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TMS320C6205GHK200

Texas Instruments

TMS320C6205GHK200 by Texas Instruments

TMS320C6205GHK200 by Texas Instruments is a 32-bit DSP with integrated cache and 32-bit external data bus width. It operates at a max clock frequency of 200 MHz, suitable for digital signal processing applications requiring high-speed performance in a compact package. With low power mode and multiple internal bus architecture, it offers efficient processing capabilities for various signal processing tasks.

Median Price

$19.990

Lifecycle Status

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7

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1k+

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TEDSS.com

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Digiode

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Electronics Depot

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LIBRA Elektronik GmbH

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Pegasus Components GmbH

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Cyclops Electronics Ltd

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AZTECH Wire

Italy . 442 parts In-Stock

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Parana Technologies

USA . 1,965 parts In-Stock

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$19.649

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$19.641

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DigiPath Technology Company

USA . 2,210 parts In-Stock

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$21.636

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$19.906

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IDEA Electronic Components Group

UK . 1,378 parts In-Stock

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ChromeModa Solutions

Germany . 702 parts In-Stock

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One Stop Electronics

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Corohmni

South Africa . 2,966 parts In-Stock

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Authorized Procurement Solutions

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Microchip USA

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Overview

Unleash the power of cutting-edge technology with the TMS320C6205GHK200 by Texas Instruments! This top-of-the-line Digital Signal Processor boasts unparalleled quality and reliability, making it a must-have for a wide range of applications. From enhancing audio and video processing to optimizing communication systems, this DSP offers superior performance and efficiency. Experience seamless integration and exceptional value with Texas Instruments' TMS320C6205GHK200 and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable package for the DSP, making it suitable for a variety of applications.

Integrated Cache: YES

Having integrated cache helps in improving the processing speed and efficiency of the DSP.

Maximum Supply Voltage: 1.57 V

Allows for safe operation at higher voltages, offering flexibility in power supply design.

On Chip Data RAM Width: 8

Wide data RAM width enables efficient data processing and storage on the chip itself.

Address Bus Width: 32

A wider address bus facilitates larger memory addressing capabilities for the DSP.

Bit Size: 32

32-bit processing capability ensures high computational performance and accuracy.

Power Supplies (V): 1.5,3.3,5

Support for multiple power supply voltages enables compatibility with different systems and power sources.

No. of Terminals: 288

Having a high number of terminals allows for versatile connectivity options and interfaces.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style offers compact size, low profile, and fine pitch for space-constrained applications.

Minimum Supply Voltage: 1.43 V

Ensures stable operation even at lower supply voltages, enhancing efficiency and reliability.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, the DSP can withstand demanding thermal conditions.

No. of External Interrupts: 4

Multiple external interrupts help in handling real-time events and improving responsiveness.

Minimum Operating Temperature: 0 °C

Capable of functioning at low temperatures, making it suitable for various environmental conditions.

Terminal Finish: TIN LEAD

Provides reliable terminal finish for soldering and PCB assembly processes.

RAM Words: 16384

Large RAM capacity allows for efficient data storage and processing in the DSP.

Width: 16 mm

Compact width facilitates easy integration into different systems and circuit designs.

Boundary Scan: YES

Boundary scan capability aids in testing, debugging, and ensuring quality control during the manufacturing process.

External Data Bus Width: 32

Wide external data bus allows for rapid data transfer between the DSP and external devices.

Maximum Clock Frequency: 200 MHz

High clock frequency enables fast signal processing and high-speed computations.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data throughput and bandwidth for efficient processing.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Diverse peripheral IC types expand functionality and compatibility with various devices and systems.

No. of Timers: 2

Built-in timers aid in timing and scheduling tasks, enhancing the overall performance of the DSP.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving overall efficiency.

Terminal Form: BALL

Ball terminal form enables reliable electrical connections and soldering for secure assembly.

No. of DMA Channels: 4

Multiple DMA channels enhance data transfer rates and offload processing tasks for improved performance.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for close terminal spacing and compact design for space-constrained applications.

Format: FIXED POINT

Fixed-point format offers fast and efficient numerical processing for various computational tasks.

Moisture Sensitivity Level (MSL): 3

MSL rating ensures proper handling and storage requirements to prevent moisture-related damage.

Low Power Mode: YES

Support for low power mode conserves energy and extends battery life for portable and battery-operated devices.

On Chip Program ROM Width: 8

Wide on-chip program ROM width allows for storing and executing program instructions efficiently within the DSP.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6205GHK200 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

200 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B288

JESD-609 Code:

e0

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Terminals:

288

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA288,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.5,3.3,5

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.57 V

Minimum Supply Voltage:

1.43 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320C6205GHK200 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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