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TMS320C6424ZDU7

Texas Instruments

TMS320C6424ZDU7 by Texas Instruments

TMS320C6424ZDU7 by Texas Instruments is a 32-bit DSP with integrated cache, 32-bit address bus width, and 20480 RAM words. It operates at a max clock frequency of 30 MHz and has 64 DMA channels. Ideal for digital signal processing applications requiring low power mode and fixed-point format.

Median Price

$56.703

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,853 parts In-Stock

1+ parts

$52.156

100+ parts

$46.361

1k+ parts

$34.089

10k+ parts

-

3,853

$52.156

$46.361

$34.089

-

Mouser Electronics

USA . 47 parts In-Stock

1+ parts

$81.470

100+ parts

$64.450

1k+ parts

$60.520

10k+ parts

-

47

$81.470

$64.450

$60.520

-

Rochester

USA . 89 parts In-Stock

1+ parts

-

100+ parts

$49.000

1k+ parts

$43.840

10k+ parts

$41.260

89

-

$49.000

$43.840

$41.260

DigiKey

USA . 89 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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89

-

-

-

-

Verical

USA . 84 parts In-Stock

1+ parts

-

100+ parts

$61.250

1k+ parts

$54.800

10k+ parts

$51.575

84

-

$61.250

$54.800

$51.575

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,183 parts In-Stock

1+ parts

$44.982

100+ parts

-

1k+ parts

-

10k+ parts

-

3,183

$44.982

-

-

-

DigiKey Marketplace

USA . 89 parts In-Stock

1+ parts

$45.590

100+ parts

-

1k+ parts

-

10k+ parts

-

89

$45.590

-

-

-

Component Electronics Inc.

Canada . 20 parts In-Stock

1+ parts

$60.000

100+ parts

$45.000

1k+ parts

$39.000

10k+ parts

-

20

$60.000

$45.000

$39.000

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Vyrian

USA . 2,126 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,126

-

-

-

-

TME

Poland . 120 parts In-Stock

1+ parts

-

100+ parts

$30.040

1k+ parts

-

10k+ parts

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120

-

$30.040

-

-

EMSNET

USA . 2 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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2

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,822 parts In-Stock

1+ parts

$42.615

100+ parts

-

1k+ parts

-

10k+ parts

-

3,822

$42.615

-

-

-

Corohmni

South Africa . 352 parts In-Stock

1+ parts

$46.045

100+ parts

-

1k+ parts

-

10k+ parts

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352

$46.045

-

-

-

Parana Technologies

USA . 1,264 parts In-Stock

1+ parts

$63.861

100+ parts

-

1k+ parts

-

10k+ parts

-

1,264

$63.861

-

-

-

DigiPath Technology Company

USA . 99 parts In-Stock

1+ parts

$70.319

100+ parts

-

1k+ parts

-

10k+ parts

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99

$70.319

-

-

-

ChromeModa Solutions

Germany . 5,317 parts In-Stock

1+ parts

$71.754

100+ parts

$58.838

1k+ parts

-

10k+ parts

-

5,317

$71.754

$58.838

-

-

IDEA Electronic Components Group

UK . 1,966 parts In-Stock

1+ parts

$71.754

100+ parts

$68.166

1k+ parts

$64.579

10k+ parts

-

1,966

$71.754

$68.166

$64.579

-

A-Z Elektronik GmbH

Germany . 5,577 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,577

-

-

-

-

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,000

-

-

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Overview

Experience unparalleled performance and efficiency with the TMS320C6424ZDU7 by Texas Instruments, a leading manufacturer in digital signal processors. Ideal for a wide range of applications, this DSP offers integrated cache, multiple power supply options, and boundary scan capabilities. With its advanced technology and low power mode, customers can expect top-notch performance and reliability. Upgrade your projects with the TMS320C6424ZDU7 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for the package, ensuring portability and protection for the DSP.

Integrated Cache: YES

Improves processing speed and efficiency by storing frequently accessed data close to the processor.

Maximum Supply Voltage: 1.26 V

Efficient power consumption and compatibility with various power sources.

On Chip Data RAM Width: 8

Enhanced data processing capabilities with a wider RAM width.

Address Bus Width: 32

Allows for efficient memory addressing and data transfer within the processor.

Package Shape: SQUARE

Space-efficient design for easy integration into electronic systems.

Bit Size: 32

High processing capability with a 32-bit architecture.

Power Supplies (V): 1.2,1.8,3.3

Versatile power supply options for different voltage requirements.

No. of Terminals: 376

Provides ample connectivity options for peripherals and external devices.

Terminal Finish: TIN SILVER COPPER

Ensures good conductivity and resistance to corrosion for reliable connections.

ROM Programmability: MROM

Non-volatile memory for storing essential program instructions.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6424ZDU7 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B376

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

376

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA376,22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

20480

ROM Programmability:

MROM

Maximum Seated Height:

2.48 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6424ZDU7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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