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TMS320C6203BGNY300

Texas Instruments

TMS320C6203BGNY300 by Texas Instruments

TMS320C6203BGNY300 by Texas Instruments is a 32-bit DSP with 524288 RAM words, 300 MHz clock frequency, and 384 terminals. It is used in digital signal processing applications due to its integrated cache, 32-bit data bus width, and boundary scan capability.

Median Price

$104.771

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,983 parts In-Stock

1+ parts

-

100+ parts

$93.130

1k+ parts

$83.330

10k+ parts

$78.420

1,983

-

$93.130

$83.330

$78.420

DigiKey

USA . 919 parts In-Stock

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919

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Verical

USA . 774 parts In-Stock

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$116.412

1k+ parts

$104.162

10k+ parts

$98.025

774

-

$116.412

$104.162

$98.025

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 104 parts In-Stock

1+ parts

$97.622

100+ parts

$80.050

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104

$97.622

$80.050

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Digiode

USA . 370 parts In-Stock

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$98.306

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370

$98.306

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DigiKey Marketplace

USA . 1,993 parts In-Stock

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$107.630

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$107.630

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Vyrian

USA . 3,143 parts In-Stock

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ECAB

Sweden . 338 parts In-Stock

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338

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EMSNET

USA . 300 parts In-Stock

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300

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Cyclops Electronics Ltd

UK . 149 parts In-Stock

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149

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Dan-Mar Components

USA . 104 parts In-Stock

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104

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Odintec Ltd.

Israel . 55 parts In-Stock

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Sogenti Electronics

Canada . 2 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,390 parts In-Stock

1+ parts

$13.640

100+ parts

-

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$14.142

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1,390

$13.640

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$14.142

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ChromeModa Solutions

Germany . 4,385 parts In-Stock

1+ parts

$15.326

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$12.567

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4,385

$15.326

$12.567

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IDEA Electronic Components Group

UK . 1,992 parts In-Stock

1+ parts

$15.326

100+ parts

$14.560

1k+ parts

$13.793

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1,992

$15.326

$14.560

$13.793

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Corohmni

South Africa . 2,126 parts In-Stock

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$33.422

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$33.422

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Corphita

USA . 3,010 parts In-Stock

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$93.132

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$93.132

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Microchip USA

USA . 1,260 parts In-Stock

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$153.392

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$153.392

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Kepictronics

USA . 8,000 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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A-Z Elektronik GmbH

Germany . 1,971 parts In-Stock

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1,971

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DigiPath Technology Company

USA . 1,533 parts In-Stock

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$13.818

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1,533

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$13.818

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Perfect Parts

USA . 304 parts In-Stock

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Overview

Experience unparalleled performance and efficiency with the TMS320C6203BGNY300 by Texas Instruments, a cutting-edge digital signal processor designed to meet the demands of today's technology-driven world. With its integrated cache, advanced internal bus architecture, and multiple power supply options, this DSP is ideal for a wide range of applications including telecommunications, audio processing, and industrial automation. Trust in the quality and expertise of Texas Instruments to deliver a reliable and innovative solution that will elevate your products to the next level. Unlock the potential of your designs with the TMS320C6203BGNY300 and stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protects the internal components of the DSP from external elements, making it a reliable choice for various applications.

Integrated Cache: YES

Integrated cache helps in improving the processing speed and efficiency of the DSP by storing frequently accessed data, enhancing overall performance.

Maximum Supply Voltage: 1.57 V

Having a higher maximum supply voltage allows the DSP to handle fluctuations in power supply without risking damage, ensuring stable operation under varying conditions.

Address Bus Width: 22

A wider address bus width enables the DSP to access a larger memory space, facilitating complex calculations and data processing tasks efficiently.

Bit Size: 32

A 32-bit architecture allows the DSP to handle large amounts of data and perform calculations with higher precision, making it suitable for demanding signal processing applications.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, this DSP can withstand heat-intensive environments without experiencing performance degradation or failure, ensuring reliability in harsh conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a specialized digital signal processor, this product is designed to efficiently handle digital signal processing tasks with high accuracy and speed, making it an ideal choice for signal processing applications.

Maximum Clock Frequency: 300 MHz

A high maximum clock frequency enables the DSP to execute instructions at a faster rate, resulting in quicker processing of signals and data, making it suitable for real-time applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6203BGNY300 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

300 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B384

JESD-609 Code:

e0

Length:

18 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Terminals:

384

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA384,22X22,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

RAM Words:

524288

ROM Programmability:

MROM

Maximum Seated Height:

2.35 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.57 V

Minimum Supply Voltage:

1.43 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

18 mm

Peripheral IC Type:

Trade Compliance

TMS320C6203BGNY300 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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