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TMS320C6203BGNY173

Texas Instruments

TMS320C6203BGNY173 by Texas Instruments

TMS320C6203BGNY173 by Texas Instruments is a 32-bit DSP with 300 MHz clock frequency, 524288 RAM words, and 22-bit address bus width. Ideal for digital signal processing applications due to its integrated cache, low power mode, and boundary scan capability.

Median Price

$82.576

Lifecycle Status

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7

In-Stock Inventory

1k+

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Texas Instruments

USA . 10 parts In-Stock

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$82.576

100+ parts

$80.092

1k+ parts

$62.087

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10

$82.576

$80.092

$62.087

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Rochester

USA . 6 parts In-Stock

1+ parts

-

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$77.620

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$69.450

10k+ parts

$65.360

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$69.450

$65.360

DigiKey

USA . 6 parts In-Stock

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6

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Verical

USA . 6 parts In-Stock

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$101.325

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$91.625

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6

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$101.325

$91.625

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Digiode

USA . 1,386 parts In-Stock

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$78.447

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Vyrian

USA . 6,718 parts In-Stock

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Holdelec - ElecDif-Pro

France . 90 parts In-Stock

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Parana Technologies

USA . 483 parts In-Stock

1+ parts

$18.393

100+ parts

-

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$18.516

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483

$18.393

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$18.516

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DigiPath Technology Company

USA . 1,211 parts In-Stock

1+ parts

$20.253

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1,211

$20.253

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ChromeModa Solutions

Germany . 899 parts In-Stock

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$20.666

100+ parts

$16.946

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899

$20.666

$16.946

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IDEA Electronic Components Group

UK . 701 parts In-Stock

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$20.666

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$19.633

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$18.599

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701

$20.666

$19.633

$18.599

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Corohmni

South Africa . 777 parts In-Stock

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$73.047

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$73.047

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Corphita

USA . 812 parts In-Stock

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$74.318

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$74.318

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Microchip USA

USA . 1,823 parts In-Stock

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$207.414

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$207.414

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A-Z Elektronik GmbH

Germany . 495 parts In-Stock

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Overview

Experience the next level of digital signal processing with the TMS320C6203BGNY173 by Texas Instruments. As a leader in cutting-edge technology, Texas Instruments delivers top-notch quality and reliability in their products. This DSP offers integrated cache, multiple power supplies, and boundary scan capabilities, making it ideal for a wide range of applications. With a maximum clock frequency of 300 MHz, this product provides high performance and efficiency. Trust Texas Instruments to provide you with the tools you need to succeed in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the DSP, making it suitable for a variety of environments.

Integrated Cache: YES

Having an integrated cache helps improve the performance and efficiency of the DSP by reducing the need to access external memory frequently.

Maximum Supply Voltage: 1.75 V

The maximum supply voltage of 1.75 V ensures that the DSP operates within safe voltage limits, preventing damage to the device.

On Chip Data RAM Width: 8

The wide data RAM width of 8 allows for faster data processing and efficient storage of information within the DSP.

Address Bus Width: 22

A wide address bus width of 22 enables the DSP to access a large memory space, improving its versatility in handling various tasks.

Package Shape: SQUARE

The square package shape makes it easier to mount the DSP on a circuit board, optimizing space usage and facilitating assembly.

Bit Size: 32

With a bit size of 32, the DSP can process data in larger chunks, leading to improved computational efficiency and overall performance.

Power Supplies (V): 1.7,3.3

Supporting multiple power supply voltages allows for flexibility in system design and compatibility with various power sources.

No. of Terminals: 384

Having a high number of terminals provides ample connectivity options for interfacing with other components in a system.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style allows for dense mounting of the DSP on a PCB, saving space and enabling high-performance designs.

Minimum Supply Voltage: 1.65 V

The minimum supply voltage of 1.65 V ensures that the DSP can operate efficiently even with low power sources, improving energy efficiency.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature of 90°C, the DSP can perform reliably in a wide range of temperature conditions.

No. of External Interrupts: 4

Having multiple external interrupts allows the DSP to quickly respond to external events or signals, enhancing its real-time processing capabilities.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures that the DSP can function effectively even in cold environments.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides good solderability and reliability, ensuring secure connections during manufacturing and operation.

Terminal Position: BOTTOM

Having terminals positioned at the bottom of the package facilitates easier PCB layout and assembly, simplifying the overall design process.

Maximum Seated Height: 2.35 mm

The low maximum seated height of 2.35 mm allows for a compact design, suitable for applications where space is limited.

RAM Words: 524288

The large RAM capacity of 524288 words enables the DSP to store and manipulate a significant amount of data efficiently.

Width: 18 mm

The compact width of 18 mm makes the DSP suitable for space-constrained applications, allowing for versatile integration in various systems.

Boundary Scan: YES

The boundary scan feature helps in testing and debugging the DSP during manufacturing, ensuring quality and reliability of the final product.

External Data Bus Width: 32

A wide external data bus width of 32 facilitates efficient data transfer between the DSP and external memory or peripherals, enhancing overall system performance.

Maximum Clock Frequency: 300 MHz

With a high maximum clock frequency of 300 MHz, the DSP can handle complex calculations and real-time processing tasks with speed and accuracy.

Peak Reflow Temperature °C: 220

The high peak reflow temperature of 220°C ensures that the DSP can withstand the soldering process during assembly without damage.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architectures allows for efficient data transfer within the DSP, enhancing performance and multitasking capabilities.

Length: 18 mm

The compact length of 18 mm complements the width and package shape, making the DSP suitable for compact and high-performance designs.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor, this peripheral IC type is optimized for signal processing tasks, making it a reliable choice for applications requiring DSP capabilities.

No. of Timers: 2

Having multiple timers allows the DSP to manage time-sensitive operations efficiently, enabling precise control and synchronization in various applications.

Technology: CMOS

Using CMOS technology provides low power consumption and high speed operation, making the DSP energy-efficient and suitable for battery-powered devices.

Terminal Form: BALL

The ball terminal form ensures reliable connections and facilitates easy mounting of the DSP on a PCB, improving solder joint strength and overall reliability.

Nominal Supply Voltage: 1.7 V

The nominal supply voltage of 1.7 V provides a stable operating voltage for the DSP, ensuring consistent performance and reliability in various applications.

No. of DMA Channels: 4

Having multiple DMA channels allows for efficient data transfer between memory and peripherals, reducing CPU overhead and improving overall system performance.

ROM Programmability: MROM

The MROM programmability feature allows for secure and permanent storage of program code, ensuring data integrity and reliability in the DSP operation.

Terminal Pitch: 0.8 mm

The narrow terminal pitch of 0.8 mm enables high-density mounting of the DSP on a PCB, optimizing space usage and facilitating compact system designs.

Format: FIXED POINT

Using fixed-point format simplifies arithmetic operations and reduces computational complexity, making the DSP efficient in processing digital signals and data.

Moisture Sensitivity Level (MSL): 4

The moisture sensitivity level of 4 indicates that the DSP is suitable for storage and operation in a typical manufacturing environment, ensuring product reliability.

Low Power Mode: YES

The low power mode feature allows the DSP to operate in a power-efficient state when not performing intensive tasks, prolonging battery life and reducing energy consumption.

On Chip Program ROM Width: 8

The wide program ROM width of 8 enables efficient storage and retrieval of program instructions within the DSP, enhancing its processing capabilities and versatility.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6203BGNY173 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

300 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B384

JESD-609 Code:

e0

Length:

18 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Terminals:

384

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA384,22X22,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.7,3.3

Qualification:

Not Qualified

RAM Words:

524288

ROM Programmability:

MROM

Maximum Seated Height:

2.35 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.75 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

18 mm

Peripheral IC Type:

Trade Compliance

TMS320C6203BGNY173 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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