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TLV863MDBZT

Texas Instruments

TLV863MDBZT by Texas Instruments

TLV863MDBZT by Texas Instruments is a Power Management IC with Vsup ranging from 1.1V to 6V, suitable for automotive applications. It features a small outline package style, matte tin terminal finish, and operates in temperatures from -40°C to 125°C. With only 3 terminals and a compact size of 2.92mm x 1.3mm x 1.12mm, it provides power supply support in space-constrained designs.

Median Price

$0.678

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 370,240 parts In-Stock

1+ parts

$1.125

100+ parts

$0.764

1k+ parts

$0.392

10k+ parts

-

370,240

$1.125

$0.764

$0.392

-

DigiKey

USA . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.582

10k+ parts

-

750

-

-

$0.582

-

Rochester

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$0.665

1k+ parts

$0.552

10k+ parts

$0.492

500

-

$0.665

$0.552

$0.492

Verical

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.691

10k+ parts

$0.616

500

-

-

$0.691

$0.616

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,678 parts In-Stock

1+ parts

$0.517

100+ parts

-

1k+ parts

-

10k+ parts

-

3,678

$0.517

-

-

-

Vyrian

USA . 4,671 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,671

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 123,653 parts In-Stock

1+ parts

$0.462

100+ parts

$0.450

1k+ parts

$0.448

10k+ parts

-

123,653

$0.462

$0.450

$0.448

-

Ampacity Inc.

Singapore . 123,481 parts In-Stock

1+ parts

$0.462

100+ parts

-

1k+ parts

-

10k+ parts

-

123,481

$0.462

-

-

-

Corphita

USA . 2,636 parts In-Stock

1+ parts

$0.490

100+ parts

-

1k+ parts

-

10k+ parts

-

2,636

$0.490

-

-

-

Corohmni

South Africa . 494 parts In-Stock

1+ parts

$0.544

100+ parts

-

1k+ parts

-

10k+ parts

-

494

$0.544

-

-

-

Component Stockers USA

USA . 1,366 parts In-Stock

1+ parts

$0.560

100+ parts

$0.520

1k+ parts

-

10k+ parts

-

1,366

$0.560

$0.520

-

-

Parana Technologies

USA . 1,254 parts In-Stock

1+ parts

$22.232

100+ parts

-

1k+ parts

$22.895

10k+ parts

-

1,254

$22.232

-

$22.895

-

DigiPath Technology Company

USA . 1,759 parts In-Stock

1+ parts

$24.480

100+ parts

$22.522

1k+ parts

-

10k+ parts

-

1,759

$24.480

$22.522

-

-

ChromeModa Solutions

Germany . 5,358 parts In-Stock

1+ parts

$24.980

100+ parts

$20.484

1k+ parts

-

10k+ parts

-

5,358

$24.980

$20.484

-

-

IDEA Electronic Components Group

UK . 484 parts In-Stock

1+ parts

$24.980

100+ parts

$23.731

1k+ parts

$22.482

10k+ parts

-

484

$24.980

$23.731

$22.482

-

Overview

Enhance your power management solutions with the TLV863MDBZT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers high-quality products that exceed expectations. The TLV863MDBZT is perfect for a variety of applications within the Power Management ICs category, offering customers reliability and efficiency. Experience the value and benefits of this product, designed to provide optimal performance and convenience for all your power management needs. Elevate your projects with Texas Instruments' innovative technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly on PCBs, saving space and reducing overall manufacturing costs.

Nominal Supply Voltage (Vsup): 2 V

Operates at a nominal supply voltage of 2V, making it suitable for low power applications.

No. of Terminals: 3

With 3 terminals, the power management IC can interface with other components effectively.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures, making it suitable for demanding environments.

Minimum Operating Temperature: -40 °C

Can operate at low temperatures, ensuring reliability in extreme conditions.

Terminal Finish: Matte Tin (Sn)

Matte Tin finish provides good solderability and ensures a reliable electrical connection.

Maximum Seated Height: 1.12 mm

Low seated height saves space on the PCB and allows for compact designs.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards, ensuring reliability in automotive applications.

Technical Specifications

Power Management ICs TLV863MDBZT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.92 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1/6

Qualification:

Not Qualified

Maximum Seated Height:

1.12 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.03 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

1.1 V

Nominal Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

4.38

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.3 mm

Trade Compliance

TLV863MDBZT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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