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TMS320C25GBL

Texas Instruments

TMS320C25GBL by Texas Instruments

TMS320C25GBL by Texas Instruments is a 16-bit DSP with 5V supply, 40.96 MHz clock frequency, and 544 RAM words. Ideal for digital signal processing applications due to its CMOS technology, MROM programmability, and low power mode feature.

Median Price

$147.475

Lifecycle Status

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23

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American Microsemiconductor Inc.

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Freelance Electronics

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Ace Electronics

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NAC Semi

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Vyrian

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Semtec, LLC

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Microfarads

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LWI Electronics Inc

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Speed Components Ltd

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J & M Industries LLC

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Atlantic Semiconductor

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Sogenti Electronics

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Sunrise Surplus Inc.

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Beltway Electronics Company

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PC Components Company LLC

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Prism Electronics

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One Stop Electronics

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AZTECH Wire

Italy . 366 parts In-Stock

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Parana Technologies

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DigiPath Technology Company

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ChromeModa Solutions

Germany . 5,165 parts In-Stock

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IDEA Electronic Components Group

UK . 488 parts In-Stock

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Corohmni

South Africa . 83 parts In-Stock

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Component Stockers USA

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Corphita

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Microchip USA

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Overview

Experience unparalleled performance and reliability with the TMS320C25GBL by Texas Instruments, a leading manufacturer in the industry. This Digital Signal Processor (DSP) is designed to deliver seamless operation in a variety of applications, from audio processing to telecommunications. With its advanced features and cutting-edge technology, this product ensures optimal functionality and efficiency. Invest in the TMS320C25GBL today and unlock a world of possibilities for your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This package body material provides durability and good thermal conductivity, ensuring reliable performance in various operating conditions.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for flexibility in power supply options, making it suitable for a wide range of applications.

On Chip Data RAM Width: 16

Having a wide on-chip data RAM width of 16 allows for efficient data processing and storage, enhancing the performance of the digital signal processor.

Address Bus Width: 16

A 16-bit address bus width enables efficient memory addressing, improving overall system performance.

Package Shape: SQUARE

The square package shape offers ease of handling and placement during manufacturing and assembly processes.

Bit Size: 16

A 16-bit bit size allows for higher precision and accuracy in signal processing tasks, making this DSP suitable for demanding applications.

Power Supplies (V): 5

The 5V power supply ensures compatibility with standard supply voltages, simplifying integration into existing systems.

No. of Terminals: 68

With a high number of terminals, this DSP offers versatile connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): GRID ARRAY

The grid array package style enables high-density mounting and efficient heat dissipation, enhancing the overall performance and reliability of the DSP.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage ensures energy efficiency and helps prevent overvoltage, leading to improved system stability.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range of 70°C allows this DSP to be used in a variety of environments without compromising performance.

No. of External Interrupts: 3

Having 3 external interrupts provides the DSP with the ability to respond to multiple events simultaneously, improving real-time responsiveness.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures reliable performance even in colder environments, expanding the usability of this DSP.

Terminal Finish: NICKEL GOLD

The nickel gold terminal finish offers excellent corrosion resistance and electrical conductivity, enhancing the durability and reliability of the DSP.

Terminal Position: PERPENDICULAR

The perpendicular terminal position facilitates easy and secure connection with other components, simplifying assembly and maintenance processes.

Maximum Seated Height: 4.953 mm

The compact maximum seated height allows for space-efficient design and installation, making this DSP suitable for applications with limited space constraints.

RAM Words: 544

With 544 RAM words, this DSP provides ample memory capacity for storing and processing data efficiently, improving system performance.

Width: 27.94 mm

The moderate width of 27.94 mm enables easy integration into various system designs and layouts, offering flexibility in installation.

External Data Bus Width: 16

Having a 16-bit external data bus width allows for fast data transfer between the DSP and external devices, enhancing system throughput.

Maximum Clock Frequency: 40.96 MHz

The high maximum clock frequency of 40.96 MHz enables fast data processing and real-time operation, making this DSP suitable for high-performance applications.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture increases data bandwidth and optimizes communication between different components within the DSP, improving overall system efficiency.

Length: 27.94 mm

Similar to the width, the length of 27.94 mm offers a compact form factor that can fit into various system designs without compromising functionality.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable operation within standard temperature ranges, making this DSP suitable for commercial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

As a digital signal processor with various peripheral functionalities, this product offers versatility and flexibility in handling various digital signal processing tasks.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption, high-speed operation, and compatibility with modern integrated circuit designs, making this DSP efficient and reliable.

Terminal Form: PIN/PEG

The pin/peg terminal form allows for easy and secure mounting on PCBs, improving reliability and connection integrity in electronic systems.

Maximum Supply Current: 185 mA

The moderate maximum supply current of 185 mA indicates efficient power usage and low energy consumption, making this DSP suitable for battery-powered applications.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5V ensures stable and reliable operation, minimizing the risk of voltage fluctuations affecting performance.

ROM Programmability: MROM

The MROM (Mask ROM) programmability ensures permanent storage of essential firmware and software, preventing accidental erasure or modification of critical data.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, this DSP is compatible with standard PCB layouts and allows for easy integration into existing electronic systems.

Format: FIXED POINT

Operating in fixed-point format enhances computational efficiency and simplifies signal processing algorithms, making this DSP ideal for real-time processing applications.

Low Power Mode: YES

The low power mode feature helps reduce power consumption during idle or low-load operation, improving energy efficiency and prolonging battery life in portable devices.

On Chip Program ROM Width: 16

With a 16-bit on-chip program ROM width, this DSP can store and execute code efficiently, enhancing the speed and reliability of program execution.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C25GBL attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

PID CONTROL; 256 WORDS DATA/PROG RAM

Address Bus Width:

16

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

NO

Maximum Clock Frequency:

40.96 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-CPGA-P68

JESD-609 Code:

e4

Length:

27.94 mm

Low Power Mode:

YES

No. of DMA Channels:

0

No. of External Interrupts:

3

No. of Serial I/Os:

1

No. of Terminals:

68

No. of Timers:

1

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Equivalence Code:

PGA68,11X11

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

544

ROM Programmability:

MROM

Maximum Seated Height:

4.953 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

185 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Width:

27.94 mm

Peripheral IC Type:

Trade Compliance

TMS320C25GBL Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

NSN

5962-01-334-6500, 5962013346500

NIIN

013346500

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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