling.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly, reducing production time and costs.

Maximum Supply Voltage: 1.89 V

The high maximum supply voltage ensures stable performance under varying power conditions.

Address Bus Width: 20

A wider address bus allows for faster data processing and better memory addressing capabilities.

Package Shape: SQUARE

The square shape helps in optimizing space utilization on circuit boards, making the product more compact and efficient.

Bit Size: 32

A 32-bit architecture enables processing of larger chunks of data at a time, improving overall speed and efficiency.

Power Supplies (V): 1.2,1.8,3.3

Multiple power supply options make the product versatile and compatible with different systems and configurations.

No. of Terminals: 697

A high number of terminals allow for multiple connectivity options and interfaces, enhancing the product's functionality.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style enables high-density mounting, saving space and improving performance in compact designs.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures energy efficiency and compatibility with low-power systems.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature range allows the product to perform reliably in various environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the product can function in cold environments without any issues.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides a reliable and durable connection, preventing corrosion and ensuring long-term performance.

Terminal Position: BOTTOM

Bottom terminal positioning allows for easier and more secure mounting on circuit boards.

Maximum Seated Height: 3.3 mm

The low maximum seated height ensures compatibility with compact designs and space-constrained applications.

RAM Words: 32768

With a large RAM capacity, the product can store and process a significant amount of data, improving overall performance.

Width: 24 mm

The compact width makes the product suitable for space-constrained applications and allows for efficient board layout.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the product during manufacturing and maintenance.

External Data Bus Width: 64

A wide external data bus allows for faster data transfer between the processor and external devices, enhancing overall performance.

Maximum Clock Frequency: 66.6 MHz

The high maximum clock frequency enables fast data processing and high-speed operation in demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time at peak temperature prevents thermal damage during assembly, ensuring product reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for effective soldering and assembly, ensuring strong and reliable connections.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data transfer speed and efficiency within the processor, improving performance.

Length: 24 mm

The compact length makes the product suitable for tight spaces and ensures compatibility with a variety of enclosure designs.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The inclusion of digital signal processor and other peripheral IC types enhances the product's capabilities and versatility for different applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in various environments.

Terminal Form: BALL

Ball terminal form provides a reliable and secure connection, enabling effective soldering and robust electrical connections.

Nominal Supply Voltage: 1.8 V

The fixed nominal supply voltage ensures stable performance and compatibility with standard power systems.

Terminal Pitch: 0.8 mm

The small terminal pitch enables high-density mounting, saving space and improving overall circuit board layout efficiency.

Format: FIXED POINT

Fixed-point format simplifies arithmetic calculations and data processing, enhancing product efficiency and speed.

Moisture Sensitivity Level (MSL): 4

MSL 4 rating ensures the product is resistant to moisture damage during shipping, storage, and handling.

Barrel Shifter: YES

Barrel shifter functionality enhances data manipulation capabilities, enabling efficient arithmetic and logical operations in the processor.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6454BZTZ8 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

20

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66.6 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B697

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

697

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA697,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6454BZTZ8 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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