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TMS320C10NL-25

Texas Instruments

TMS320C10NL-25 by Texas Instruments

TMS320C10NL-25 by Texas Instruments is a 16-bit DSP with 12-bit address bus, operating at 35.1 MHz. It has 144 RAM words and supports low power mode, making it ideal for digital signal processing applications requiring high-speed computation in commercial temperature environments.

Median Price

$13.540

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Rochester

USA . 2 parts In-Stock

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$13.540

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$13.270

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$13.000

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Digiode

USA . 233 parts In-Stock

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$14.582

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Vyrian

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Inland Empire Components Inc.

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ACDS - Activité Composants Distribution Service

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Corel Iberica Componentes, S.L.

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LWI Electronics Inc

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Prism Electronics

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Zilex Electronics Inc.

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Manoshevitz Elec. Sales

Israel . 5 parts In-Stock

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Pegasus Components GmbH

Germany . 4 parts In-Stock

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Bristol Electronics

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Electronic Expediters

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AZTECH Wire

Italy . 413 parts In-Stock

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$12.300

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Ampacity Inc.

Singapore . 2 parts In-Stock

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$13.050

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Corphita

USA . 4,170 parts In-Stock

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Component Stockers USA

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Parana Technologies

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Corohmni

South Africa . 2,588 parts In-Stock

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DigiPath Technology Company

USA . 2,090 parts In-Stock

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ChromeModa Solutions

Germany . 6,680 parts In-Stock

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IDEA Electronic Components Group

UK . 2,061 parts In-Stock

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$55.432

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QUARKTWIN TECHNOLOGY LTD

USA . 28,780 parts In-Stock

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Microchip USA

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Perfect Parts

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Kepictronics

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Cyclops Electronics Ltd (Excess)

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Assy Fe

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A-Plus Industry Inc.

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Overview

Unlock the power of cutting-edge technology with the TMS320C10NL-25 by Texas Instruments. As a top-tier manufacturer in the industry, Texas Instruments delivers unparalleled quality and reliability. The TMS320C10NL-25 falls into the category of Digital Signal Processors, offering a wide range of applications for various industries. Experience seamless performance, high-speed processing, and optimal efficiency with this innovative product. Upgrade your projects and take your designs to the next level with the TMS320C10NL-25.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, ideal for portable or rugged applications.

Maximum Supply Voltage: 5.25 V

Allows for a higher operating voltage, increasing flexibility in power supply options.

Address Bus Width: 12

Wide address bus allows for efficient memory access and processing capabilities.

Power Supplies (V): 5

Standard voltage supply for compatibility with common power sources.

RAM Words: 144

Sufficient RAM capacity for storing and processing data efficiently.

Maximum Clock Frequency: 35.1 MHz

High clock frequency enables fast signal processing and response times.

Temperature Grade: COMMERCIAL

Suitable for general commercial applications with standard operating temperature range.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Low Power Mode: YES

Low power mode option for energy-efficient operation and extended battery life.

Barrel Shifter: YES

Barrel shifter feature for efficient arithmetic and logic operations.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C10NL-25 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

5 MIPS

Address Bus Width:

12

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

NO

Maximum Clock Frequency:

35.1 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-PDIP-T40

Length:

52.455 mm

Low Power Mode:

YES

No. of Terminals:

40

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

144

Maximum Seated Height:

5.08 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.24 mm

Peripheral IC Type:

Trade Compliance

TMS320C10NL-25 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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