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TMS320C6415TBGLZA8

Texas Instruments

TMS320C6415TBGLZA8 by Texas Instruments

TMS320C6415TBGLZA8 by Texas Instruments is a 32-bit DSP with integrated cache, operating at max 75 MHz clock frequency. Ideal for industrial applications, it features 262144 RAM words, 64 external data bus width, and flash ROM programmability for efficient signal processing tasks.

Median Price

$222.038

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 160 parts In-Stock

1+ parts

$202.210

100+ parts

$198.190

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$194.140

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$202.210

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$194.140

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Texas Instruments

USA . 1,311 parts In-Stock

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$241.867

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$234.593

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$181.855

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$241.867

$234.593

$181.855

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Distributors (In-Stock)

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Digiode

USA . 4,521 parts In-Stock

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$229.774

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$229.774

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Bristol Electronics

USA . 55 parts In-Stock

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$234.089

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$172.055

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55

$234.089

$172.055

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Vyrian

USA . 8,809 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 60 parts In-Stock

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Dan-Mar Components

USA . 60 parts In-Stock

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Speed Components Ltd

Israel . 12 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 469 parts In-Stock

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$15.290

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469

$15.290

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Parana Technologies

USA . 640 parts In-Stock

1+ parts

$29.347

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$2,725.301

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$26.412

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640

$29.347

$2,725.301

$26.412

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DigiPath Technology Company

USA . 1,977 parts In-Stock

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$32.315

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$32.315

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ChromeModa Solutions

Germany . 3,031 parts In-Stock

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$32.974

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$27.039

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3,031

$32.974

$27.039

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IDEA Electronic Components Group

UK . 359 parts In-Stock

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$32.974

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$31.325

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$29.677

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359

$32.974

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$29.677

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Corohmni

South Africa . 5,168 parts In-Stock

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$35.822

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$35.822

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Corphita

USA . 1,484 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 12,132 parts In-Stock

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Authorized Procurement Solutions

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Perfect Parts

USA . 67 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the TMS320C6415TBGLZA8 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Digital Signal Processors that are versatile and reliable, making them ideal for a wide range of applications. Experience the value and benefits of this product as it offers unmatched performance, efficiency, and precision. Whether you're in need of fast data processing, high-speed calculations, or advanced signal processing capabilities, this DSP has got you covered. Elevate your projects to new heights with the TMS320C6415TBGLZA8 and witness the difference that superior technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DSP, ensuring reliable performance in various environmental conditions.

Integrated Cache: YES

Allows for faster access to frequently used data, improving the overall processing speed and efficiency of the DSP.

Maximum Supply Voltage: 1.24 V

Optimal supply voltage level for efficient performance without risking damage to the DSP.

Address Bus Width: 23

Wide address bus width allows for efficient memory addressing and management in complex processing tasks.

Package Shape: SQUARE

Square package shape makes it easier to mount and integrate the DSP into various electronic systems.

Bit Size: 32

32-bit architecture enables the DSP to handle large amounts of data and complex calculations with precision.

Power Supplies (V): 1.1,3.3

Multiple power supply options provide flexibility in voltage selection based on system requirements and power efficiency considerations.

No. of Terminals: 532

More terminals allow for greater connectivity and integration with other electronic components, expanding the DSP's capabilities.

Minimum Supply Voltage: 1.16 V

Ensures reliable operation at lower voltage levels, saving power and reducing heat generation during operation.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures the DSP can function effectively in industrial environments with elevated temperatures.

No. of External Interrupts: 4

External interrupts allow for real-time responses to external events, enhancing the DSP's responsiveness in time-critical applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables the DSP to perform reliably in harsh cold environments without compromising performance.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead terminal finish provides good solderability and ensures secure connections with other electronic components during assembly.

RAM Words: 262144

Large RAM capacity allows the DSP to store and access a significant amount of data for processing, enabling complex algorithm execution.

Width: 23 mm

Compact width facilitates space-saving integration of the DSP into compact electronic devices or systems.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging of the DSP during production and maintenance phases.

External Data Bus Width: 64

Wide external data bus width enhances data transfer speed between the DSP and external memory or peripherals, improving overall processing efficiency.

Maximum Clock Frequency: 75 MHz

High clock frequency enables fast data processing and execution of instructions, enhancing the overall performance of the DSP.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Specialized peripheral IC type tailored for digital signal processing applications, providing dedicated support for signal processing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable in noisy environments.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent and reliable operation of the DSP at the optimal voltage level.

No. of DMA Channels: 64

Multiple DMA channels enable efficient data transfer and processing between memory and peripherals, reducing CPU overhead and improving system performance.

ROM Programmability: FLASH

Flash programmable ROM provides flexibility in updating firmware or software configurations without the need for external programming equipment.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6415TBGLZA8 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

532

No. of Timers:

3

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.1,3.3

Qualification:

Not Qualified

RAM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

3.25 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.24 V

Minimum Supply Voltage:

1.16 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6415TBGLZA8 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

NSN

5962-01-655-5549, 5962016555549

NIIN

016555549

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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