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TMS320C31PQL80

Texas Instruments

TMS320C31PQL80 by Texas Instruments

TMS320C31PQL80 by Texas Instruments is a 32-bit DSP with 2048 RAM words, operating at 80 MHz. It features low power mode, barrel shifter, and supports floating-point format. Ideal for digital signal processing applications requiring high-speed data processing and low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,806 parts In-Stock

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Digiode

USA . 1,838 parts In-Stock

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1,838

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Distributors (Availability)

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AZTECH Wire

Italy . 744 parts In-Stock

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$17.751

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744

$17.751

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One Stop Electronics

USA . 378 parts In-Stock

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$19.000

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378

$19.000

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Parana Technologies

USA . 892 parts In-Stock

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$44.940

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892

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DigiPath Technology Company

USA . 917 parts In-Stock

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$49.484

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917

$49.484

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ChromeModa Solutions

Germany . 4,127 parts In-Stock

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$50.494

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$41.405

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$50.494

$41.405

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IDEA Electronic Components Group

UK . 141 parts In-Stock

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$50.494

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$47.969

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$45.445

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141

$50.494

$47.969

$45.445

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Corohmni

South Africa . 359 parts In-Stock

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$72.896

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Component Stockers USA

USA . 265 parts In-Stock

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$99.990

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Corphita

USA . 4,365 parts In-Stock

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Microchip USA

USA . 391 parts In-Stock

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Overview

Experience cutting-edge technology with the TMS320C31PQL80 by Texas Instruments. This high-quality Digital Signal Processor (DSP) offers unmatched performance and versatility for a wide range of applications. With Texas Instruments' reputation for excellence in semiconductor manufacturing, you can trust that this product delivers on its promises. Unlock the potential of your projects with the value, benefits, and advantages that the TMS320C31PQL80 brings to the table. Elevate your designs and stay ahead of the competition with this powerful DSP solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the DSP, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto printed circuit boards, saving time and labor costs during manufacturing.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage allows for greater flexibility in power supply design and operation, accommodating different voltage requirements.

Bit Size: 32

32-bit processing capability enables the DSP to handle complex algorithms and calculations with precision and speed, making it suitable for demanding signal processing tasks.

RAM Words: 2048

Ample RAM capacity ensures sufficient memory for storing data and instructions, allowing for efficient processing and data manipulation.

Maximum Clock Frequency: 80 MHz

High clock frequency enables rapid execution of instructions and processing of data, enhancing the overall performance of the DSP.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable for various applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C31PQL80 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

NO

Maximum Clock Frequency:

80 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G132

JESD-609 Code:

e4

Length:

24.13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

132

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

SPQFP132,1.1SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

2048

Maximum Seated Height:

4.57 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

550 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.13 mm

Peripheral IC Type:

Trade Compliance

TMS320C31PQL80 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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