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TMS320C6424ZDUQ5

Texas Instruments

TMS320C6424ZDUQ5 by Texas Instruments

TMS320C6424ZDUQ5 by Texas Instruments is a 32-bit DSP with integrated cache, 30 MHz clock frequency, and 20480 RAM words. Widely used in automotive applications due to its low power mode, it features 64 DMA channels and operates at temperatures ranging from -40 to 125°C.

Median Price

$38.389

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 32 parts In-Stock

1+ parts

$27.620

100+ parts

-

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32

$27.620

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Chip1Stop

Japan . 77 parts In-Stock

1+ parts

$28.400

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-

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77

$28.400

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Texas Instruments

USA . 520 parts In-Stock

1+ parts

$38.389

100+ parts

$34.124

1k+ parts

$25.091

10k+ parts

-

520

$38.389

$34.124

$25.091

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Rochester

USA . 37 parts In-Stock

1+ parts

-

100+ parts

$39.810

1k+ parts

$35.620

10k+ parts

$33.520

37

-

$39.810

$35.620

$33.520

DigiKey

USA . 37 parts In-Stock

1+ parts

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37

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Verical

USA . 31 parts In-Stock

1+ parts

-

100+ parts

$49.763

1k+ parts

$44.525

10k+ parts

$41.900

31

-

$49.763

$44.525

$41.900

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,370 parts In-Stock

1+ parts

$15.200

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-

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3,370

$15.200

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Vyrian

USA . 8,324 parts In-Stock

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8,324

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SPM Sales

USA . 8 parts In-Stock

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8

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,455 parts In-Stock

1+ parts

$14.400

100+ parts

-

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2,455

$14.400

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Corohmni

South Africa . 143 parts In-Stock

1+ parts

$24.456

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143

$24.456

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Parana Technologies

USA . 456 parts In-Stock

1+ parts

$42.925

100+ parts

$3,986.210

1k+ parts

$38.632

10k+ parts

-

456

$42.925

$3,986.210

$38.632

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DigiPath Technology Company

USA . 2,259 parts In-Stock

1+ parts

$47.265

100+ parts

$43.484

1k+ parts

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2,259

$47.265

$43.484

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IDEA Electronic Components Group

UK . 1,893 parts In-Stock

1+ parts

$48.230

100+ parts

$45.818

1k+ parts

$43.407

10k+ parts

-

1,893

$48.230

$45.818

$43.407

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ChromeModa Solutions

Germany . 1,242 parts In-Stock

1+ parts

$48.230

100+ parts

$39.549

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1,242

$48.230

$39.549

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Microchip USA

USA . 1,157 parts In-Stock

1+ parts

$83.350

100+ parts

$81.900

1k+ parts

$81.180

10k+ parts

$80.450

1,157

$83.350

$81.900

$81.180

$80.450

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Perfect Parts

USA . 90 parts In-Stock

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90

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Overview

Unleash the power of cutting-edge technology with the TMS320C6424ZDUQ5 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and innovation in digital signal processors (DSPs). This versatile product offers value and benefits across various applications, providing customers with unmatched performance and reliability. Elevate your projects to new heights with the TMS320C6424ZDUQ5 and experience the advantages it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and durable, making the product suitable for various applications.

Integrated Cache: YES

Integrated cache helps in improving the performance of the DSP by storing frequently accessed data, resulting in faster processing speeds.

Maximum Supply Voltage: 1.26 V

Operating within a maximum supply voltage of 1.26 V ensures efficient power consumption and prevents damage to the DSP.

On Chip Data RAM Width: 8

A wider data RAM width of 8 enables the DSP to handle larger amounts of data simultaneously, enhancing its processing capabilities.

Address Bus Width: 32

A wider address bus of 32 allows the DSP to access a larger memory space, providing flexibility in data retrieval and storage.

Bit Size: 32

With a bit size of 32, the DSP can process data in 32-bit chunks, improving the speed and efficiency of calculations.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures that the DSP can function reliably even in demanding environmental conditions.

No. of DMA Channels: 64

Having 64 DMA channels allows for efficient data transfers between peripherals and memory, enhancing the overall performance of the DSP.

Temperature Grade: AUTOMOTIVE

Being automotive-grade means the DSP is designed to operate in automotive applications, where durability and reliability are crucial.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6424ZDUQ5 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B376

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

376

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA376,22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

20480

ROM Programmability:

MROM

Maximum Seated Height:

2.48 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6424ZDUQ5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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