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TMS320C6416TBCLZ1

Texas Instruments

TMS320C6416TBCLZ1 by Texas Instruments

TMS320C6416TBCLZ1 by Texas Instruments is a 32-bit DSP with integrated cache, 64-bit external data bus width, and max clock frequency of 75 MHz. Ideal for digital signal processing applications requiring high-speed performance in a compact package.

Median Price

$288.211

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 122 parts In-Stock

1+ parts

$288.211

100+ parts

$279.543

1k+ parts

$216.700

10k+ parts

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122

$288.211

$279.543

$216.700

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,892 parts In-Stock

1+ parts

$273.800

100+ parts

-

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2,892

$273.800

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Vyrian

USA . 2,074 parts In-Stock

1+ parts

-

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2,074

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Chip Stock

USA . 135 parts In-Stock

1+ parts

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135

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 163 parts In-Stock

1+ parts

$18.930

100+ parts

-

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163

$18.930

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Parana Technologies

USA . 1,848 parts In-Stock

1+ parts

$71.192

100+ parts

$6,611.256

1k+ parts

$64.073

10k+ parts

-

1,848

$71.192

$6,611.256

$64.073

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DigiPath Technology Company

USA . 734 parts In-Stock

1+ parts

$78.391

100+ parts

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734

$78.391

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ChromeModa Solutions

Germany . 831 parts In-Stock

1+ parts

$79.991

100+ parts

$65.593

1k+ parts

-

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831

$79.991

$65.593

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IDEA Electronic Components Group

UK . 609 parts In-Stock

1+ parts

$79.991

100+ parts

$75.991

1k+ parts

$71.992

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609

$79.991

$75.991

$71.992

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Corohmni

South Africa . 977 parts In-Stock

1+ parts

$83.542

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977

$83.542

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Corphita

USA . 2,315 parts In-Stock

1+ parts

$259.390

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2,315

$259.390

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Overview

Unlock the power of digital signal processing with the TMS320C6416TBCLZ1 by Texas Instruments. As a leader in the industry, Texas Instruments guarantees top-notch quality and reliability. This DSP is perfect for applications requiring high-speed data processing and low power consumption, making it ideal for telecommunications, audio processing, and industrial automation. With integrated cache and multiple DMA channels, this product offers unparalleled performance and efficiency. Trust Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components as it provides good protection for the internal circuitry and is lightweight, making the product durable and easy to handle.

Integrated Cache: YES

Integrated cache helps in improving the overall performance of the DSP by reducing memory access times and increasing data processing speed.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, reducing manufacturing costs and improving reliability.

Maximum Supply Voltage: 1.24 V

Having a low maximum supply voltage helps in reducing power consumption and heat generation, making the product energy-efficient.

Address Bus Width: 20

Having a wider address bus allows for the processing of larger amounts of data at once, improving the efficiency of data processing tasks.

Package Shape: SQUARE

Square packages are more space-efficient and allow for easier PCB layout and assembly, making the product ideal for compact electronic devices.

Bit Size: 32

A 32-bit architecture allows for faster and more efficient processing of data, making the product suitable for demanding applications that require high-speed computation.

Power Supplies (V): 1.2,3.3

Having multiple power supply options provides flexibility in design and allows the product to be used in a variety of electronic systems with different power requirements.

No. of Terminals: 532

A higher number of terminals allow for more connectivity options and interfaces, making the product versatile and adaptable to different system configurations.

Package Style (Meter): GRID ARRAY, FINE PITCH

A grid array with fine pitch allows for high-density packaging and efficient heat dissipation, making the product suitable for applications where space and thermal management are critical.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6416TBCLZ1 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

532

No. of Timers:

3

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

3.25 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.24 V

Minimum Supply Voltage:

1.16 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6416TBCLZ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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